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Proceedings Papers

Analysis of Instability and Self-Excited Vibration for Collapsible Tube by Distributed Parameter Model

Satoru Hayashi, Toshiyuki Hayase, Yuji Miura

Proc. ASME. IMECE97, Advances in Bioengineering, 105-106, November 16–21, 1997

Paper No: IMECE1997-0250

DOI: https://doi.org/10.1115/IMECE1997-0250

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Topics: Distributed parameter models, Vibration, Stability, Circuits, Differential equations, Eigenvalues, Flow (Dynamics), Flow separation, Nonlinear equations, Resistors

Proceedings Papers

Nanoscale Thermometry Using Scanning Joule Expansion Microscopy

Arun Majumdar, John Varesi

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 171-179, November 16–21, 1997

Paper No: IMECE1997-0955

DOI: https://doi.org/10.1115/IMECE1997-0955

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Topics: Joules, Microscopy, Nanoscale phenomena, Temperature measurement, Atomic force microscopy, Imaging, Metals, Resolution (Optics), Signals, Temperature distribution

Proceedings Papers

Vibration Control via Active-Passive Hybrid Piezoelectric Network With Variable Resistance

Ronald A. Morgan, K. W. Wang

Proc. ASME. IMECE97, Adaptive Structures and Material Systems, 195-203, November 16–21, 1997

Paper No: IMECE1997-0193

DOI: https://doi.org/10.1115/IMECE1997-0193

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Topics: Design methodology, Feedback, Passive damping, Resistors, Vibration control, Vibration suppression

Proceedings Papers

Hydrostatic Response of Piezoresistive Stress Sensors

Y. Kang, A. K. M. Mian, J. C. Suhling, R. C. Jaeger

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 29-36, November 16–21, 1997

Paper No: IMECE1997-1224

DOI: https://doi.org/10.1115/IMECE1997-1224

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Topics: Hydrostatics, Sensors, Stress, Hydrostatic testing, Resistors, Calibration, Manufacturing, Pressure, Pressure vessels, Semiconductor wafers

Proceedings Papers

Advances in Stress Test Chips

Richard C. Jaeger, Jeffrey C. Suhling

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 1-5, November 16–21, 1997

Paper No: IMECE1997-1220

DOI: https://doi.org/10.1115/IMECE1997-1220

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Topics: Stress, Sensors, Silicon, Circuits, Electronic packages, Energy dissipation, Integrated circuits, Operating temperature, Reliability, Resistors

Proceedings Papers

Evaluation of Die Stress Using van der Pauw Sensors

A. K. M. Mian, J. C. Suhling, R. C. Jaeger, B. M. Wilamowski

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 59-67, November 16–21, 1997

Paper No: IMECE1997-1228

DOI: https://doi.org/10.1115/IMECE1997-1228

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Topics: Sensors, Stress, Resistors, Silicon, Anisotropy, Electronic packaging, Heat conduction, Semiconductor wafers, Simulation results, Temperature

Proceedings Papers

Ceramic Tape-Based Meso Systems Technology

Haim H. Bau, Suresh G. K. Ananthasuresh, Jorge J. Santiago-Avilés, Jihua Zhong, Moon Kim, Mingqiang Yi, Patricio Espinoza-Vallejos, Luis Sola-Laguna

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 491-498, November 15–20, 1998

Paper No: IMECE1998-1290

DOI: https://doi.org/10.1115/IMECE1998-1290

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Topics: Ceramics, Glass, Manufacturing, Silicon, Binders (Materials), Firing, Flow (Dynamics), Lamination, Low temperature, Microelectromechanical systems

Proceedings Papers

Numerical Simulation and Design of the Four-Terminal Piezoresistive Pressure Transducer

Chahid K. Ghaddar, Mark G. da Silva, John R. Gilbert, Stephen F. Bart

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 329-334, November 15–20, 1998

Paper No: IMECE1998-1263

DOI: https://doi.org/10.1115/IMECE1998-1263

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Topics: Computer simulation, Design, Pressure transducers, Resistors, Diaphragms (Mechanical devices), Diaphragms (Structural), Bridges (Structures), Sensors, Dimensions, Pressure sensors

