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Proceedings Papers

Liner/Shell Load Transfer Mechanisms in a Modular Acetabular Component for Total Hip Replacement

Steven M. Kurtz, Jorge A. Ochoa, Christopher V. White
Proc. ASME. IMECE97, Advances in Bioengineering, 303-304, November 16–21, 1997
Paper No: IMECE1997-0349
DOI: https://doi.org/10.1115/IMECE1997-0349
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Topics: Hip joint prostheses, Shells, Stress, Metals, Design, Manufacturing
Proceedings Papers

Direct Integration of Haptic User Interface in CAD Systems

Paul Stewart, Yifan Chen, Pietro Buttolo
Proc. ASME. IMECE97, Dynamic Systems and Control, 93-99, November 16–21, 1997
Paper No: IMECE1997-0382
DOI: https://doi.org/10.1115/IMECE1997-0382
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Topics: Computer-aided design, Haptics, User interfaces, Product development, Automotive industry, Design, Engineering prototypes, Manufacturing, Numerical analysis, Product design
Proceedings Papers

Sequential Processing Mechanics Modeling for a Model IC Package

Jianjun Wang, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 401-410, November 16–21, 1997
Paper No: IMECE1997-1117
DOI: https://doi.org/10.1115/IMECE1997-1117
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Topics: Modeling, Stress, Manufacturing, Solders, Temperature, Finite element analysis, Finite element methods, Finite element model, Silicon chips, Bonding
Proceedings Papers

Automated Modular Fixture Planning: Accuracy, Clamping, and Accessibility Analysis

Yufeng Wu, Yiming (Kevin) Rong, Weidong Ma, Steven R. LeClair
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 221-227, November 16–21, 1997
Paper No: IMECE1997-1156
DOI: https://doi.org/10.1115/IMECE1997-1156
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Topics: Clamps (Tools), Computer-aided design, Design, Fixturing, Manufacturing, Production planning, Stability
Proceedings Papers

Chip Formation When Hard Turning Steel

Amitabh Vyas, Milton C. Shaw
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 21-28, November 16–21, 1997
Paper No: IMECE1997-1131
DOI: https://doi.org/10.1115/IMECE1997-1131
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Topics: Steel, Turning, Machining, Grinding, Boron, Ceramics, Finishes, Fracture (Materials), Fracture (Process), Hard materials
Proceedings Papers

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Ji Li, Imin Kao, Vish Prasad
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 439-446, November 16–21, 1997
Paper No: IMECE1997-1121
DOI: https://doi.org/10.1115/IMECE1997-1121
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Topics: Modeling, Semiconductor wafers, Stress, Particulate matter, Wire, Cutting, Silicon, Abrasives, Fracture (Materials), Slurries
Proceedings Papers

Forward and Inverse Kinematic Solutions of a New Three Dimensional Metrology Frame

Dale E. Schinstock, James F. Cuttino
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 435-441, November 16–21, 1997
Paper No: IMECE1997-1182
DOI: https://doi.org/10.1115/IMECE1997-1182
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Topics: Dimensional metrology, Kinematics, Manufacturing, Calibration, Errors, Geometry, Metrology
Proceedings Papers

A Study on the Dynamics of Toolholders

Joseph Jouraij, Ruxu Du, Juhchin A. Yang
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 297-304, November 16–21, 1997
Paper No: IMECE1997-1165
DOI: https://doi.org/10.1115/IMECE1997-1165
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Topics: Dynamics (Mechanics), Errors, Manufacturing, Vibration, Design, Finite element analysis, Machinery, Modal analysis, Modeling, Simulation
Proceedings Papers

Flexible Monitoring Strategies for Milling Operations

Fritz Klocke, Martin Reuber, Michael Rehse
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 83-90, November 16–21, 1997
Paper No: IMECE1997-1079
DOI: https://doi.org/10.1115/IMECE1997-1079
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Topics: Milling, Machining, Drilling, Evaluation methods, Manufacturing, Process monitoring
Proceedings Papers

