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Proceedings Papers

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

Xiantao Yan, Rakesh K. Agarwal

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 383-390, November 16–21, 1997

Paper No: IMECE1997-1114

DOI: https://doi.org/10.1115/IMECE1997-1114

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Topics: Flip-chip assemblies, Fracture toughness, Printed circuit boards, Stress, Fracture (Materials), Silicon chips, Solder masks

Proceedings Papers

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Jianjun Wang, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 411-421, November 16–21, 1997

Paper No: IMECE1997-1118

DOI: https://doi.org/10.1115/IMECE1997-1118

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Topics: Fracture toughness, Fracture (Materials), Temperature, Stress, Displacement, Finite element analysis, Interferometry, Molding, Silicon, Density

Proceedings Papers

Preliminary Results of Laser-Assisted Cleaning of Alumina Coated Carbide Tool Inserts

Ajay P. Malshe, Kok E. Khor, Deepak G. Bhat

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 207-212, November 16–21, 1997

Paper No: IMECE1997-1154

DOI: https://doi.org/10.1115/IMECE1997-1154

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Topics: Lasers, Carbide cutting tools, Coating processes, Coatings, Blasting, Chemical vapor deposition, Cobalt, Cutting, Cutting tools, Damage

Proceedings Papers

Microstructural Effects on the Machining Performance of Dental Ceramics

D. T. Le, Lixun Qi, Guangming Zhang, Stanley J. Ng

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 245-251, November 16–21, 1997

Paper No: IMECE1997-1098

DOI: https://doi.org/10.1115/IMECE1997-1098

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Topics: Ceramics, Machining, Bending strength, Chemical properties, Cutting, Force measurement, Fracture (Materials), Fracture (Process), Fracture toughness, Microscale devices

Proceedings Papers

Measurement of Solder-Copper Interfacial Fracture Parameters Using u 2 -Displacement Fields

H. V. Tippur, H. Krishnamoorthy

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 77-84, November 16–21, 1997

Paper No: IMECE1997-1230

DOI: https://doi.org/10.1115/IMECE1997-1230

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Topics: Copper, Displacement, Fracture (Materials), Solders, Deformation, Fracture toughness, Interferometry, Strain gages

Proceedings Papers

Advances in Tensile Testing of Polysilicon Thin Films

William N. Sharpe, Jr., Bin Yuan, Richard L. Edwards

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 113-116, November 16–21, 1997

Paper No: IMECE1997-1235

DOI: https://doi.org/10.1115/IMECE1997-1235

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Topics: Polysilicon, Tensile testing, Thin films, Testing, ASTM International, Mechanical properties, Displacement, Fracture (Materials), Fracture toughness, Mechanical testing

Proceedings Papers

A Fracture Toughness Test of Bone-Biomaterial Interfaces Under Mixed Mode Loading Conditions

X. D. Wang, C. M. Agrawal

Proc. ASME. IMECE97, Advances in Bioengineering, 323-324, November 16–21, 1997

Paper No: IMECE1997-0359

DOI: https://doi.org/10.1115/IMECE1997-0359

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Topics: Biomaterials, Bone, Fracture toughness, Orthopedics, Artificial limbs, Bonding, Cements (Adhesives), Dental materials, Fracture mechanics, Numerical analysis

Proceedings Papers

Friction Properties at Polyethylene-Metal Interface in Total Joint Arthroplasty

A. Hashemi, M. Dammak, A. Shirazi-Adl, D. J. Zukor

Proc. ASME. IMECE97, Advances in Bioengineering, 315-316, November 16–21, 1997

Paper No: IMECE1997-0355

DOI: https://doi.org/10.1115/IMECE1997-0355

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Topics: Arthroplasty, Friction, Metals, Wear, Artificial joints, Bearings, Bone, Damage, Fracture toughness, Molecular weight

Proceedings Papers

Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load

Jianjun Wang, Minfu Lu, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 103-113, November 16–21, 1997

Paper No: IMECE1997-0505

DOI: https://doi.org/10.1115/IMECE1997-0505

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Topics: Flip-chip packages, Fracture (Materials), Stress, Crack propagation, Fracture toughness, Silicon chips, Deflection, Displacement, Interferometry, Density

Proceedings Papers

Interfacial Fracture Toughness in Plastic Packages

L. T. Nguyen, G. Lee, C. Jones, T. R. Hsu, R. Fang, A. Y. Kuo, W. T. Chen

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 15-24, November 16–21, 1997

Paper No: IMECE1997-0495

DOI: https://doi.org/10.1115/IMECE1997-0495

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Topics: Fracture toughness, Design, Testing, Adhesion, Coating processes, Coatings, Composite building materials, Copper alloys, Databases, Fracture (Materials)

Proceedings Papers

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

J. M. Snodgrass, S.-Y. Kook, A. Kirtikar, R. H. Dauskardt

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 33-39, November 16–21, 1997

Paper No: IMECE1997-0497

DOI: https://doi.org/10.1115/IMECE1997-0497

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Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics

Proceedings Papers

Toughening of High Performance Epoxy Adhesives Using Core-Shell Particles

Hung-Jue Sue, P. Mac Puckett, Yee Y. Wang

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 163-168, November 16–21, 1997

Paper No: IMECE1997-0512

DOI: https://doi.org/10.1115/IMECE1997-0512

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Topics: Epoxy adhesives, Particulate matter, Shells, Rubber, Adhesives, Elastic moduli, Fracture toughness, Glass transition, Materials properties, Shear (Mechanics)

