We present a new room-temperature bonding technique using a submicron-thick PDMS as an intermediate adhesive bonding layer for fabrication of micron and submicron-scale channels. The ultrathin bonding layers were created with spin-coating of PDMS dissolved in toluene at various weight ratios from 1:4 to 1:18 (PDMS:toluene) to obtain layer thicknesses from 1.65 μm to 0.10 μm, respectively. Bonding of discrete parts of microchannel was formed under pressure with a clamping vise at room-temperature. Tensile bonding strength test on this new technique showed excellent bonding strength. We have achieved 310 kPa for a 0.1 μm-thick layer with the aid of oxygen plasma treatment. To demonstrate its utility in micron and submicron channel fabrication, we created channels (970 μm × 60 μm × 0.97 μm) and performed leakage tests. The bonding showed no leakage at pressures up to 210 kPa.
- Electronic and Photonic Packaging Division
A Room-Temperature Bonding Technique Using Ultrathin PDMS as an Intermediate Layer for Fabrication of Micron and Submicron Channels
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Sung, Y, Zhao, Y, & Lin, Q. "A Room-Temperature Bonding Technique Using Ultrathin PDMS as an Intermediate Layer for Fabrication of Micron and Submicron Channels." Proceedings of the ASME 2005 International Mechanical Engineering Congress and Exposition. Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. Orlando, Florida, USA. November 5–11, 2005. pp. 269-272. ASME. https://doi.org/10.1115/IMECE2005-82824
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