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Proceedings Papers

Physics-Based Filament Adhesion Modeling in Fused Filament Fabrication

Shreyas Aniyambeth, Deepak Malekar, Tuğrul Özel

Proc. ASME. IMECE2022, Volume 2A: Advanced Manufacturing, V02AT02A027, October 30–November 3, 2022

Paper No: IMECE2022-96486

DOI: https://doi.org/10.1115/IMECE2022-96486

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Topics: Additive manufacturing, Adhesion, Manufacturing, Modeling, Physics, Polymers

Proceedings Papers

Spontaneous Enlargement of Receptor Clusters in Response to Pulling Traction

Alireza S. Sarvestani, Arsha Moorthy

Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T12A026, October 30–November 3, 2022

Paper No: IMECE2022-89397

DOI: https://doi.org/10.1115/IMECE2022-89397

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Topics: Adhesion, Anchorage, Elasticity, Mechanical properties, Proteins, Sensors, Tension, Thermodynamic processes, Traction

Proceedings Papers

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Y. Feng, V. R. Raju, E. Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 89-139, November 16–21, 1997

Paper No: IMECE1997-0817

DOI: https://doi.org/10.1115/IMECE1997-0817

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Topics: Failure, Adhesion, Fracture mechanics, Manufacturing, Mechanical behavior, Microelectronic devices, Modeling, Molding, Reliability, Surfaces (Materials)

Proceedings Papers

Molecular Mechanisms of Monocyte Adhesion to Cytokine Stimulated Endothelial Cells Under Physiological Flow Conditions

Sharad Kukreti, Larry V. McIntire, C. Wayne Smith

Proc. ASME. IMECE97, Advances in Bioengineering, 81-82, November 16–21, 1997

Paper No: IMECE1997-0238

DOI: https://doi.org/10.1115/IMECE1997-0238

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Topics: Adhesion, Endothelial cells, Flow (Dynamics), Physiology, Adhesives, Shear stress

Proceedings Papers

Hydrodynamics in Cell Rolling and Adhesion

Yihua Zhao, Richard Skalak, Shu Chien

Proc. ASME. IMECE97, Advances in Bioengineering, 79-80, November 16–21, 1997

Paper No: IMECE1997-0237

DOI: https://doi.org/10.1115/IMECE1997-0237

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Topics: Adhesion, Hydrodynamics, Biological cells, Design, Leukocytes

Proceedings Papers

Probabilistic Modeling of Formation and Breakage of Cell Aggregates in a Shear Field

Mian Long, Harry L. Goldsmith, Cheng Zhu

Proc. ASME. IMECE97, Advances in Bioengineering, 77-78, November 16–21, 1997

Paper No: IMECE1997-0236

DOI: https://doi.org/10.1115/IMECE1997-0236

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Topics: Modeling, Shear (Mechanics), Adhesion, Adhesives, Erythrocytes, Latex, Probability, Statistics, Steady state, Stress

Proceedings Papers

A Micromachined Device to Measure Subcellular Traction Forces

Catherine G. Galbraith, Michael P. Sheetz

Proc. ASME. IMECE97, Advances in Bioengineering, 167-168, November 16–21, 1997

Paper No: IMECE1997-0281

DOI: https://doi.org/10.1115/IMECE1997-0281

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Topics: Micromachining, Traction, Adhesion, Tissue engineering

Proceedings Papers

Sticking to the Point: A Friction and Adhesion Model for Simulated Surfaces

Jun Chen, Christopher DiMattia, Russell M. Taylor, II, Mike Falvo, Pichet Thiansathaporn, Richard Superfine

Proc. ASME. IMECE97, Dynamic Systems and Control, 167-171, November 16–21, 1997

Paper No: IMECE1997-0392

DOI: https://doi.org/10.1115/IMECE1997-0392

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Topics: Adhesion, Friction, Physics, Haptics, Stiction

Proceedings Papers

Mechanics of Cell Rolling Adhesion in Shear Flow

Xiaoxiao Lei, Michael B. Lawrence, Cheng Dong

Proc. ASME. IMECE97, Advances in Bioengineering, 173-174, November 16–21, 1997

Paper No: IMECE1997-0284

DOI: https://doi.org/10.1115/IMECE1997-0284

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Topics: Adhesion, Shear flow, Leukocytes, Adhesives, Biological tissues, Deformation, Endothelial cells, Hemodynamics, Shear (Mechanics), Shear stress

Proceedings Papers

Measuring the Probability of Receptor Extraction From the Cell Membrane

Scott E. Chesla, Bryan T. Marshall, Cheng Zhu

Proc. ASME. IMECE97, Advances in Bioengineering, 129-130, November 16–21, 1997

Paper No: IMECE1997-0262

DOI: https://doi.org/10.1115/IMECE1997-0262

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Topics: Cell membranes, Probability, Membranes, Adhesion, Adhesives

Proceedings Papers

Probabilistic Modeling of Rosette Formation

Mian Long, Cheng Zhu

Proc. ASME. IMECE97, Advances in Bioengineering, 75-76, November 16–21, 1997

Paper No: IMECE1997-0235

DOI: https://doi.org/10.1115/IMECE1997-0235

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Topics: Adhesion, Modeling

Proceedings Papers

Adhesions of the Patellar and Quadriceps Tendons: Mathematical Model Simulations

H. Roglic, S. D. Kwak, J. H. Henry, G. A. Ateshian, W. G. Rodkey, J. R. Steadman, V. C. Mow

Proc. ASME. IMECE97, Advances in Bioengineering, 261-262, November 16–21, 1997

Paper No: IMECE1997-0328

DOI: https://doi.org/10.1115/IMECE1997-0328

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Topics: Engineering simulation, Simulation, Tendons, Knee, Adhesion, Surgery, Anterior cruciate ligament, Mechanical admittance, Arthroscopy, Biological tissues

