A closed liquid reservoir in typical fluidic microdevices contain liquid volumes ranging from μl to ml. A new approach for liquid filling and sealing of multiple microdevices with a volume less than 1 nl is presented. A Teflon microgasketing technique combined with a room temperature curing UV epoxy adhesive is used to isolate liquid inside each lithographically defined area and permanently seal the device all in a batch fashion. The technique has been applied to successfully package an array of liquid-filled mercury microrelays, each of extremely small volume (< nl). To ensure good penetration of the adhesive throughout the entire die of many microdevices, a method for adhesive distribution using wicking microchannels has been developed. The microgasketing technique is further combined with electroplated microriveting, another low-temperature wafer joining method, to provide sealing to the microriveting technique. Microgasketing is a quite general technique, as it can be combined with most low-temperature wafer joining methods and the reservoir area could contain liquid or gas and can be of a wide range of volumes and shapes.