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Proceedings Papers

Process Modeling and Interfacial Behavior in the VSPA Package

Richard Harries, Suresh Sitaraman

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 293-299, November 16–21, 1997

Paper No: IMECE1997-0676

DOI: https://doi.org/10.1115/IMECE1997-0676

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Topics: Delamination, Electronic packages, Failure mechanisms, Finite element model, Fracture (Materials), Fracture mechanics, Geometry, Manufacturing, Materials properties, Modeling

Proceedings Papers

Direct Observation of Contact Damage Produced by Vickers Indentation in Diamond-Like Films

Vispi Homi Bulsara, Srinivasan Chandrasekar, Thomas N. Farris

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 287-292, November 16–21, 1997

Paper No: IMECE1997-0675

DOI: https://doi.org/10.1115/IMECE1997-0675

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Topics: Damage, Diamond films, Stress, Delamination, Adhesives, Cracking (Materials), Failure, Force sensors, Fracture (Materials), Fracture (Process)

Proceedings Papers

Computational Analysis of Mixed-Mode Delamination Crack Growth in a Woven Laminated Ceramic Matrix Composite

M. Krishnappa, G. M. Newaz

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 455-458, November 16–21, 1997

Paper No: IMECE1997-0700

DOI: https://doi.org/10.1115/IMECE1997-0700

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Topics: Ceramic matrix composites, Delamination, Fracture (Materials), Computational mechanics, Materials properties, Temperature

Proceedings Papers

Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

M. Uschitsky, E. Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 33-54, November 16–21, 1997

Paper No: IMECE1997-0813

DOI: https://doi.org/10.1115/IMECE1997-0813

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Topics: Epoxy adhesives, Epoxy resins, Glass fibers, Stress, Fibers, Buckling, Delamination, Design, Metals, Optical fiber

Proceedings Papers

Nondestructive Elastic Property Characterization of IC Encapsulants

Sridhar Canumalla, Michael G. Oravecz

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 25-32, November 16–21, 1997

Paper No: IMECE1997-0496

DOI: https://doi.org/10.1115/IMECE1997-0496

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Topics: Delamination, Elasticity, Fillers (Materials), Flip-chip packages, Integrated circuit packaging, Molding, Process control, Reliability, Resins, Young's modulus

Proceedings Papers

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Xiang Dai, Mark V. Brillhart, Paul S. Ho

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 115-124, November 16–21, 1997

Paper No: IMECE1997-0506

DOI: https://doi.org/10.1115/IMECE1997-0506

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Topics: Adhesion, Flip-chip packages, Delamination, Failure, Flip-chip, Flip-chip assemblies, Fracture mechanics, Junctions, Manufacturing, Polymers

Proceedings Papers

Reliability of Underfill-Encapsulated Flip-Chip Packages

Hiroaki Doi, Kenya Kawano, Akio Yasukawa, Toshihiko Sato

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-0494

DOI: https://doi.org/10.1115/IMECE1997-0494

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Topics: Flip-chip packages, Reliability, Flat heat pipes, Solder joints, Delamination, Mechanical properties, Shapes, Stress, Stress analysis (Engineering), Finite element methods

Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997

Paper No: IMECE1997-0508

DOI: https://doi.org/10.1115/IMECE1997-0508

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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination

Proceedings Papers

Comparison of Acoustic Microscope, X-Ray Radiography, Dye Penetrant and Destructive Physical Analysis Data for Die Attachment Analysis

Duane A. Gilmour, James F. Reilly, Donald W. Calabrese

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 175-181, November 16–21, 1997

Paper No: IMECE1997-0514

DOI: https://doi.org/10.1115/IMECE1997-0514

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Topics: Acoustics, Microscopes, X-rays, Microscopy, Silicon, Adhesion, Energy dissipation, Testing, Delamination, Density

Proceedings Papers

A New Approach for Thermal Fatigue Testing of the Underfill/Passivation Interface