Proceedings Papers

The Role of Mechanical Stimulation on Ligament Fibroblast Gene Expression of Extracellular Matrix and Adhesion Proteins

Adam H. Hsieh, Yan Shi, K.-L. Paul Sung

Proc. ASME. IMECE97, Advances in Bioengineering, 171-172, November 16–21, 1997

Paper No: IMECE1997-0283

DOI: https://doi.org/10.1115/IMECE1997-0283

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Topics: Adhesion, Fibroblasts, Proteins, Anterior cruciate ligament, Biological tissues, Wounds

Proceedings Papers

Effect of Thermal Residual Stress on the Measurement of the Adhesion Between Polyimide and Underfill Using an Asymmetric Double Cantilever Beam Specimen

Jinbao Jiao, Charan K. Gurumurthy, Edward J. Kramer, Yan Sha, Chung-Yuen Hui, Peter Børgesen

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 97-102, November 16–21, 1997

Paper No: IMECE1997-0504

DOI: https://doi.org/10.1115/IMECE1997-0504

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Topics: Adhesion, Cantilever beams, Stress, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Ethers (Class of compounds), Thermal expansion

Proceedings Papers

The Effect of Temperature and Humidity Exposure on Adhesion

R. A. Pearson, R. M. Hydro, T. B. Lloyd, H. F. Nied

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 1-6, November 16–21, 1997

Paper No: IMECE1997-0493

DOI: https://doi.org/10.1115/IMECE1997-0493

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Topics: Adhesion, Temperature, Adhesives, Silver, Copper, Epoxy adhesives, Epoxy resins, Fracture (Materials), Fracture (Process), Cantilever beams

Proceedings Papers

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Xiang Dai, Mark V. Brillhart, Paul S. Ho

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 115-124, November 16–21, 1997

Paper No: IMECE1997-0506

DOI: https://doi.org/10.1115/IMECE1997-0506

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Topics: Adhesion, Flip-chip packages, Delamination, Failure, Flip-chip, Flip-chip assemblies, Fracture mechanics, Junctions, Manufacturing, Polymers

Proceedings Papers

Interfacial Fracture Toughness in Plastic Packages

L. T. Nguyen, G. Lee, C. Jones, T. R. Hsu, R. Fang, A. Y. Kuo, W. T. Chen

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 15-24, November 16–21, 1997

Paper No: IMECE1997-0495

DOI: https://doi.org/10.1115/IMECE1997-0495

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Topics: Fracture toughness, Design, Testing, Adhesion, Coating processes, Coatings, Composite building materials, Copper alloys, Databases, Fracture (Materials)

Proceedings Papers

Comparison of Acoustic Microscope, X-Ray Radiography, Dye Penetrant and Destructive Physical Analysis Data for Die Attachment Analysis

Duane A. Gilmour, James F. Reilly, Donald W. Calabrese

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 175-181, November 16–21, 1997

Paper No: IMECE1997-0514

DOI: https://doi.org/10.1115/IMECE1997-0514

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Topics: Acoustics, Microscopes, X-rays, Microscopy, Silicon, Adhesion, Energy dissipation, Testing, Delamination, Density

Proceedings Papers

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

J. M. Snodgrass, S.-Y. Kook, A. Kirtikar, R. H. Dauskardt

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 33-39, November 16–21, 1997

Paper No: IMECE1997-0497

DOI: https://doi.org/10.1115/IMECE1997-0497

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Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics

Proceedings Papers

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Sven Rzepka, Matt A. Korhonen, Ekkehard Meusel, Che-Yu Li

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 73-83, November 16–21, 1997

Paper No: IMECE1997-0502

DOI: https://doi.org/10.1115/IMECE1997-0502

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Topics: Delamination, Flip-chip, Flip-chip devices, Reliability, Solders, Tension, Failure, Solder joints, Adhesion, Compressive stress

2 3 4 5

NARROW

Physics-Based Filament Adhesion Modeling in Fused Filament Fabrication

Spontaneous Enlargement of Receptor Clusters in Response to Pulling Traction

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Molecular Mechanisms of Monocyte Adhesion to Cytokine Stimulated Endothelial Cells Under Physiological Flow Conditions

Hydrodynamics in Cell Rolling and Adhesion

Probabilistic Modeling of Formation and Breakage of Cell Aggregates in a Shear Field

A Micromachined Device to Measure Subcellular Traction Forces

Sticking to the Point: A Friction and Adhesion Model for Simulated Surfaces

Mechanics of Cell Rolling Adhesion in Shear Flow

Measuring the Probability of Receptor Extraction From the Cell Membrane

Probabilistic Modeling of Rosette Formation

Adhesions of the Patellar and Quadriceps Tendons: Mathematical Model Simulations

The Role of Mechanical Stimulation on Ligament Fibroblast Gene Expression of Extracellular Matrix and Adhesion Proteins

Effect of Thermal Residual Stress on the Measurement of the Adhesion Between Polyimide and Underfill Using an Asymmetric Double Cantilever Beam Specimen

The Effect of Temperature and Humidity Exposure on Adhesion

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Interfacial Fracture Toughness in Plastic Packages

Comparison of Acoustic Microscope, X-Ray Radiography, Dye Penetrant and Destructive Physical Analysis Data for Die Attachment Analysis

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

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