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Proceedings Papers

A Phase Field Method for Numerical Simulation of Boiling Heat Transfer

Zhicheng Wang, Xiaoning Zheng, George Karniadakis
Proc. ASME. FEDSM2020, Volume 2: Fluid Mechanics; Multiphase Flows, V002T04A032, July 13–15, 2020
Paper No: FEDSM2020-20176
https://doi.org/10.1115/FEDSM2020-20176
View Paper titled, A Phase Field Method for Numerical Simulation of Boiling Heat Transfer
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Topics: Boiling, Computer simulation, Heat transfer, Bubbles, Two-phase flow, Density, Fluids, Reynolds number, Aerospace engineering, Condensation
Proceedings Papers

Can Natural Convection on Smooth Vertical Plates in the Laminar Regime Be Improved by Adding Forward Facing Triangular Roughness Elements?

Jakob Hærvig, Anna Lyhne Jensen, Henrik Sørensen
Proc. ASME. AJKFluids2019, Volume 1: Fluid Mechanics, V001T01A058, July 28–August 1, 2019
Paper No: AJKFluids2019-5441
https://doi.org/10.1115/AJKFluids2019-5441
View Paper titled, Can Natural Convection on Smooth Vertical Plates in the Laminar Regime Be Improved by Adding Forward Facing Triangular Roughness Elements?
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Topics: Natural convection, Surface roughness, Vertical plates, Heat transfer, Heat, Accounting, Cooling, Electronics, Flow (Dynamics), Flux (Metallurgy)
Proceedings Papers

Evaluation of an Integrated Micro-Cooling Chip Architecture for Managing Thermal Concerns of a Power Electronics Module

George Papadopoulos, Daniel Kearney, Daniele Torresin
Proc. ASME. FEDSM2017, Volume 1B, Symposia: Fluid Measurement and Instrumentation; Fluid Dynamics of Wind Energy; Renewable and Sustainable Energy Conversion; Energy and Process Engineering; Microfluidics and Nanofluidics; Development and Applications in Computational Fluid Dynamics; DNS/LES and Hybrid RANS/LES Methods, V01BT10A015, July 30–August 3, 2017
Paper No: FEDSM2017-69519
https://doi.org/10.1115/FEDSM2017-69519
View Paper titled, Evaluation of an Integrated Micro-Cooling Chip Architecture for Managing Thermal Concerns of a Power Electronics Module
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Topics: Cooling, Electronics, Additive manufacturing, Circuits, Coolants, Design, Laminates, Distributed power generation, Fluid dynamics, Heat
Proceedings Papers

Computational Model Development and Failure Mode Investigation for a Magnetically-Driven Bearingless Micro-Pump

Gabriel B. Goodwin, Jesse R. Maxwell, Triem T. Hoang
Proc. ASME. FEDSM2017, Volume 1B, Symposia: Fluid Measurement and Instrumentation; Fluid Dynamics of Wind Energy; Renewable and Sustainable Energy Conversion; Energy and Process Engineering; Microfluidics and Nanofluidics; Development and Applications in Computational Fluid Dynamics; DNS/LES and Hybrid RANS/LES Methods, V01BT10A002, July 30–August 3, 2017
Paper No: FEDSM2017-69065
https://doi.org/10.1115/FEDSM2017-69065
View Paper titled, Computational Model Development and Failure Mode Investigation for a Magnetically-Driven Bearingless Micro-Pump
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Topics: Failure mechanisms, Micropumps, Model development, Heat, Heat pipes, Maintenance, Pumps, Fluids, Space vehicles, Thermal management
Proceedings Papers

Operational Parametric Study of a Tesla Pump: Disk Pack Spacing and Rotational Speed

Laura Dodsworth, Dominic Groulx
Proc. ASME. AJKFluids2015, Volume 1: Symposia, V001T33A006, July 26–31, 2015
Paper No: AJKFluids2015-33220
https://doi.org/10.1115/AJKFluids2015-33220
View Paper titled, Operational Parametric Study of a Tesla Pump: Disk Pack Spacing and Rotational Speed
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Topics: Disks, Pumps, Engines, Motors, Blades, Cavitation, Cooling, Electronics, Engineering prototypes, Fluids
Proceedings Papers

Imaging Measurements in Nano-Particle Enhanced Spray Cooling

J. Torres, A. Perdones, A. Garcia, F. J. Diez
Proc. ASME. FEDSM2010, ASME 2010 3rd Joint US-European Fluids Engineering Summer Meeting: Volume 1, Symposia – Parts A, B, and C, 1847-1848, August 1–5, 2010
Paper No: FEDSM-ICNMM2010-31072
https://doi.org/10.1115/FEDSM-ICNMM2010-31072
View Paper titled, Imaging Measurements in Nano-Particle Enhanced Spray Cooling
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Topics: Cooling, Imaging, Nanoparticles, Sprays, Fluids, Particulate matter, Critical heat flux, Heat transfer, Drops, Heat
Proceedings Papers

Transient Numerical Computation of the Temperature of Electronic Devices in Passenger Cars: Flow Simulation in Electronics Cavities

Florence Michel, Bernard Desmet
Proc. ASME. FEDSM2010, ASME 2010 3rd Joint US-European Fluids Engineering Summer Meeting: Volume 1, Symposia – Parts A, B, and C, 1645-1657, August 1–5, 2010
Paper No: FEDSM-ICNMM2010-30255
https://doi.org/10.1115/FEDSM-ICNMM2010-30255
View Paper titled, Transient Numerical Computation of the Temperature of Electronic Devices in Passenger Cars: Flow Simulation in Electronics Cavities
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Topics: Automobiles, Cavities, Computation, Electronics, Flow simulation, Temperature, Transients (Dynamics), Flow (Dynamics), Computer simulation, Convection
Proceedings Papers

