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Proceedings Papers

Transient Two-Dimensional Heat Conduction Problem With Partial Heating Near Corners

Robert L. McMasters, Filippo de Monte, James V. Beck, Donald E. Amos
Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T15A013, July 10–14, 2016
Paper No: HT2016-7103
DOI: https://doi.org/10.1115/HT2016-7103
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Topics: Corners (Structural elements), Heat conduction, Heating, Transients (Dynamics), Plates (structures), Algebra, Electronic equipment, Heat flux, Heating and cooling, Parameter estimation
Proceedings Papers

Thermodynamic Analysis of Heat and Fluid Flow in a Microchannel With Internal Fins

Ramesh Narayanaswamy, Tilak T. Chandratilleke, Andrew J. L. Foong
Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 785-792, July 19–23, 2009
Paper No: HT2009-88107
DOI: https://doi.org/10.1115/HT2009-88107
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Topics: Fins, Fluid dynamics, Heat, Microchannels, Entropy, Heat transfer, Cooling, Computer simulation, Design, Electronic components
Proceedings Papers

Simple Measuring Method of Thermal Conductivity of Silicone Grease and Effect of Carbon Nanomaterials on Its Thermal Conductivity

Toshio Tomimura, Seiji Nomura, Masaaki Okuyama
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 3, 449-453, July 8–12, 2007
Paper No: HT2007-32649
DOI: https://doi.org/10.1115/HT2007-32649
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Topics: Carbon, Nanomaterials, Silicones, Thermal conductivity, Heat, Computers, Contact resistance, Cooling, Cooling systems, Electronic equipment
Proceedings Papers

Effect of Hole Shape on Flow Resistance of Perforated Plates for Natural Air Cooled Electronic Equipment

Katsuhiro Koizumi, Masaru Ishizuka, Shinji Nakagawa
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 713-718, July 8–12, 2007
Paper No: HT2007-32100
DOI: https://doi.org/10.1115/HT2007-32100
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Topics: Electronic equipment, Flow (Dynamics), Plates (structures), Shapes, Experimental design, Reynolds number, Natural convection
Proceedings Papers

Effects of Clearance Between Heating Walls on Natural Cooling in a Channel Model of Electronic Equipment

Yasushi Nishino, Ryoji Imai, Shinji Nakagawa, Masaru Ishizuka
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 757-762, July 8–12, 2007
Paper No: HT2007-32723
DOI: https://doi.org/10.1115/HT2007-32723
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Topics: Clearances (Engineering), Cooling, Electronic equipment, Heating, Temperature, Copper, Modeling, Electronic products, Flow (Dynamics), Natural convection
Proceedings Papers

Thermal Management of Electronic Equipment Using Closed and Open Loop Cooling Systems

Ali Heydari
Proc. ASME. HT2005, Heat Transfer: Volume 4, 877-884, July 17–22, 2005
Paper No: HT2005-72703
DOI: https://doi.org/10.1115/HT2005-72703
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Topics: Cooling systems, Electronic equipment, Thermal management, Heat exchangers, Modeling, Cooling, Computational fluid dynamics, Refrigeration, Data centers, Computer cooling
Proceedings Papers

Development of Thermal Flow Simulation Method for Electronic Equipment Integrated With Electric Circuit Design: Application to the Thermal Design of a Natural Convection Air Cooling SMPS

Katsuhiro Koizumi, Masaru Ishizuka
Proc. ASME. HT-FED2004, Volume 4, 265-272, July 11–15, 2004
Paper No: HT-FED2004-56062
DOI: https://doi.org/10.1115/HT-FED2004-56062
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Topics: Circuit design, Cooling, Design, Electronic equipment, Flow simulation, Natural convection, Power semiconductor devices, Computational fluid dynamics, Heat, Circuits
Proceedings Papers

Experimental Investigation of Single-Phase Micro Jets Impingement Cooling for Electronic Applications

Matteo Fabbri, Shanjuan Jiang, Vijay K. Dhir
Proc. ASME. HT2003, Heat Transfer: Volume 3, 461-468, July 21–23, 2003
Paper No: HT2003-47162
DOI: https://doi.org/10.1115/HT2003-47162
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Topics: Impingement cooling, Jets, Reynolds number, Water, Cooling, Electronic equipment, Fluids, Flux (Metallurgy), Heat, Prandtl number
Proceedings Papers

An Experimental Assessment of Computational Fluid Dynamics Predictive Accuracy for Electronic Component Operational Temperature

Vale´rie Eveloy, Peter Rodgers, M. S. J. Hashmi
Proc. ASME. HT2003, Heat Transfer: Volume 3, 477-487, July 21–23, 2003
Paper No: HT2003-47282
DOI: https://doi.org/10.1115/HT2003-47282
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Topics: Computational fluid dynamics, Electronic components, Temperature, Heat transfer, Junctions, Thermal analysis, Turbulence, Air flow, Boundary-value problems, Design