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Proceedings Papers

Active Structural Control of Vertical Turning Lathe Vibrations

John E. Miesner, Reza Ghanadan, Stephen D. O’Regan

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 105-112, November 16–21, 1997

Paper No: IMECE1997-1082

DOI: https://doi.org/10.1115/IMECE1997-1082

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Topics: Turning, Vibration, Control equipment, Signals, Accelerometers, Actuators, Capacitors, Chatter, Control systems, Electronic components

Proceedings Papers

Transient Thermal Analysis of Outdoor Electronic Equipment

L. T. Yeh

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 65-73, November 16–21, 1997

Paper No: IMECE1997-1215

DOI: https://doi.org/10.1115/IMECE1997-1215

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Topics: Electronic equipment, Thermal analysis, Transients (Dynamics), Temperature, Cycles, Design, Electronic components, Flow (Dynamics), Junctions, Reliability

Proceedings Papers

Optimization of the Compression (Injection/Compression) Molding Process Using Numerical Simulation

Bruce A. Davis, Richard P. Theriault, Tim A. Osswald

Proc. ASME. IMECE97, CAE and Intelligent Processing of Polymeric Materials, 125-138, November 16–21, 1997

Paper No: IMECE1997-0624

DOI: https://doi.org/10.1115/IMECE1997-0624

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Topics: Compression, Computer simulation, Molding, Optimization, Design, Simulation, Computers, Fibers, Thermosetting composites, Vehicles

Proceedings Papers

Effects of Orifice Geometry on the Heat Transfer Distribution for Impinging Jet Array

Simona C. Arjocu, James A. Liburdy, Michele M. Ferland

Proc. ASME. IMECE97, Heat Transfer: Volume 3, 47-54, November 16–21, 1997

Paper No: IMECE1997-0893

DOI: https://doi.org/10.1115/IMECE1997-0893

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Topics: Geometry, Heat transfer, Jets, Flow (Dynamics), Heat, Heat transfer coefficients, Liquid crystals, Reynolds number, Blades, Cooling

Proceedings Papers

Guidelines for Preliminary Thermal Design of Convectively Cooled Printed Circuit Boards

Hyunjae Park, Nicholas Nigro, Abdel Elkouh, Neil Gollhardt, Ping Lee

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 315-324, November 16–21, 1997

Paper No: IMECE1997-0857

DOI: https://doi.org/10.1115/IMECE1997-0857

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Topics: Design, Printed circuit boards, Air flow, Heat, Dimensions, Electronic components, Energy dissipation, Engineers, Temperature, Temperature distribution

Proceedings Papers

Structural Analysis of a Sensor Module for the “Smart” Bearing

Robert Gao, Priyaranjan Sahay

Proc. ASME. IMECE98, Dynamic Systems and Control, 615-621, November 15–20, 1998

Paper No: IMECE1998-0309

DOI: https://doi.org/10.1115/IMECE1998-0309

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Topics: Bearings, Sensors, Structural analysis, Ball bearings, Deflection, Design, Electronic components, Modal analysis, Packaging, Stress

Proceedings Papers

Heat Spreaders for High-Power Electronics Employing Boiling Mechanisms in a Narrow Space

M. Gao, Y. Cao

Proc. ASME. IMECE98, Advanced Energy Systems, 503-508, November 15–20, 1998

Paper No: IMECE1998-0879

DOI: https://doi.org/10.1115/IMECE1998-0879

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Topics: Boiling, Electronics, Flat heat pipes, Heat transfer, Cooling, Fluids, Heat, Heat flux, Copper, Design

Proceedings Papers

Parametric Investigation on Thermal and Hydraulic Performance of Minichannel Heatsink

Ozan Atalay, Murat Gultekin, Sertac Cadirci

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A055, November 1–5, 2021

Paper No: IMECE2021-70472

DOI: https://doi.org/10.1115/IMECE2021-70472

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Topics: Computational fluid dynamics, Heat sinks, Heat transfer, Design, Modeling, Convection, Cooling, Electric vehicles, Electronic components, Energy consumption

Proceedings Papers

Analysis of Conjugate Heat Transfer in a Three-Dimensional Microchannel Heat Sink for Cooling of Electronic Components

Andrei G. Fedorov, Raymond Viskanta

Proc. ASME. IMECE99, Heat Transfer: Volume 3, 89-98, November 14–19, 1999

Paper No: IMECE1999-1066

DOI: https://doi.org/10.1115/IMECE1999-1066

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Topics: Cooling, Electronic components, Heat sinks, Heat transfer, Microchannels, Fluids, Design, Electronic packaging, Energy conservation, Flow (Dynamics)

