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research-article

Simultaneous Measurement of Free Surface Elevation and 3-Component Velocity Field around a Translating Surface-Piercing Foil

[+] Author and Article Information
James J. Schock

U. S. Coast Guard Academy, Engineering Department (den), 31 Mohegan Avenue, New London, CT 06320
jjschock@gmail.com

Jason Dahl

University of Rhode Island, 217 Sheets Building, Narragansett Bay Campus, 215 South Ferry Road, Narragansett, RI, 02882
jmdahl@uri.edu

1Corresponding author.

ASME doi:10.1115/1.4038586 History: Received April 06, 2017; Revised November 16, 2017

Abstract

Two methods are investigated to simultaneously obtain both three-dimensional velocity field and free surface elevations measurements near a surface piercing foil, while limiting the equipment. The combined velocity field and free surface elevation measurements are obtained specifically for validation of numerical methods requiring simultaneous field data and free surface measurements for a slender body shape. Both methods use stereo particle image velocimetry (SPIV) to measure three component velocities in the flow field and both methods use an off the shelf digital camera with a laser intersection line to measure free surface elevations. The first method is performed using a vertical laser sheet oriented parallel to the foil chord line. Through repetition of experiments with repositioning of the laser, a statistical representation of the three-dimensional flow field and surface elevations is obtained. The second method orients the vertical laser sheet such that the foil chord line is orthogonal to the laser sheet. A single experiment is performed with this method to measure the 3D3C flow field and free surface, assuming steady flow conditions, such that the time dimension is used to expand the flow field in three-dimensional space. The two methods are compared using dynamic mode decomposition and found to be comparable in the primary mode. Utilizing these methods produces results that are acceptable for use in numerical methods verification, at a fraction of the capital and computing cost associated with two plane or tomographic PIV.

Copyright (c) 2017 by ASME
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