An experimental system on the fluid flow in microchannels with heat generation at the bottom has been set up. This system approximates the use of microchannel flow for the cooling of electronic components. The fabrication procedure of the test section is introduced briefly. Then, different flow rates and heat input have been proposed to study the effect of these parameters experimentally. Several numerical models have been given to simulate this process. By comparing the results from these models and the experimental data, it is found that the “two channel model”, which employ two channels with periodic boundary conditions, is the best model to simulate the overall heat transfer performance. The study considers the use of combined experimental and numerical simulation for an accurate and realistic modeling of such complex microchannel systems.
Numerical Simulation of Fluid Flow and Heat Transfer in U-Shape Microchannels
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Zhang, T, Jia, L, Zhang, J, & Jaluria, Y. "Numerical Simulation of Fluid Flow and Heat Transfer in U-Shape Microchannels." Proceedings of the ASME 2010 International Mechanical Engineering Congress and Exposition. Volume 7: Fluid Flow, Heat Transfer and Thermal Systems, Parts A and B. Vancouver, British Columbia, Canada. November 12–18, 2010. pp. 1311-1319. ASME. https://doi.org/10.1115/IMECE2010-39816
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