Charan K. Gurumurthy, Jinbao Jiao, Larry G. Norris, Chung-Yuen Hui, Edward J. Kramer

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 41-47, November 16–21, 1997

Paper No: IMECE1997-0498

DOI: https://doi.org/10.1115/IMECE1997-0498

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Topics: Cantilever beams, Cycles, Delamination, Displacement, Failure, Fatigue, Fatigue testing, Fibers, Flow (Dynamics), Fracture (Materials)

Proceedings Papers

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Sven Rzepka, Matt A. Korhonen, Ekkehard Meusel, Che-Yu Li

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 73-83, November 16–21, 1997

Paper No: IMECE1997-0502

DOI: https://doi.org/10.1115/IMECE1997-0502

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Topics: Delamination, Flip-chip, Flip-chip devices, Reliability, Solders, Tension, Failure, Solder joints, Adhesion, Compressive stress

Proceedings Papers

Behavior of Tensile Preloaded Composites Subjected to Low-Velocity Impact Loads

Ajit D. Kelkar, J. Sankar, C. Grace, Roger J. Aschenbrenner, Gregory Schoeppner

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 39-46, November 16–21, 1997

Paper No: IMECE1997-0521

DOI: https://doi.org/10.1115/IMECE1997-0521

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Topics: Composite materials, Stress, Laminates, Damage, Aircraft, Fiber reinforced composites, Graphite, Weight (Mass), Damage mechanics, Deformation

Proceedings Papers

Energy Absorption and Dissipation Characteristics of Pultruded Glass-Graphite/Epoxy Hybrid Composite Beams

Murthy V. S. L. N. Kowsika, P. Raju Mantena, K. Balasubramaniam

Proc. ASME. IMECE97, Noise Control and Acoustics, 99-116, November 16–21, 1997

Paper No: IMECE1997-1035

DOI: https://doi.org/10.1115/IMECE1997-1035

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Topics: Absorption, Composite building materials, Energy dissipation, Epoxy adhesives, Epoxy resins, Glass, Graphite, Pultrusion, Delamination, Composite materials

Proceedings Papers

Low-Velocity Impact Response and Evaluation of Delamination Damage in CFRP Laminates

Mahesh. V. Hosur, C. R. L. Murthy, T. S. Ramamurthy

Proc. ASME. IMECE97, Noise Control and Acoustics, 203-214, November 16–21, 1997

Paper No: IMECE1997-1046

DOI: https://doi.org/10.1115/IMECE1997-1046

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Topics: Carbon reinforced plastics, Damage, Delamination, Laminates, Joules, Stress, Composite materials, Displacement, Energy levels (Quantum mechanics), Image processing

Proceedings Papers

Ultrasonic and Acoustic Emission NDE of a Graphite/Epoxy T-Joint

Vinay Dayal

Proc. ASME. IMECE97, Noise Control and Acoustics, 155-160, November 16–21, 1997

Paper No: IMECE1997-1040

DOI: https://doi.org/10.1115/IMECE1997-1040

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Topics: Acoustic emissions, Epoxy adhesives, Epoxy resins, Graphite, Nondestructive evaluation, Buckling, Composite materials, Compression, Delamination

Proceedings Papers

Nondestructive Evaluation of Graphite/Aluminum Composites Using Acousto-Ultrasonics

Gene J. Quattlebaum, P. K. Raju

Proc. ASME. IMECE97, Noise Control and Acoustics, 167-175, November 16–21, 1997

Paper No: IMECE1997-1042

DOI: https://doi.org/10.1115/IMECE1997-1042

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Topics: Aluminum, Composite materials, Graphite, Nondestructive evaluation, Ultrasonics, Adhesives, Bond strength, Carbon, Damage, Tensile strength

Proceedings Papers

Effect of 3D Reinforcement on the Low-Velocity Impact Response of S2-Glass/Vinyl Ester Composite Laminates