Development of a Wet Wall: An Undergraduate Research Project

Matt Samuel, Jeremiah Henley, Said Shakerin
Proc. ASME. FEDSM2007, Volume 2: Fora, Parts A and B, 547-550, July 30–August 2, 2007
Paper No: FEDSM2007-37677
https://doi.org/10.1115/FEDSM2007-37677
View Paper titled, Development of a Wet Wall: An Undergraduate Research Project
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Topics: Undergraduate research, Students, Water, Electronics, Flow (Dynamics), Interpersonal skills, Mechatronics education, Performance, Surface texture, Teams
Proceedings Papers

Effect of Spray Angle in Spray Cooling Thermal Management of Electronics

J. Schwarzkopf, T. Cader, K. Okamoto, B. Q. Li, B. Ramaprian
Proc. ASME. HT-FED2004, Volume 4, 423-431, July 11–15, 2004
Paper No: HT-FED2004-56414
https://doi.org/10.1115/HT-FED2004-56414
View Paper titled, Effect of Spray Angle in Spray Cooling Thermal Management of Electronics
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Topics: Cooling, Electronics, Sprays, Thermal management, Coolants, Heat transfer, Algorithms, Finite element model, Flow (Dynamics), Heat flux
Proceedings Papers

Measurement of Thermal Properties of Composite Panels

A. M. Druma, M. K. Alam, M. Kistner, Roland Watts
Proc. ASME. HT-FED2004, Volume 1, 385-388, July 11–15, 2004
Paper No: HT-FED2004-56566
https://doi.org/10.1115/HT-FED2004-56566
View Paper titled, Measurement of Thermal Properties of Composite Panels
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Topics: Composite materials, Thermal properties, Carbon, Aircraft, Carbon fibers, Electronics, Instrumentation, Power systems (Machinery), Space vehicles, Stress
Proceedings Papers

Empirical Heat Transfer Models of Single- and Multiple-Nozzle Spray Cooling for Electronics

Timothy A. Shedd, Adam G. Pautsch
Proc. ASME. HT-FED2004, Volume 4, 441-448, July 11–15, 2004
Paper No: HT-FED2004-56443
https://doi.org/10.1115/HT-FED2004-56443
View Paper titled, Empirical Heat Transfer Models of Single- and Multiple-Nozzle Spray Cooling for Electronics
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Topics: Cooling, Electronics, Heat transfer, Nozzles, Sprays, Critical heat flux, Boiling, Liquid films, Visualization, Computer cooling
Proceedings Papers

Investigation of a Capillary Assisted Thermosyphon (CAT) for Shipboard Electronics Cooling

E. H. Larsen, M. Cerza, A. N. Smith, C. Thomas Conroy
Proc. ASME. HT-FED2004, Volume 4, 485-494, July 11–15, 2004
Paper No: HT-FED2004-56483
https://doi.org/10.1115/HT-FED2004-56483
View Paper titled, Investigation of a Capillary Assisted Thermosyphon (CAT) for Shipboard Electronics Cooling
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Topics: Computer cooling, Cooling, Flat plates, Heat, Temperature, Vapors, Condensers (steam plant), Energy dissipation, Flow (Dynamics), Subcooling
Proceedings Papers

Integrated Thermomechanical Design and Optimization of BGA Packages Using Genetic Algorithm

Hamid A. Hadim, Tohru Suwa
Proc. ASME. HT-FED2004, Volume 4, 495-502, July 11–15, 2004
Paper No: HT-FED2004-56512
https://doi.org/10.1115/HT-FED2004-56512
View Paper titled, Integrated Thermomechanical Design and Optimization of BGA Packages Using Genetic Algorithm
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Topics: Ball-Grid-Array packages, Design, Genetic algorithms, Optimization, Thermomechanics, Ball-Grid-Array packaging, Electronic packages, Electronic packaging, Electronics, Leakage
Proceedings Papers

Micro Fluidic Jets for Thermal Management of Electronics

Jivtesh Garg, Mehmet Arik, Stanton Weaver, Seyed Saddoughi
Proc. ASME. HT-FED2004, Volume 4, 647-654, July 11–15, 2004
Paper No: HT-FED2004-56782
https://doi.org/10.1115/HT-FED2004-56782
View Paper titled, Micro Fluidic Jets for Thermal Management of Electronics
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Topics: Electronics, Jets, Thermal management, Cooling, Heat transfer, Natural convection, Temperature, Aerospace industry, Boundary layers, Computer cooling
Proceedings Papers

Fixed Valve Piezoelectric Micropump for Miniature Thermal Management Module

D. Faulkner, C. Ward, D. Gilbuena, R. Shekarriz, F. K. Forster
Proc. ASME. FEDSM2006, Volume 2: Fora, 843-848, July 17–20, 2006
Paper No: FEDSM2006-98347
https://doi.org/10.1115/FEDSM2006-98347
View Paper titled, Fixed Valve Piezoelectric Micropump for Miniature Thermal Management Module
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Topics: Micropumps, Thermal management, Valves, Cavities, Flow (Dynamics), Pressure, Pumps, Stress, Blades, Cooling