Proceedings Papers

The Mechanics of Hydride Formation and Embrittlement

J. Lufrano, P. Sofronis, H. K. Birnbaum

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 261-271, November 16–21, 1997

Paper No: IMECE1997-0542

DOI: https://doi.org/10.1115/IMECE1997-0542

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Topics: Deformation, Density, Diffusion (Physics), Embrittlement, Finite element analysis, Fracture (Materials), Fracture toughness, Hydrogen, Plane strain, Precipitation

Proceedings Papers

Process Zone of Polycrystalline Alumina

D. K. Tran, A. S. Kobayashi, K. W. White

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 361-364, November 16–21, 1997

Paper No: IMECE1997-0684

DOI: https://doi.org/10.1115/IMECE1997-0684

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Topics: Cantilever beams, Ceramic composites, Ceramics, Density, Fibers, Fracture (Materials), Fracture toughness

Proceedings Papers

Self-Healing Composites Using Embedded Microspheres

D. Jung, A. Hegeman, N. R. Sottos, P. H. Geubelle, S. R. White

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 265-275, November 16–21, 1997

Paper No: IMECE1997-0673

DOI: https://doi.org/10.1115/IMECE1997-0673

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Topics: Composite materials, Fracture (Materials), Maintenance, Fracture toughness, Polyester fabrics, Adhesion, Cantilever beams, Elastic moduli, Molecular weight, Resins

Proceedings Papers

Effects of Stress Concentrations at the Slipping Fiber/Matrix Interface on Tensile Strength of Ceramic Matrix Composites

B. K. Ahn, W. A. Curtin

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 373, November 16–21, 1997

Paper No: IMECE1997-0686

DOI: https://doi.org/10.1115/IMECE1997-0686

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Topics: Ceramic matrix composites, Fibers, Stress, Tensile strength, Composite materials, Fracture (Materials), Brittleness, Fracture toughness, Approximation, Damage

Proceedings Papers

Raman Investigation and Mechanical Behavior of Zirconia

George G. Gogotsi

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 433-440, November 16–21, 1997

Paper No: IMECE1997-0697

DOI: https://doi.org/10.1115/IMECE1997-0697

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Topics: Ceramics, Crystals, Fracture (Materials), Fracture (Process), Fracture toughness, Low temperature, Mechanical behavior, Micromechanical devices, Microprobe analysis, Phase transitions

Proceedings Papers

Toughness Enhancement in Blends of Dissimilar Polymers Due to the In-Situ Formation by Chaotic Mixing of Fine-Scale Extended Structures at Low Minor Phase Concentrations

Y. H. Liu, D. A. Zumbrunnen

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 301-318, November 16–21, 1997

Paper No: IMECE1997-0677

DOI: https://doi.org/10.1115/IMECE1997-0677

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Topics: Fracture toughness, Polymers, Impact testing, Cavities, Drops, Fracture (Materials), Fracture (Process), Low density polyethylene, Polymer blends, Scanning electron microscopy

Proceedings Papers

Damage Development, Toughening, and the Design and Performance of Ceramic Composite Systems

Ronald J. Kerans

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 187-188, November 16–21, 1997

Paper No: IMECE1997-0663

DOI: https://doi.org/10.1115/IMECE1997-0663

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Topics: Ceramic composites, Damage, Design, Coating processes, Coatings, Brittleness, Composite materials, Fibers, Fracture (Materials), Fracture toughness

Proceedings Papers

Effects of PVD Coatings on Thermal Fatigue Resistance of Hot-Work Tool Steels

Yucong Wang

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 351-355, November 16–21, 1997

Paper No: IMECE1997-0682

DOI: https://doi.org/10.1115/IMECE1997-0682

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Topics: Coatings, Fatigue, Tool steel, Die casting (Process), Die castings (Product), Aluminum, Casting, Corrosion, Corrosion resistance, Erosion

2 3 4 5

NARROW

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Preliminary Results of Laser-Assisted Cleaning of Alumina Coated Carbide Tool Inserts

Microstructural Effects on the Machining Performance of Dental Ceramics

Measurement of Solder-Copper Interfacial Fracture Parameters Using u 2 -Displacement Fields

Advances in Tensile Testing of Polysilicon Thin Films

A Fracture Toughness Test of Bone-Biomaterial Interfaces Under Mixed Mode Loading Conditions

Friction Properties at Polyethylene-Metal Interface in Total Joint Arthroplasty

Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load

Interfacial Fracture Toughness in Plastic Packages

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

Toughening of High Performance Epoxy Adhesives Using Core-Shell Particles

The Mechanics of Hydride Formation and Embrittlement

Process Zone of Polycrystalline Alumina

Self-Healing Composites Using Embedded Microspheres

Effects of Stress Concentrations at the Slipping Fiber/Matrix Interface on Tensile Strength of Ceramic Matrix Composites

Raman Investigation and Mechanical Behavior of Zirconia

Toughness Enhancement in Blends of Dissimilar Polymers Due to the In-Situ Formation by Chaotic Mixing of Fine-Scale Extended Structures at Low Minor Phase Concentrations

Damage Development, Toughening, and the Design and Performance of Ceramic Composite Systems

Effects of PVD Coatings on Thermal Fatigue Resistance of Hot-Work Tool Steels

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