The growth of SiC bulk crystal is studied using a physical model including chemical reactions, mass transfer and growth kinetics. The thermal stress distribution in an irregular shaped growing crystal is predicted using a two-dimensional anisotropic stress model. The growth and stress models are integrated into an existing global heat transport model to investigate variation of thermal field, growth rate and the shape of the as-grown crystal as well as the thermal stress distribution during a real time growth processes. The onset of dislocation is also correlated with thermal elastic stress qualitatively using the CRSS model. The simulated results are compared with experimental measurement. The effects of the growth system geometry are also discussed.
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ASME 2002 International Mechanical Engineering Congress and Exposition
November 17–22, 2002
New Orleans, Louisiana, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
0-7918-3632-0
PROCEEDINGS PAPER
Modeling for Mass Transfer and Thermal Stress of Silicon Carbide PVT Growth
R.-H. Ma,
R.-H. Ma
State University of New York at Stony Brook, Stony Brook, NY
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H. Zhang,
H. Zhang
State University of New York at Stony Brook, Stony Brook, NY
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M. Dudley,
M. Dudley
State University of New York at Stony Brook, Stony Brook, NY
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M. Skowronski
M. Skowronski
Carnegie Mellon University, Pittsburgh, PA
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R.-H. Ma
State University of New York at Stony Brook, Stony Brook, NY
H. Zhang
State University of New York at Stony Brook, Stony Brook, NY
M. Dudley
State University of New York at Stony Brook, Stony Brook, NY
S. Ha
Carnegie Mellon University, Pittsburgh, PA
M. Skowronski
Carnegie Mellon University, Pittsburgh, PA
Paper No:
IMECE2002-39391, pp. 187-195; 9 pages
Published Online:
June 3, 2008
Citation
Ma, R, Zhang, H, Dudley, M, Ha, S, & Skowronski, M. "Modeling for Mass Transfer and Thermal Stress of Silicon Carbide PVT Growth." Proceedings of the ASME 2002 International Mechanical Engineering Congress and Exposition. Heat Transfer, Volume 1. New Orleans, Louisiana, USA. November 17–22, 2002. pp. 187-195. ASME. https://doi.org/10.1115/IMECE2002-39391
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