Search Results | HT | ASME Digital Collection

1-20 of 23

Sort by

Sort Order Select

Proceedings Papers

A Novel Modeling Approach to Estimate Segmental and Intersegmental Ventilation and Heat Transport From a Walking Clothed Human Using Electric Circuit Analogy

Nagham Ismail, Nesreen Ghaddar, Kamel Ghali

Proc. ASME. HT2017, Volume 2: Heat Transfer Equipment; Heat Transfer in Multiphase Systems; Heat Transfer Under Extreme Conditions; Nanoscale Transport Phenomena; Theory and Fundamental Research in Heat Transfer; Thermophysical Properties; Transport Phenomena in Materials Processing and Manufacturing, V002T14A002, July 9–12, 2017

Paper No: HT2017-4748

DOI: https://doi.org/10.1115/HT2017-4748

View Paper

Topics: Circuits, Heat, Modeling, Ventilation, Wind, Air flow, Heat losses, Permeability, Pressure, Vapors

Proceedings Papers

Laser-Induced Bubble Formation on a Micro Gold Particle Levitated Under Ultrasound

Jaekyoon Oh, Yungpil Yoo, Samsun Seung, Ho-Young Kwak

Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T24A004, July 10–14, 2016

Paper No: HT2016-1006

DOI: https://doi.org/10.1115/HT2016-1006

View Paper

Topics: Bubbles, Lasers, Particulate matter, Ultrasound, Water, Acoustics, Nanoparticles, Cavitation, Collapse, Electromagnetic scattering

Proceedings Papers

Thermoelectrically Powered Sensing for Small Modular Reactors

Chih Chieh Lin, Hanfei Chen, Mahder Tewolde, Gaosheng Fu, Di Liu, Tao Zhang, He Tao, Chao Nie, Weixiao Zheng, Fan Liu, Lei Zuo, David Hwang, Jon Longtin

Proc. ASME. HT2013, Volume 4: Heat and Mass Transfer Under Extreme Conditions; Environmental Heat Transfer; Computational Heat Transfer; Visualization of Heat Transfer; Heat Transfer Education and Future Directions in Heat Transfer; Nuclear Energy, V004T19A008, July 14–19, 2013

Paper No: HT2013-17788

DOI: https://doi.org/10.1115/HT2013-17788

View Paper

Topics: Small modular reactors, Heat, Pipes, Radiation (Physics), Sensors, Circuits, Cooling, Design, Electricity (Physics), Energy dissipation

Proceedings Papers

Self-Organized Micro-Honeycomb Network Structure of Single-Walled Carbon Nanotubes for Photovoltaic Devices

Shigeo Maruyama, Kehang Cui, Takaaki Chiba, Erik Einarsson, Shohei Chiashi

Proc. ASME. HT2013, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamental Research in Heat Transfer, V001T03A043, July 14–19, 2013

Paper No: HT2013-17304

DOI: https://doi.org/10.1115/HT2013-17304

View Paper

Topics: Honeycomb structures, Single-walled carbon nanotubes, Single-walled nanotubes, Solar cells, Circuits, Water vapor, Drying, Electrodes, Manufacturing, Nanomaterials

Proceedings Papers

Preliminary Design for Conventional and Compact Secondary Heat Exchanger in a Molten Salt Reactor

Piyush Sabharwall, Eung Soo Kim, Ali S. Siahpush, Mike Patterson

Proc. ASME. HT2012, Volume 1: Heat Transfer in Energy Systems; Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat and Mass Transfer in Biotechnology; Environmental Heat Transfer; Visualization of Heat Transfer; Education and Future Directions in Heat Transfer, 1-12, July 8–12, 2012

Paper No: HT2012-58007

DOI: https://doi.org/10.1115/HT2012-58007

View Paper

Topics: Circuits, Coolants, Cycles, Design, Energy generation, Heat, Heat capacity, Heat exchangers, Heat transfer, Molten salt reactors

Proceedings Papers

Experimental Measurement of Nusselt Number Correlations on Flat Plate and NACA 0010 Section Surfaces

Michael Benissan, Stephen Akwaboa, Patrick Mensah

Paper No: HT2012-58340

DOI: https://doi.org/10.1115/HT2012-58340

View Paper

Topics: Airfoils, Flat plates, Reynolds number, Turbulence, Wind tunnels, Cylinders, Temperature, Circuits, Cross-flow, Engines

Proceedings Papers

A Numerical Procedure for the Evaluation of the Engine Head-Cylinder Group Cooling Effectiveness

Marco Antonelli, Luigi Martorano, Alessio Simi, Stefano Di Palma, Carlo Carapellucci

Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 723-734, July 19–23, 2009

Paper No: HT2009-88196

DOI: https://doi.org/10.1115/HT2009-88196

View Paper

Topics: Cooling, Cylinders, Engines, Heat, Computational fluid dynamics, Cooling systems, Temperature, Circuits, Fluids, Heat transfer

Proceedings Papers

An Efficient Wavy Microchannel Heat Sink for Electronic Devices

Y. Sui, C. J. Teo, P. S. Lee, Y. T. Chew, C. Shu

Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 719-725, July 19–23, 2009

Paper No: HT2009-88585

DOI: https://doi.org/10.1115/HT2009-88585

View Paper

Topics: Heat sinks, Microchannels, Flow (Dynamics), Heat transfer, Fluids, Metals, Silicon, Vortices, Chaos, Circuits

Proceedings Papers

Performance Testing of 5cc Glow-Ignition Four-Stroke Engine

Toshinori Ogawa, Yasuo Kawaguchi

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 3, 807-814, July 8–12, 2007

Paper No: HT2007-32132

DOI: https://doi.org/10.1115/HT2007-32132

View Paper

Topics: Four-stroke engines, Ignition, Luminescence, Testing performance, Engines, Fuels, Combustion, Heat, Cycles, Batteries

Proceedings Papers

A Micropump Driven by Marangoni Effect

Kenji Sugimoto, Kaoru Iwamoto, Hiroshi Kawamura

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 223-228, July 8–12, 2007

Paper No: HT2007-32640

DOI: https://doi.org/10.1115/HT2007-32640

View Paper

Topics: Micropumps, Flow (Dynamics), Temperature, Diaphragms (Mechanical devices), Diaphragms (Structural), Circuits, Convection, Fluids, Geometry, Heat conduction

Proceedings Papers

Flame Spread Along PE-Insulated Wire in Sub-Atmospheric Pressure Enclosure

Yuji Nakamura, Nobuko Yoshimura, Tomohiro Matsumura, Hiroyuki Ito, Osamu Fujita

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 591-596, July 8–12, 2007

Paper No: HT2007-32657

DOI: https://doi.org/10.1115/HT2007-32657

View Paper

Topics: Flames, Pressure, Wire, Heat conduction, Oxygen, Shapes, Aircraft, Circuits, Combustion, Fire prevention

Proceedings Papers

Numerical and Experimental Investigation on Thermal Characteristics of Deformable Thin Film Mirrors Package and Its Performance Optimization

Jae Choon Kim, Jin Taek Chung, Jae Hong Min, Dong Jin Lee, Ji-Hyuk Yu, JuHwan Lim, Byeong-Kwon Ju, SungWoo Hwang

Proc. ASME. HT2008, Heat Transfer: Volume 2, 663-669, August 10–14, 2008

Paper No: HT2008-56292

DOI: https://doi.org/10.1115/HT2008-56292

View Paper

Topics: Mirrors, Optimization, Thin films, Temperature, Circuits, Control systems, Feedback, Steady state, Temperature control

Proceedings Papers

Use of Computational Fluid Dynamics in the Design and Optimization of Microchannel Heat Exchangers for Microelectronics Cooling

Michael K. Patterson, Xiaojin Wei, Yogendra Joshi

Proc. ASME. HT2005, Heat Transfer: Volume 4, 453-459, July 17–22, 2005

Paper No: HT2005-72647

DOI: https://doi.org/10.1115/HT2005-72647

View Paper

Topics: Computational fluid dynamics, Cooling, Design, Heat exchangers, Microchannels, Microelectronic devices, Optimization, Circuits, Convection, Cooling systems

Proceedings Papers

Design and Calibration of a Novel High Temperature Heat Flux Gage

Sujay Raphael-Mabel, Scott Huxtable, Andrew Gifford, Thomas E. Diller

Proc. ASME. HT2005, Heat Transfer: Volume 4, 983-988, July 17–22, 2005

Paper No: HT2005-72761

DOI: https://doi.org/10.1115/HT2005-72761

View Paper

Topics: Calibration, Design, Gages, Heat flux, High temperature, Sensors, Convection, Temperature, Thermocouples, Brass (Metal)

Proceedings Papers

CFD Analysis of a Possible Leakage of Coolant in the MEGAPIE Spallation Source Target

Brian L. Smith, Sergey V. Shepel

Proc. ASME. HT2005, Heat Transfer: Volume 3, 631-639, July 17–22, 2005

Paper No: HT2005-72611

DOI: https://doi.org/10.1115/HT2005-72611

View Paper

Topics: Computational fluid dynamics, Coolants, Leakage, Spallation (Nuclear physics), Safety, Containers, Shells, Boiling, Circuits, Delays

