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Proceedings Papers

Effects of Field Plate on the Maximum Temperature and Temperature Distribution for GaN HEMT Devices

Dogacan Kara, Nazli Donmezer, Talha Furkan Canan, Ozlem Sen, Ekmel Ozbay

Proc. ASME. HT2016, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Theory and Fundamentals in Heat Transfer; Nanoscale Thermal Transport; Heat Transfer in Equipment; Heat Transfer in Fire and Combustion; Transport Processes in Fuel Cells and Heat Pipes; Boiling and Condensation in Macro, Micro and Nanosystems, V001T04A003, July 10–14, 2016

Paper No: HT2016-7367

DOI: https://doi.org/10.1115/HT2016-7367

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Topics: Gallium nitride, Temperature, Temperature distribution, Electric fields, Electron mobility, Heating, Plates (structures), Transistors, Engineering simulation, Finite element analysis

Proceedings Papers

A Roadmap for Building Thermal Models for AlGaN/GaN HEMTs: Simplifications and Beyond

Mohammad Azarifar, Nazli Donmezer

Proc. ASME. HT2016, Volume 2: Heat Transfer in Multiphase Systems; Gas Turbine Heat Transfer; Manufacturing and Materials Processing; Heat Transfer in Electronic Equipment; Heat and Mass Transfer in Biotechnology; Heat Transfer Under Extreme Conditions; Computational Heat Transfer; Heat Transfer Visualization Gallery; General Papers on Heat Transfer; Multiphase Flow and Heat Transfer; Transport Phenomena in Manufacturing and Materials Processing, V002T11A006, July 10–14, 2016

Paper No: HT2016-7383

DOI: https://doi.org/10.1115/HT2016-7383

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Topics: Gallium nitride, Heat, Heat transfer, Engineering simulation, Simulation, Boundary-value problems, Design, Electron mobility, Heating, High temperature

Proceedings Papers

Evaluation of the Integration of Oscillating Heat Pipes in High Power DC-DC Converters for Pulsed Power Applications

B. M. Huhman, A. Hathaway, H. B. Ma

Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A016, July 14–19, 2013

Paper No: HT2013-17173

DOI: https://doi.org/10.1115/HT2013-17173

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Topics: Heat pipes, Cooling, Capacitors, Aluminum, Batteries, Dimensions, Numerical analysis, Thermal conductivity, Bridges (Structures), Design

Proceedings Papers

Characterization of Electronic Packages by Thermal Diffusion Tomography

Hakan Erturk

Proc. ASME. HT2009, Volume 2: Theory and Fundamental Research; Aerospace Heat Transfer; Gas Turbine Heat Transfer; Computational Heat Transfer, 249-258, July 19–23, 2009

Paper No: HT2009-88380

DOI: https://doi.org/10.1115/HT2009-88380

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Topics: Electronic packages, Thermal diffusion, Thermal management, Acoustics, Algorithms, Computerized tomography, Flaw detection, Heat, Imaging, Manufacturing

Proceedings Papers

Low Temperature, All-Inorganic Nanoparticle Solution Process for ZnO Nanowire Network Transistor Fabrication on a Polymer Substrate

Seung Hwan Ko, Inkyu Park, Heng Pan, Nipun Misra, Costas P. Grigoropoulos

Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 771-775, July 19–23, 2009

Paper No: HT2009-88062

DOI: https://doi.org/10.1115/HT2009-88062

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Topics: Low temperature, Manufacturing, Nanoparticles, Nanowires, Polymers, Transistors, Metals, Active materials, Electrodes, Electronics

Proceedings Papers

Construction of a Broad-Based Experimental and Computational Test Capability for High Power Wide Bandgap Semiconductor Devices

Jason A. Carter, Matthew D. Roth, Michael W. Horgan, Lisa Shellenberger, Daniel P. Hoffmann, Mark D. Stitt

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 365-372, July 8–12, 2007

Paper No: HT2007-32127

DOI: https://doi.org/10.1115/HT2007-32127

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Topics: Construction, Wide band gap semiconductors, Gallium nitride, Temperature, Electron mobility, Gates (Closures), Numerical analysis, Operating temperature, Silicon, Stress

Proceedings Papers

Electron-Phonon Interaction Model and Thermal Transport Simulation During ESD Event in NMOS Transistor

Jae Sik Jin, Joon Sik Lee

Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 2, 485-492, July 8–12, 2007

Paper No: HT2007-32199

DOI: https://doi.org/10.1115/HT2007-32199

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Topics: Electron-phonon interactions, Simulation, Transistors, Phonons, Electrons, Electromagnetic scattering, Heat, Radiation scattering, Scattering (Physics), Silicon

Proceedings Papers

Modeling and Testing of an Integrated Evaporator-Condenser Device for CPU Cooling

Mark Aaron Chan, Christopher R. Yap, Kim Choon Ng

Proc. ASME. HT2008, Heat Transfer: Volume 2, 685-691, August 10–14, 2008

Paper No: HT2008-56187

DOI: https://doi.org/10.1115/HT2008-56187

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Topics: Computer cooling, Condensers (steam plant), Modeling, Testing, Design, Cooling, Heat, Air flow, Boiling, Copper