Proceedings Papers

On the Modeling of the Wheatstone-Bridge Piezoresistive Pressure Sensor: A Finite-Element-Based Approach

Chahid K. Ghaddar, John R. Gilbert

Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 195-200, November 14–19, 1999

Paper No: IMECE1999-0267

DOI: https://doi.org/10.1115/IMECE1999-0267

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Topics: Bridges (Structures), Modeling, Pressure sensors, Resistors, Design, Diaphragms (Mechanical devices), Diaphragms (Structural), Diffusion (Physics), Dimensions, Engineering simulation

Proceedings Papers

A Thermal Cycler Fabricated With Low Temperature, Co-Fired Ceramic Tapes

Jihua Zhong, Mingqiang Yi, Haim H. Bau

Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 123-128, November 14–19, 1999

Paper No: IMECE1999-0256

DOI: https://doi.org/10.1115/IMECE1999-0256

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Topics: Ceramics, Low temperature, Temperature, Chain, DNA, Electrophoresis, Flow (Dynamics), Joules, Resistors, Separation (Technology)

Proceedings Papers

Vibration Control Using Piezoelectric Material With High Order Nonlinearity

J. Tang, K. W. Wang

Proc. ASME. IMECE99, Adaptive Structures and Material Systems, 149-160, November 14–19, 1999

Paper No: IMECE1999-0539

DOI: https://doi.org/10.1115/IMECE1999-0539

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Topics: Piezoelectric materials, Vibration control, Actuators, Algorithms, Electric fields, Inductors, Piezoelectric actuators, Resistors, Sliding mode control

Proceedings Papers

Pirani Pressure Sensor With Distributed Temperature Sensing

J. J. van Baar, R. J. Wiegerink, T. S. J. Lammerink, G. J. M. Krijnen, M. Elwenspoek

Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 115-122, November 11–16, 2001

Paper No: IMECE2001/MEMS-23817

DOI: https://doi.org/10.1115/IMECE2001/MEMS-23817

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Topics: Microelectromechanical systems, Pressure sensors, Temperature, Microbeams, Pressure, Temperature distribution, Thermal conductivity, Heat losses, Heat sinks, Resistors

Proceedings Papers

Optimization of Sulfur Sublimators Used in the Colombian Flower Industry

José Ignacio Huertas, Julián D. Rodríguez

Proc. ASME. IMECE2001, Advanced Energy Systems, 523-528, November 11–16, 2001

Paper No: IMECE2001/AES-23662

DOI: https://doi.org/10.1115/IMECE2001/AES-23662

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Topics: Optimization, Sulfur, Temperature, Evaporation, Geometry, Thermal efficiency, Air flow, Diseases, Engineering prototypes, Glass jars

Proceedings Papers

Applications of a Microfluidic Amplifier As a Bi-Stable Device in an Oxygen Delivery System

Narciso F. Macia

Proc. ASME. IMECE2001, Advances in Bioengineering, 219-220, November 11–16, 2001

Paper No: IMECE2001/BED-23109

DOI: https://doi.org/10.1115/IMECE2001/BED-23109

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Topics: Microfluidics, Oxygen, Fluids, Army, Diamonds, Feedback, Resistors

Proceedings Papers

Key Parameters Affecting Solder Joint Life of Chip Resistors and Chip Capacitors Mounted on Insulated Metal Substrate

Nicoletta Sangalli, Donald B. Barker

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 35-41, November 5–10, 2000

Paper No: IMECE2000-2244

DOI: https://doi.org/10.1115/IMECE2000-2244

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Topics: Capacitors, Metals, Resistors, Solder joints, Finite element analysis, Aluminum, Ceramics, Energy dissipation, Heat, Temperature

Proceedings Papers

Powertrain Modeling With Modelica

Michael Tiller, Cleon Davis, Hubertus Tummescheit, Nizar Trigui

Proc. ASME. IMECE2000, Dynamic Systems and Control: Volume 1, 591-598, November 5–10, 2000