M. V. Hosur, U. K. Vaidya, A. Abraham, S. Jeelani

Proc. ASME. IMECE98, Noise Control and Acoustics, 303-308, November 15–20, 1998

Paper No: IMECE1998-0524

DOI: https://doi.org/10.1115/IMECE1998-0524

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Topics: Composite materials, Ester, Glass, Laminates, Damage, Delamination, Energy levels (Quantum mechanics), Fiber reinforced composites, Frequency response, Joules

Proceedings Papers

Micromechanics-Based Modeling of Uniaxially and Biaxially Compressed Graphite/Epoxy Laminates

Serge Hauert, Daniel S. Potter, Vijay Gupta

Proc. ASME. IMECE98, Recent Advances in Mechanics of Aerospace Structures and Materials, 123-125, November 15–20, 1998

Paper No: IMECE1998-0369

DOI: https://doi.org/10.1115/IMECE1998-0369

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Topics: Epoxy adhesives, Epoxy resins, Graphite, Laminates, Micromechanics (Engineering), Modeling, Fracture (Materials), Stress, Brittleness, Delamination

Proceedings Papers

Fatigue Behavior and Life Simulation of Torsion Loaded Glass Fiber/Vinylester Tubes

Norbert A. Himmel, Michael C. Kienert

Proc. ASME. IMECE98, Recent Advances in Mechanics of Aerospace Structures and Materials, 75-84, November 15–20, 1998

Paper No: IMECE1998-0363

DOI: https://doi.org/10.1115/IMECE1998-0363

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Topics: Fatigue, Glass fibers, Simulation, Torsion, Damage, Fatigue life, Fracture (Process), Stress, Composite materials, Delamination

Proceedings Papers

Compressive Failure of Debonded Sandwich Beams

John L. Avery, III, Manickam Narayanan, Bhavani V. Sankar

Proc. ASME. IMECE98, Recent Advances in Mechanics of Aerospace Structures and Materials, 207-217, November 15–20, 1998

Paper No: IMECE1998-0380

DOI: https://doi.org/10.1115/IMECE1998-0380

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Topics: Aramid fibers, Buckling, Cantilever beams, Compression, Delamination, Epoxy adhesives, Epoxy resins, Failure, Finite element model, Fracture toughness

2 3 4 5

NARROW

Process Modeling and Interfacial Behavior in the VSPA Package

Direct Observation of Contact Damage Produced by Vickers Indentation in Diamond-Like Films

Computational Analysis of Mixed-Mode Delamination Crack Growth in a Woven Laminated Ceramic Matrix Composite

Predicted Thermally Induced Stresses in a Glass Fiber Epoxy Bonded Into an Elliptical Enclosure

Nondestructive Elastic Property Characterization of IC Encapsulants

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Reliability of Underfill-Encapsulated Flip-Chip Packages

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Comparison of Acoustic Microscope, X-Ray Radiography, Dye Penetrant and Destructive Physical Analysis Data for Die Attachment Analysis

A New Approach for Thermal Fatigue Testing of the Underfill/Passivation Interface

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Behavior of Tensile Preloaded Composites Subjected to Low-Velocity Impact Loads

Energy Absorption and Dissipation Characteristics of Pultruded Glass-Graphite/Epoxy Hybrid Composite Beams

Low-Velocity Impact Response and Evaluation of Delamination Damage in CFRP Laminates

Ultrasonic and Acoustic Emission NDE of a Graphite/Epoxy T-Joint

Nondestructive Evaluation of Graphite/Aluminum Composites Using Acousto-Ultrasonics

Effect of 3D Reinforcement on the Low-Velocity Impact Response of S2-Glass/Vinyl Ester Composite Laminates

Micromechanics-Based Modeling of Uniaxially and Biaxially Compressed Graphite/Epoxy Laminates

Fatigue Behavior and Life Simulation of Torsion Loaded Glass Fiber/Vinylester Tubes

Compressive Failure of Debonded Sandwich Beams

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