Multi-Media Developments for a Laser Processing Curriculum

Elijah Kannatey-Asibu, Jr.
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 455-459, November 16–21, 1997
Paper No: IMECE1997-1123
DOI: https://doi.org/10.1115/IMECE1997-1123
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Topics: Lasers, Multimedia, Laser materials processing, Computer simulation, Manufacturing, Modeling
Proceedings Papers

A Review of Changes and Trends Affecting Military Electronics Manufacturing

Anthony J. Rafanelli
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 447-451, November 16–21, 1997
Paper No: IMECE1997-1122
DOI: https://doi.org/10.1115/IMECE1997-1122
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Topics: Electronics, Manufacturing, Military systems, Defense industry, Aerospace industry, Coatings, Design, Proton exchange membranes, US Department of Defense
Proceedings Papers

Manufacturing Processes Course With Emphasis on Modeling, Experimentation, and Design

James C. Moller
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 487-491, November 16–21, 1997
Paper No: IMECE1997-1128
DOI: https://doi.org/10.1115/IMECE1997-1128
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Topics: Design, Manufacturing, Modeling, Design for Manufacturing, Manufacturing engineering, Process design, Students, Teams
Proceedings Papers

Manufacturing Engineering Education Through Industry/University Cooperative Research: Issues, Challenges, and Strategies

Jay Lee
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 465-469, November 16–21, 1997
Paper No: IMECE1997-1125
DOI: https://doi.org/10.1115/IMECE1997-1125
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Topics: Education, Manufacturing engineering, Manufacturing, Collaboration, Engineers, Innovation
Proceedings Papers

Interactive Tutorials on Manufacturing Processes Using Java™

Barney E. Klamecki
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 461-464, November 16–21, 1997
Paper No: IMECE1997-1124
DOI: https://doi.org/10.1115/IMECE1997-1124
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Topics: Manufacturing, Computers, Computer software, Machining
Proceedings Papers

Applications of Digital Correlation Method to Microscopic Strain Measurement and Materials’ Property Characterization

H. Lu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 423-428, November 16–21, 1997
Paper No: IMECE1997-1119
DOI: https://doi.org/10.1115/IMECE1997-1119
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Topics: Hardware, Manufacturing, Reliability, Resolution (Optics), Strain measurement
Proceedings Papers

Investigation of the Lead-On-Chip Package’s Reliability

P.-H. Tsao, L. C. Chang, T. C. Chen, Chender Haung, C. Z. Chen
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 347-351, November 16–21, 1997
Paper No: IMECE1997-1109
DOI: https://doi.org/10.1115/IMECE1997-1109
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Topics: Reliability, Epoxy adhesives, Epoxy resins, Silicon chips, Crack propagation, Failure mechanisms, Finite element analysis, Fracture (Materials), Manufacturing, Molding
Proceedings Papers

Teaching Manufacturing and Design for Manufacturability to Mechanical Engineering Students

Steven M. Nesbit, Jess J. Comer
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 479-485, November 16–21, 1997
Paper No: IMECE1997-1127
DOI: https://doi.org/10.1115/IMECE1997-1127
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Topics: Design for Manufacturing, Manufacturing, Mechanical engineering, Students, Teaching, Design, Design engineering, Engineering design
Proceedings Papers

Video Based Manufacturing Courses for Electronics

John A. Fillo, Chittaranjan Sahay, Krishnaswami Srihari
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 471-477, November 16–21, 1997
Paper No: IMECE1997-1126
DOI: https://doi.org/10.1115/IMECE1997-1126
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Topics: Electronics, Manufacturing, Defense industry, Packaging, Students, Wire
Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997
Paper No: IMECE1997-1221
DOI: https://doi.org/10.1115/IMECE1997-1221
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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards
Proceedings Papers

Hydrostatic Response of Piezoresistive Stress Sensors

Y. Kang, A. K. M. Mian, J. C. Suhling, R. C. Jaeger
Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 29-36, November 16–21, 1997
Paper No: IMECE1997-1224
DOI: https://doi.org/10.1115/IMECE1997-1224
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Topics: Hydrostatics, Sensors, Stress, Hydrostatic testing, Resistors, Calibration, Manufacturing, Pressure, Pressure vessels, Semiconductor wafers