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Proceedings Papers

Heat Transfer Enhancement in Compact Phase Change Microchannel Heat Exchangers for High Flux Laser Diodes

Jensen Hoke, Todd Bandhauer, Jack Kotovsky, Julie Hamilton, Paul Fontejon

Proc. ASME. ICNMM2018, ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels, V001T11A003, June 10–13, 2018

Paper No: ICNMM2018-7664

DOI: https://doi.org/10.1115/ICNMM2018-7664

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Topics: Heat exchangers, Heat transfer, Lasers, Microchannels, Heat, Flow (Dynamics), Flux (Metallurgy), Heat flux, Boiling, Borosilicate glasses

Proceedings Papers

Fabrication of Inverted Trapezoidal Microstructures for Heat Transfer and Microfluidics Applications

Henry Ems, Sidy Ndao

Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T08A001, August 3–7, 2014

Paper No: ICNMM2014-21071

DOI: https://doi.org/10.1115/ICNMM2014-21071

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Topics: Heat transfer, Manufacturing, Microfluidics, Semiconductor wafers, Silicon, Etching, Silicon-on-insulator, Bonding, Anisotropy, Chemical etching

Proceedings Papers

Pressure Drop Measurements in Turbulent Channel Flow Over Superhydrophobic Surfaces With Riblets

Joseph F. Prince, Daniel Maynes, Julie Crockett

Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T08A004, August 3–7, 2014

Paper No: ICNMM2014-21690

DOI: https://doi.org/10.1115/ICNMM2014-21690

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Topics: Channel flow, Pressure drop, Turbulence, Drag (Fluid dynamics), Semiconductor wafers, Cavities, Flow (Dynamics), Damping, Drag reduction, Friction

Proceedings Papers

Subcooled Flow Boiling Over Nanostructured Plate Integrated Into a Rectangular Channel

Ebru Demir, Muhsincan Sesen, Turker Izci, Wisam Khudhayer, Tansel Karabacak, Ali Kosar

Proc. ASME. ICNMM2013, ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, V001T09A007, June 16–19, 2013

Paper No: ICNMM2013-73154

DOI: https://doi.org/10.1115/ICNMM2013-73154

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Topics: Boiling, Flow (Dynamics), Subcooling, Dimensions, Nanorods, Copper, Heat transfer, Cooling, Damage, Flux (Metallurgy)

Proceedings Papers

Experimental Investigations of Laminar, Transitional to Turbulent Gas Flow in Rib-Patterned Micro-Channels

Chungpyo Hong, Toru Yamada, Yutaka Asako, Mohammad Faghri, Ichiro Ueno

Proc. ASME. ICNMM2011, ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, Volume 1, 327-334, June 19–22, 2011

Paper No: ICNMM2011-58100

DOI: https://doi.org/10.1115/ICNMM2011-58100

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Topics: Gas flow, Microchannels, Turbulence, Friction, Flow (Dynamics), Mach number, Glass, Pressure, Reynolds number, Semiconductor wafers

Proceedings Papers

Compressible Microchannel Flow

Gholamreza Mirshekari, Martin Brouillette

Proc. ASME. ICNMM2010, ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels: Parts A and B, 433-441, August 1–5, 2010

Paper No: FEDSM-ICNMM2010-30399

DOI: https://doi.org/10.1115/FEDSM-ICNMM2010-30399

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Topics: Borosilicate glasses, Displacement, Etching, Flow (Dynamics), Friction, Gas flow, Glass, Mach number, Microchannel flow, Microchannels

Proceedings Papers

Characterization of Capillary Flow Within a Homogenously Dispersed Array of Vertical Micropillars

Conan Zhang, Carlos H. Hidrovo

Proc. ASME. ICNMM2010, ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels: Parts A and B, 655-663, August 1–5, 2010

Paper No: FEDSM-ICNMM2010-30526

DOI: https://doi.org/10.1115/FEDSM-ICNMM2010-30526

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Topics: Flow (Dynamics), Fluid dynamics, Columns (Structural), Dimensions, Pumps, Fluidic devices, Geometry, Optimization, Reactive-ion etching, Semiconductor wafers

Proceedings Papers

Experimental Investigation of Dielectrophoretic Behavior of Myoglobin and Silica Particles on a Microelectrode Chip

Naga Siva Kumar Gunda, Sushanta Kumar Mitra

Proc. ASME. ICNMM2010, ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels: Parts A and B, 1427-1433, August 1–5, 2010

Paper No: FEDSM-ICNMM2010-30306

DOI: https://doi.org/10.1115/FEDSM-ICNMM2010-30306

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Topics: Particulate matter, Dielectrophoresis, Electrokinetics, Etching, Glass, Metals, Microfabrication, Photolithography, Semiconductor wafers, Transparency