Paper No: IMECE2000-2352

DOI: https://doi.org/10.1115/IMECE2000-2352

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Topics: Modeling, Valves, Combustion gases, Design, Dynamics (Mechanics), Engineering disciplines, Engineering systems and industry applications, Hardware, Model development, Resistors

Proceedings Papers

Thermal Characteristics of a Compact, Passive Thermal Energy Storage Device

Candice A. Bauer, R. A. Wirtz

Proc. ASME. IMECE2000, Heat Transfer: Volume 1, 283-289, November 5–10, 2000

Paper No: IMECE2000-1395

DOI: https://doi.org/10.1115/IMECE2000-1395

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Topics: Aluminum, Composite materials, Flat plates, Flow (Dynamics), Heat, Latent heat, Metals, Resistors, Storage, Thermal conductivity

Proceedings Papers

Measurements of the Effect of Pressure on the Thermal Conductivity of Silica Aerogel Particles

Sachin S. Vakil, Bouvard Hosticka, Pamela M. Norris

Proc. ASME. IMECE2000, Heat Transfer: Volume 1, 275-281, November 5–10, 2000

Paper No: IMECE2000-1394

DOI: https://doi.org/10.1115/IMECE2000-1394

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Topics: Particulate matter, Pressure, Thermal conductivity, Heat, Resistors, Vacuum, Bombs, Flow (Dynamics), Glass, Heat transfer

Proceedings Papers

Measurements and Modeling of Two-Phase Flow in Microchannels With Nearly-Constant Heat Flux Boundary Conditions

Lian Zhang, Jae-Mo Koo, Linan Jiang, Shilajeet S. Banerjee, Mehdi Ashegi, Kenneth E. Goodson, Juan G. Santiago, Thomas W. Kenny

Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 129-135, November 5–10, 2000

Paper No: IMECE2000-1082

DOI: https://doi.org/10.1115/IMECE2000-1082

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Topics: Boundary-value problems, Heat flux, Microchannels, Modeling, Two-phase flow, Boiling, Dimensions, Flow (Dynamics), Silicon, Bubbles

Proceedings Papers

Switching of a Double-Comb Microactuator by Time-Lag Modulation and Electrical-Damping Control

Yijian Chen, Yashesh Shroff, William G. Oldham

Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 157-160, November 5–10, 2000

Paper No: IMECE2000-1086

DOI: https://doi.org/10.1115/IMECE2000-1086

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Topics: Damping, Microactuators, Transients (Dynamics), Computer simulation, Dynamics (Mechanics), Optimal control, Optimization, Resistors, Tradeoffs

2 3 4

NARROW

Analysis of Instability and Self-Excited Vibration for Collapsible Tube by Distributed Parameter Model

Nanoscale Thermometry Using Scanning Joule Expansion Microscopy

Vibration Control via Active-Passive Hybrid Piezoelectric Network With Variable Resistance

Hydrostatic Response of Piezoresistive Stress Sensors

Advances in Stress Test Chips

Evaluation of Die Stress Using van der Pauw Sensors

Ceramic Tape-Based Meso Systems Technology

Numerical Simulation and Design of the Four-Terminal Piezoresistive Pressure Transducer

On the Modeling of the Wheatstone-Bridge Piezoresistive Pressure Sensor: A Finite-Element-Based Approach

A Thermal Cycler Fabricated With Low Temperature, Co-Fired Ceramic Tapes

Vibration Control Using Piezoelectric Material With High Order Nonlinearity

Pirani Pressure Sensor With Distributed Temperature Sensing

Optimization of Sulfur Sublimators Used in the Colombian Flower Industry

Applications of a Microfluidic Amplifier As a Bi-Stable Device in an Oxygen Delivery System

Key Parameters Affecting Solder Joint Life of Chip Resistors and Chip Capacitors Mounted on Insulated Metal Substrate

Powertrain Modeling With Modelica

Thermal Characteristics of a Compact, Passive Thermal Energy Storage Device

Measurements of the Effect of Pressure on the Thermal Conductivity of Silica Aerogel Particles

Measurements and Modeling of Two-Phase Flow in Microchannels With Nearly-Constant Heat Flux Boundary Conditions

Switching of a Double-Comb Microactuator by Time-Lag Modulation and Electrical-Damping Control

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