Proceedings Papers

Heat Transfer and Fluid Flow in Metal Foam Subjected to Oscillating Flow

K. C. Leong, L. W. Jin

Proc. ASME. HT2005, Heat Transfer: Volume 1, 301-310, July 17–22, 2005

Paper No: HT2005-72699

DOI: https://doi.org/10.1115/HT2005-72699

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Topics: Flow (Dynamics), Fluid dynamics, Heat transfer, Metal foams, Cooling, Porous materials, Pressure drop, Temperature, Temperature distribution, Aluminum

Proceedings Papers

Development of Thermal Flow Simulation Method for Electronic Equipment Integrated With Electric Circuit Design: Application to the Thermal Design of a Natural Convection Air Cooling SMPS

Katsuhiro Koizumi, Masaru Ishizuka

Proc. ASME. HT-FED2004, Volume 4, 265-272, July 11–15, 2004

Paper No: HT-FED2004-56062

DOI: https://doi.org/10.1115/HT-FED2004-56062

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Topics: Circuit design, Cooling, Design, Electronic equipment, Flow simulation, Natural convection, Power semiconductor devices, Computational fluid dynamics, Heat, Circuits

Proceedings Papers

Simulation of Nano-Scale Multi-Fingered PD/SOI MOSFETs Using the Boltzmann Transport Equation

Jose´ A. Pascual-Gutie´rrez, Jayathi Y. Murthy, Raymond Viskanta, Rajiv V. Joshi, Ching-Te K. Chuang

Proc. ASME. HT-FED2004, Volume 4, 387-398, July 11–15, 2004

Paper No: HT-FED2004-56375

DOI: https://doi.org/10.1115/HT-FED2004-56375

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Topics: Heat conduction, Nanoscale phenomena, Silicon-on-insulator, Simulation, Transistors

Proceedings Papers

Atomistic Simulations of G-Type Phonons in Silicon Devices

Sanjiv Sinha, P. K. Schelling, S. R. Phillpot, K. E. Goodson

Proc. ASME. HT-FED2004, Volume 4, 433-439, July 11–15, 2004

Paper No: HT-FED2004-56429

DOI: https://doi.org/10.1115/HT-FED2004-56429

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Topics: Engineering simulation, Phonons, Silicon, Simulation, Density, Electromagnetic scattering, Heat, Radiation scattering, Scattering (Physics), Transistors

Proceedings Papers

Simulations of Heat Transport During Transient Electrostatic Discharge Events in a Sub-Micron Transistor

Sreekant V. J. Narumanchi, Jayathi Y. Murthy, Cristina H. Amon

Proc. ASME. HT-FED2004, Volume 4, 347-359, July 11–15, 2004

Paper No: HT-FED2004-56252

DOI: https://doi.org/10.1115/HT-FED2004-56252

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Topics: Engineering simulation, Heat, Simulation, Transients (Dynamics), Transistors, Phonons, Silicon, Diffusion (Physics), Failure, Melting

Proceedings Papers

Fast Computation of Microscale Temperature Distribution in LSI Chips

Shigeki Hirasawa, Satoru Isomura

Proc. ASME. HT2003, Heat Transfer: Volume 3, 373-378, July 21–23, 2003

Paper No: HT2003-47014

DOI: https://doi.org/10.1115/HT2003-47014

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Topics: Computation, Microscale devices, Temperature distribution, Silicon-on-insulator, Computational methods, Design, Errors, Finite element methods, Heating, Temperature

Proceedings Papers

Modeling of Localized Heating Effect in Sub-Micron Silicon Transistors

Keivan Etessam-Yazdani, Sadegh M. Sadeghipour, Mehdi Asheghi

Proc. ASME. HT2003, Heat Transfer: Volume 1, 93-96, July 21–23, 2003

Paper No: HT2003-47272

DOI: https://doi.org/10.1115/HT2003-47272

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Topics: Heating, Modeling, Silicon, Transistors, Phonons, Dimensions, Boundary-value problems, Electrons, Geometry, Heat

NARROW

Effects of Field Plate on the Maximum Temperature and Temperature Distribution for GaN HEMT Devices

A Roadmap for Building Thermal Models for AlGaN/GaN HEMTs: Simplifications and Beyond

Evaluation of the Integration of Oscillating Heat Pipes in High Power DC-DC Converters for Pulsed Power Applications

Characterization of Electronic Packages by Thermal Diffusion Tomography

Low Temperature, All-Inorganic Nanoparticle Solution Process for ZnO Nanowire Network Transistor Fabrication on a Polymer Substrate

Construction of a Broad-Based Experimental and Computational Test Capability for High Power Wide Bandgap Semiconductor Devices

Electron-Phonon Interaction Model and Thermal Transport Simulation During ESD Event in NMOS Transistor

Modeling and Testing of an Integrated Evaporator-Condenser Device for CPU Cooling

Heat Transfer and Fluid Flow in Metal Foam Subjected to Oscillating Flow

Development of Thermal Flow Simulation Method for Electronic Equipment Integrated With Electric Circuit Design: Application to the Thermal Design of a Natural Convection Air Cooling SMPS

Simulation of Nano-Scale Multi-Fingered PD/SOI MOSFETs Using the Boltzmann Transport Equation

Atomistic Simulations of G-Type Phonons in Silicon Devices

Simulations of Heat Transport During Transient Electrostatic Discharge Events in a Sub-Micron Transistor

Fast Computation of Microscale Temperature Distribution in LSI Chips

Modeling of Localized Heating Effect in Sub-Micron Silicon Transistors

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