Proceedings Papers

Experimental Study of Microbubble Formation in Micro Channel

T. J. John, H. Hegab

Proc. ASME. ICNMM2010, ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels: Parts A and B, 1763-1769, August 1–5, 2010

Paper No: FEDSM-ICNMM2010-31155

DOI: https://doi.org/10.1115/FEDSM-ICNMM2010-31155

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Topics: Bubbles, Junctions, Microbubbles, Microchannels, Gas flow, Flow (Dynamics), Glass, Semiconductor wafers, Cross-flow, Dry etching

Proceedings Papers

Fabrication of Nanochannels on Polymer Thin Film

Vinh-Nguyen Phan, Patrick Abgrall, Nam-Trung Nguyen, Peige Shao, Jeroen Anton Van Kan

Proc. ASME. ICNMM2009, ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels, 921-925, June 22–24, 2009

Paper No: ICNMM2009-82057

DOI: https://doi.org/10.1115/ICNMM2009-82057

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Topics: Manufacturing, Polymers, Thin films, Bonding, Embossing, Atomic force microscopy, Pressure, Reactive-ion etching, Temperature, Dimensions

Proceedings Papers

Experimental Study on Behavior of Bubbles and Temperature Fluctuation of Heat Transfer Surface by Using Heat Transfer Surface With Artificial Cavities Created by MEMS Technology

Takato Sato, Yasuo Koizumi, Hiroyasu Ohtake

Proc. ASME. ICNMM2009, ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels, 105-111, June 22–24, 2009

Paper No: ICNMM2009-82276

DOI: https://doi.org/10.1115/ICNMM2009-82276

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Topics: Bubbles, Cavities, Heat transfer, Microelectromechanical systems, Temperature, Resolution (Optics), Boiling, Mirrors, Nucleate boiling, Radiation (Physics)

Proceedings Papers

Ion Transport in 2-NM Nanochannels

Chuanhua Duan, Arun Majumdar

Proc. ASME. ICNMM2009, ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels, 943-948, June 22–24, 2009

Paper No: ICNMM2009-82190

DOI: https://doi.org/10.1115/ICNMM2009-82190

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Topics: Bonding, Borosilicate glasses, Dry etching, Electrical conductance, Geometry, Grain boundary diffusion, Mechanical admittance, Protons, Semiconductor wafers, Simulation results

Proceedings Papers

A Systematic Approach to Wall Roughness Effects in Laminar Channel Flows: Experiments and Modelling

D. Gloss, J. Dittmer, H. Herwig

Proc. ASME. ICNMM2008, ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels, 39-46, June 23–25, 2008

Paper No: ICNMM2008-62147

DOI: https://doi.org/10.1115/ICNMM2008-62147

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Topics: Channel flow, Modeling, Surface roughness, Computational fluid dynamics, Entropy, Air flow, Computer simulation, Disks, Error analysis, Flow (Dynamics)

Proceedings Papers

Micro Oscillation Heat Pipe Fabricated on Silicon Wafer

Masamichi Kohno, Takashi Nishizono, Yasunori Onaka, Sumitomo Hidaka, Koji Takahashi, Yasuyuki Takata

Proc. ASME. ICNMM2008, ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels, 1343-1346, June 23–25, 2008

Paper No: ICNMM2008-62082

DOI: https://doi.org/10.1115/ICNMM2008-62082

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Topics: Heat pipes, Oscillations, Semiconductor wafers, Flow (Dynamics), Fluids, Heat, Heat transfer, Microchannels, Pulsatile flow, Vibration

Proceedings Papers

Experimental Study of Flow Boiling in Microchannel

S. G. Singh, S. P. Duttagupta, A. M. Kulkarni, B. P. Puranik, A. Agrawal

Proc. ASME. ICNMM2007, ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels, 229-235, June 18–20, 2007

Paper No: ICNMM2007-30130

DOI: https://doi.org/10.1115/ICNMM2007-30130

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Topics: Boiling, Flow (Dynamics), Microchannels, Pressure drop, Two-phase flow, Heat, Heat flux, Heat transfer, Semiconductor wafers, Computer cooling

Proceedings Papers

Bulk Micromachining of High Index Silicon Wafers and Possible Applications in Microchannels and Diffractive Elements

W. Calleja-Arriaga, C. Zu´n˜iga-Islas, P. Rosales-Quintero, J. De la Hidalga-Wade, C. Reyes-Betanzo, A. Torres-Jacome, M. Linares-Aranda

Proc. ASME. ICNMM2007, ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels, 443-448, June 18–20, 2007