Proceedings Papers

Dynamics of the Flows in Micro-Channels of a Capillary Pumped Loop (CPL) Evaporator

Hyoung-In Lee, Hye-Jung Cho, In-Seob Song, Ju-Hyeong Lee

Proc. ASME. IMECE2001, Heat Transfer: Volume 3 — Fluid-Physics and Heat Transfer for Macro- and Micro-Scale Gas-Liquid and Phase-Change Flows, 171-178, November 11–16, 2001

Paper No: IMECE2001/HTD-24212

DOI: https://doi.org/10.1115/IMECE2001/HTD-24212

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Topics: Dynamics (Mechanics), Flow (Dynamics), Microchannels, Capillarity, Cooling, Cycles, Coolants, Design, Electronic components, Energy consumption

Proceedings Papers

A Methodology for Evaluating the Mechanical Reliability of Alternatives to Tin-Lead Solder Electronic Interconnection Systems (Focus on Electrically Conductive Adhesives)

Anthony J. Rafanelli

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 143-155, November 11–16, 2001

Paper No: IMECE2001/EPP-24718

DOI: https://doi.org/10.1115/IMECE2001/EPP-24718

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Topics: Adhesives, Reliability, Solders, Creep, Fatigue, Fracture mechanics, Electronic components, Stress, Temperature, Thermal shock

Proceedings Papers

Mitigating Environmental and Occupational Health Concerns for the Electronic Demanufacturing Industry

LuAnn Gibson

Proc. ASME. IMECE2000, Successfully Managing the Risk and Development of Your Business and Technology, 85, November 5–10, 2000

Paper No: IMECE2000-1186

DOI: https://doi.org/10.1115/IMECE2000-1186

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Topics: Occupational safety and health, Electronics, Computers, Cutting, Electronic components, Electronic equipment, Ergonomics, Errors, Forklifts, Hazardous substances

Proceedings Papers

Equivalent Active Circuits of Distributed Control Systems

H. S. Tzou, J. H. Ding

Proc. ASME. IMECE2000, Control of Vibration and Noise: New Millennium, 195-202, November 5–10, 2000

Paper No: IMECE2000-1782

DOI: https://doi.org/10.1115/IMECE2000-1782

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Topics: Circuits, Control systems, Electronic circuits, Modeling, Signals, Actuators, Distributed parameter systems, Dynamics (Mechanics), Electronic components, Finite difference methods

Proceedings Papers

Borehole Temperature Modelling in High Temperature Drilling Environment Based on Heat Transfer Laws

Abhijeet D. Chodankar, Cheng-Xian Lin

Proc. ASME. IMECE2019, Volume 8: Heat Transfer and Thermal Engineering, V008T09A075, November 11–14, 2019

Paper No: IMECE2019-10085

DOI: https://doi.org/10.1115/IMECE2019-10085

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Topics: Drilling, Heat transfer, High temperature, Modeling, Temperature, Fluids, Drill strings, Composite materials, Cylinders, Stability

Proceedings Papers

Experimental Setup of Combustion Visualization Inside a Heavy-Duty Diesel Engine Converted to Natural-Gas Spark-Ignition Operation

Vishnu Padmanaban, Jinlong Liu, Cosmin E. Dumitrescu

Proc. ASME. IMECE2019, Volume 6: Energy, V006T06A014, November 11–14, 2019

Paper No: IMECE2019-10735

DOI: https://doi.org/10.1115/IMECE2019-10735

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Topics: Combustion, Diesel engines, Ignition, Natural gas, Visualization, Flames, Cylinders, Diesel, Engines, Fuels

Proceedings Papers

Design and Testing of Liquid Cooled Thermal Solution for High Loading (Socket P) Processors

Anali Soto, Veronica Torreblanca, Devdatta Kulkarni

Proc. ASME. IMECE2018, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A043, November 9–15, 2018

Paper No: IMECE2018-86730

DOI: https://doi.org/10.1115/IMECE2018-86730

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Topics: Design, Testing, Cooling, Data centers, Electronic components, Engineering prototypes, Heat sinks, Numerical analysis, Pins (Engineering), Plates (structures)