Proceedings Papers

Transient Heat Transfer Experiments in Complex Passages

Rico Poser, Jens von Wolfersdorf, Klaus Semmler

Proc. ASME. HT2005, Heat Transfer: Volume 1, 797-804, July 17–22, 2005

Paper No: HT2005-72260

DOI: https://doi.org/10.1115/HT2005-72260

View Paper

Topics: Transient heat transfer, Temperature, Blades, Circuits, Cooling, Flow (Dynamics), Fluids, Gas turbines, Heat exchangers, Heat transfer

Proceedings Papers

Development of Microfluidic Flow Sensor in a Polymeric Microchip

Juan David Salgado, Keisuke Horiuchi, Prashanta Dutta

Proc. ASME. HT-FED2004, Volume 4, 655-660, July 11–15, 2004

Paper No: HT-FED2004-56793

DOI: https://doi.org/10.1115/HT-FED2004-56793

View Paper

Topics: Flow sensors, Integrated circuits, Microfluidics, Circuits, Flow (Dynamics), Electric fields, Electrodes, Sensors, Glass, Plasma desorption mass spectrometry

Proceedings Papers

Effectiveness of 6-Row Crossflow Heat Exchangers Alternating Circuitry

Tony D. Chen

Proc. ASME. HT-FED2004, Volume 3, 287-293, July 11–15, 2004

Paper No: HT-FED2004-56705

DOI: https://doi.org/10.1115/HT-FED2004-56705

View Paper

Topics: Heat exchangers, Flow (Dynamics), Temperature, Air conditioning, Circuits, Design, Fluids, Heat capacity, Pressure drop, Refrigerants

Proceedings Papers

Design of the Inlet for an Open Circuit Wind Tunnel for Testing Full Scale Class Eight Trucks

Bhaskar Bhatnagar, Gerald Recktenwald

Proc. ASME. HT-FED2004, Volume 1, 761-768, July 11–15, 2004

Paper No: HT-FED2004-56354

DOI: https://doi.org/10.1115/HT-FED2004-56354

View Paper

Topics: Circuits, Design, Testing, Trucks, Wind tunnels, Boundary layers, Vehicles, Computational fluid dynamics, Corners (Structural elements), Flow (Dynamics)

Proceedings Papers

Development of Thermal Flow Simulation Method for Electronic Equipment Integrated With Electric Circuit Design: Application to the Thermal Design of a Natural Convection Air Cooling SMPS

Katsuhiro Koizumi, Masaru Ishizuka

Proc. ASME. HT-FED2004, Volume 4, 265-272, July 11–15, 2004

Paper No: HT-FED2004-56062

DOI: https://doi.org/10.1115/HT-FED2004-56062

View Paper

Topics: Circuit design, Cooling, Design, Electronic equipment, Flow simulation, Natural convection, Power semiconductor devices, Computational fluid dynamics, Heat, Circuits

NARROW

A Novel Modeling Approach to Estimate Segmental and Intersegmental Ventilation and Heat Transport From a Walking Clothed Human Using Electric Circuit Analogy

Laser-Induced Bubble Formation on a Micro Gold Particle Levitated Under Ultrasound

Thermoelectrically Powered Sensing for Small Modular Reactors

Self-Organized Micro-Honeycomb Network Structure of Single-Walled Carbon Nanotubes for Photovoltaic Devices

Preliminary Design for Conventional and Compact Secondary Heat Exchanger in a Molten Salt Reactor

Experimental Measurement of Nusselt Number Correlations on Flat Plate and NACA 0010 Section Surfaces

A Numerical Procedure for the Evaluation of the Engine Head-Cylinder Group Cooling Effectiveness

An Efficient Wavy Microchannel Heat Sink for Electronic Devices

Performance Testing of 5cc Glow-Ignition Four-Stroke Engine

A Micropump Driven by Marangoni Effect

Flame Spread Along PE-Insulated Wire in Sub-Atmospheric Pressure Enclosure

Numerical and Experimental Investigation on Thermal Characteristics of Deformable Thin Film Mirrors Package and Its Performance Optimization

Use of Computational Fluid Dynamics in the Design and Optimization of Microchannel Heat Exchangers for Microelectronics Cooling

Design and Calibration of a Novel High Temperature Heat Flux Gage

CFD Analysis of a Possible Leakage of Coolant in the MEGAPIE Spallation Source Target

Transient Heat Transfer Experiments in Complex Passages

Development of Microfluidic Flow Sensor in a Polymeric Microchip

Effectiveness of 6-Row Crossflow Heat Exchangers Alternating Circuitry

Design of the Inlet for an Open Circuit Wind Tunnel for Testing Full Scale Class Eight Trucks

Development of Thermal Flow Simulation Method for Electronic Equipment Integrated With Electric Circuit Design: Application to the Thermal Design of a Natural Convection Air Cooling SMPS

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only