For the last decade, many researchers have been working to develop self-healing materials, and have obtained good results in the field of polymers, these components with microencapsulated healing agent have exhibited noticeable mechanical performance and regenerative property The research described in this paper applies the concept of self healing to simulate self healing polymer matrix composites, with the aid of models developed by the authors for the manufacturing processes and self-healing behavior. The development of self-healing is a novel idea that has not been totally explored in great detail yet. The concept of self-healing described in this paper consists of simulation of a healing agent dicyclopentadiene (DCPD) inside of a microvascular network within a polymer matrix coating with catalyst forming a self-healing composite (SHC). When this SHC is damaged or cracked, the healing agent by capillary action will flow inside of the microvascular network; when the liquid enter in contact with the catalyst will form a polymer structure and sealing the crack. The study consists of theoretical analysis and Computational Fluid Dynamics of a self-healing polymer. The objective of the study reported here was to find the influence and efficiency of the microvascular network in healing a polymer matrix. To check this effect a computational model was created to simulate the healing treatment, thus a crack was created on the matrix surface piercing the microvascular network filled with healing agent and the method to simulate healing behavior of the composite allows assessment of the effects of the autonomously repairing repeated damage events.
- Design Engineering Division and Computers in Engineering Division
Computational Analysis of Self-Healing in a Polymer Matrix With Microvascular Networks
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Martinez Lucci, J, Amano, RS, & Rohatgi, P. "Computational Analysis of Self-Healing in a Polymer Matrix With Microvascular Networks." Proceedings of the ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 3: 28th Computers and Information in Engineering Conference, Parts A and B. Brooklyn, New York, USA. August 3–6, 2008. pp. 409-417. ASME. https://doi.org/10.1115/DETC2008-50148
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