Proceedings Papers

Rheology Characterization of Solder Paste

Flávia V. Barbosa, Pedro E. A. Ribeiro, Maria F. Cerqueira, Delfim F. Soares, José C. F. Teixeira, Senhorinha F. C. F. Teixeira, Rui A. M. M. Lima, Diana M. D. Pinho

Proc. ASME. IMECE2017, Volume 7: Fluids Engineering, V007T09A035, November 3–9, 2017

Paper No: IMECE2017-71413

DOI: https://doi.org/10.1115/IMECE2017-71413

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Topics: Rheology, Solders, Reflow soldering, Electronic components, Melting, Shear rate, Viscosity, Adhesion, Alloys, Creep

Proceedings Papers

Qualitative Study of Cumulative Corrosion Damage of IT Equipment in a Data Center Utilizing Air-Side Economizer

Jimil M. Shah, Oluwaseun Awe, Pavan Agarwal, Iziren Akhigbe, Dereje Agonafer, Prabjit Singh, Naveen Kannan, Mike Kaler

Proc. ASME. IMECE2016, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A052, November 11–17, 2016

Paper No: IMECE2016-66199

DOI: https://doi.org/10.1115/IMECE2016-66199

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Topics: Corrosion, Damage, Data centers, Reliability, Contamination, Temperature, Particulate matter, Evaporative cooling, Bearings, Climate

Proceedings Papers

Gait-Monitoring Wearable Technology for Transtibial Prosthetics

Kolby V. Hebert, Rachel S. Keen, Derek R. King, Sally F. Shady

Proc. ASME. IMECE2016, Volume 3: Biomedical and Biotechnology Engineering, V003T04A012, November 11–17, 2016

Paper No: IMECE2016-66226

DOI: https://doi.org/10.1115/IMECE2016-66226

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Topics: Artificial limbs, Biomedicine, Design, Accelerometers, Additive manufacturing, Data collection, Electronic components, Electronics, Engineering prototypes, Graphical user interfaces

Proceedings Papers

Numerical Investigations of the Effect of Flow Arrangement and Number of Layers on the Performance of Multi-Layer Microchannel Heat Sinks

M. B. Effat, M. S. AbdelKarim, O. Hassan, M. Abdelgawad

Proc. ASME. IMECE2015, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A048, November 13–19, 2015

Paper No: IMECE2015-52931

DOI: https://doi.org/10.1115/IMECE2015-52931

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Topics: Flow (Dynamics), Heat sinks, Microchannels, Heat flux, Temperature distribution, Cooling, Electronic components, Pressure drop, Finite element analysis, Numerical analysis

2 3 4

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Active Structural Control of Vertical Turning Lathe Vibrations

Transient Thermal Analysis of Outdoor Electronic Equipment

Optimization of the Compression (Injection/Compression) Molding Process Using Numerical Simulation

Effects of Orifice Geometry on the Heat Transfer Distribution for Impinging Jet Array

Guidelines for Preliminary Thermal Design of Convectively Cooled Printed Circuit Boards

Structural Analysis of a Sensor Module for the “Smart” Bearing

Heat Spreaders for High-Power Electronics Employing Boiling Mechanisms in a Narrow Space

Parametric Investigation on Thermal and Hydraulic Performance of Minichannel Heatsink

Analysis of Conjugate Heat Transfer in a Three-Dimensional Microchannel Heat Sink for Cooling of Electronic Components

Dynamics of the Flows in Micro-Channels of a Capillary Pumped Loop (CPL) Evaporator

A Methodology for Evaluating the Mechanical Reliability of Alternatives to Tin-Lead Solder Electronic Interconnection Systems (Focus on Electrically Conductive Adhesives)

Mitigating Environmental and Occupational Health Concerns for the Electronic Demanufacturing Industry

Equivalent Active Circuits of Distributed Control Systems

Borehole Temperature Modelling in High Temperature Drilling Environment Based on Heat Transfer Laws

Experimental Setup of Combustion Visualization Inside a Heavy-Duty Diesel Engine Converted to Natural-Gas Spark-Ignition Operation

Design and Testing of Liquid Cooled Thermal Solution for High Loading (Socket P) Processors

Rheology Characterization of Solder Paste

Qualitative Study of Cumulative Corrosion Damage of IT Equipment in a Data Center Utilizing Air-Side Economizer

Gait-Monitoring Wearable Technology for Transtibial Prosthetics

Numerical Investigations of the Effect of Flow Arrangement and Number of Layers on the Performance of Multi-Layer Microchannel Heat Sinks

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