Paper No: ICNMM2007-30189

DOI: https://doi.org/10.1115/ICNMM2007-30189

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Topics: Microchannels, Micromachining, Semiconductor wafers, Etching, Microfluidics, Diffraction gratings, Manufacturing, Microelectromechanical systems, Optics, Silicon

Proceedings Papers

Micro-Refrigerator Fabricated on Silicon Wafer

Y. Takata, K. Sugahara, T. Tachikawa, S. Moroe, H. Kubota, M. Kohno, K. Takahashi, T. Koshimizu

Proc. ASME. ICNMM2007, ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels, 749-753, June 18–20, 2007

Paper No: ICNMM2007-30108

DOI: https://doi.org/10.1115/ICNMM2007-30108

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Topics: Semiconductor wafers, Heat exchangers, Flow (Dynamics), Cooling, Microcoolers, Temperature, Thermal conductivity, Engineering prototypes, Joules, Numerical analysis

Proceedings Papers

Manifold Microchannel Cooler for Direct Backside Liquid Cooling of SiC Power Devices

Lauren Everhart, Nicholas Jankowski, Bruce Geil, Andrew Bayba, Dimeji Ibitayo, Patrick McCluskey

Proc. ASME. ICNMM2007, ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels, 285-292, June 18–20, 2007

Paper No: ICNMM2007-30190

DOI: https://doi.org/10.1115/ICNMM2007-30190

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Topics: Cooling, Manifolds, Microchannels, Design, Engineering simulation, Manufacturing, Pressure drop, Simulation, Flow (Dynamics), Heat

Proceedings Papers

Fluid Flow and Heat Transfer in Microchannels With Rectangular Cross Section

Jung-Yeul Jung, Ho-Young Kwak

Proc. ASME. ICMM2003, 1st International Conference on Microchannels and Minichannels, 291-297, April 24–25, 2003

Paper No: ICMM2003-1032

DOI: https://doi.org/10.1115/ICMM2003-1032

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Topics: Fluid dynamics, Heat transfer, Microchannels, Friction, Convection, Flow (Dynamics), Microelectromechanical systems, Polishing, Polysilicon, Semiconductor wafers

Proceedings Papers

Gaseous Slip Flow in a Micro-Channel

Shou-Shing Hsieh, Huang-Hsiu Tsai, Chih-Yi Lin, Ching-Fang Huang, Cheng-Ming Chien

Proc. ASME. ICMM2003, 1st International Conference on Microchannels and Minichannels, 299-306, April 24–25, 2003

Paper No: ICMM2003-1033

DOI: https://doi.org/10.1115/ICMM2003-1033

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Topics: Microchannels, Slip flow, Flow (Dynamics), Boundary-value problems, Gas flow, Knudsen number, Nitrogen, Pressure drop, Reynolds number, Semiconductor wafers

NARROW

Heat Transfer Enhancement in Compact Phase Change Microchannel Heat Exchangers for High Flux Laser Diodes

Fabrication of Inverted Trapezoidal Microstructures for Heat Transfer and Microfluidics Applications

Pressure Drop Measurements in Turbulent Channel Flow Over Superhydrophobic Surfaces With Riblets

Subcooled Flow Boiling Over Nanostructured Plate Integrated Into a Rectangular Channel

Experimental Investigations of Laminar, Transitional to Turbulent Gas Flow in Rib-Patterned Micro-Channels

Compressible Microchannel Flow

Characterization of Capillary Flow Within a Homogenously Dispersed Array of Vertical Micropillars

Experimental Investigation of Dielectrophoretic Behavior of Myoglobin and Silica Particles on a Microelectrode Chip

Experimental Study of Microbubble Formation in Micro Channel

Fabrication of Nanochannels on Polymer Thin Film

Experimental Study on Behavior of Bubbles and Temperature Fluctuation of Heat Transfer Surface by Using Heat Transfer Surface With Artificial Cavities Created by MEMS Technology

Ion Transport in 2-NM Nanochannels

A Systematic Approach to Wall Roughness Effects in Laminar Channel Flows: Experiments and Modelling

Micro Oscillation Heat Pipe Fabricated on Silicon Wafer

Experimental Study of Flow Boiling in Microchannel

Bulk Micromachining of High Index Silicon Wafers and Possible Applications in Microchannels and Diffractive Elements

Micro-Refrigerator Fabricated on Silicon Wafer

Manifold Microchannel Cooler for Direct Backside Liquid Cooling of SiC Power Devices

Fluid Flow and Heat Transfer in Microchannels With Rectangular Cross Section

Gaseous Slip Flow in a Micro-Channel

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