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Proceedings Papers

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Ji Li, Imin Kao, Vish Prasad
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 439-446, November 16–21, 1997
Paper No: IMECE1997-1121
DOI: https://doi.org/10.1115/IMECE1997-1121
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Topics: Modeling, Semiconductor wafers, Stress, Particulate matter, Wire, Cutting, Silicon, Abrasives, Fracture (Materials), Slurries
Proceedings Papers

Machinability of Graphitic Silicon Carbide Aluminum Metal Matrix Composite GrA-Ni™

V. Songmene, T. F. Stephenson, A. E. M. Warner
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 193-200, November 16–21, 1997
Paper No: IMECE1997-1152
DOI: https://doi.org/10.1115/IMECE1997-1152
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Topics: Aluminum, Composite materials, Machinability, Silicon, Particulate matter, Graphite, Cutting, Metal matrix composites, Nickel, Cast iron
Proceedings Papers

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Jianjun Wang, Daqing Zou, Sheng Liu
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 411-421, November 16–21, 1997
Paper No: IMECE1997-1118
DOI: https://doi.org/10.1115/IMECE1997-1118
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Topics: Fracture toughness, Fracture (Materials), Temperature, Stress, Displacement, Finite element analysis, Interferometry, Molding, Silicon, Density
Proceedings Papers

Failure Mechanism of Metallization Layer of a Multichip Module Substrate

Mansur Rastani
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 469-475, November 16–21, 1997
Paper No: IMECE1997-0703
DOI: https://doi.org/10.1115/IMECE1997-0703
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Topics: Failure mechanisms, Multi-chip modules, Silicon, Temperature, Aluminum, Failure, Fatigue, Fatigue life, Finite element analysis, Metals
Proceedings Papers

Microstructural Optimization of a Functionally Gradient Layer

Joseph C. Nadeau, Mauro Ferrari
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 3-10, November 16–21, 1997
Paper No: IMECE1997-0645
DOI: https://doi.org/10.1115/IMECE1997-0645
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Topics: Optimization, Composite materials, Aluminum, Coating processes, Coatings, Flamelet generated manifold, Functionally graded materials, Silicon, Temperature gradient
Proceedings Papers

In Situ Observation and Modeling of Damage Modes in Cross-Ply Ceramic Matrix Composites

Ran Y. Kim, G. P. Tandon
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 447-454, November 16–21, 1997
Paper No: IMECE1997-0699
DOI: https://doi.org/10.1115/IMECE1997-0699
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Topics: Ceramic matrix composites, Damage, Modeling, Composite materials, Laminates, Stress, Ceramics, Failure, Fibers, Bonding
Proceedings Papers

Novel Processes for Fabricating Ceramic Composites and Future Outlook for Markets and Applications

Laurel M. Sheppard
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 347-349, November 16–21, 1997
Paper No: IMECE1997-0681
DOI: https://doi.org/10.1115/IMECE1997-0681
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Topics: Ceramic composites, Ceramic fibers, Ceramic matrix composites, Ceramics, Cutting tools, Extruding, Fibers, Gas turbines, Glass, Heat exchangers
Proceedings Papers

Cyclic Fatigue and Resistance-Curve Toughening in In Situ Toughened Silicon Carbide at Ambient to Elevated Temperatures

C. J. Gilbert, R. O. Ritchie
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 393-398, November 16–21, 1997
Paper No: IMECE1997-0690
DOI: https://doi.org/10.1115/IMECE1997-0690
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Topics: Ceramics, Fatigue, Fracture (Materials), Silicon, Stress, Temperature, Wakes
Proceedings Papers

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, E. Suhir, G. W. Kammlott
Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 171-206, November 16–21, 1997
Paper No: IMECE1997-0819
DOI: https://doi.org/10.1115/IMECE1997-0819
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Topics: Composite materials, Molding, Thermoelasticity, Fillers (Materials), Thermal stresses, Epoxy adhesives, Epoxy resins, Design, Integrated circuits, Reliability
Proceedings Papers

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

Shoji Kamiya, Hironori Takahashi, Masumi Saka, Hiroyuki Abé
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 169-174, November 16–21, 1997
Paper No: IMECE1997-0513
DOI: https://doi.org/10.1115/IMECE1997-0513
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Topics: Adhesives, Fracture (Materials), Fracture (Process), Particulate matter, Synthetic diamonds, Chemical vapor deposition, Diamond films, Nucleation (Physics), Stress, Electronics
Proceedings Papers

Die Strength Evaluation in the Presence of Edge Cracks

Betty Leung, Yifan Guo, Vijay Sarihan
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 125-131, November 16–21, 1997
Paper No: IMECE1997-0507
DOI: https://doi.org/10.1115/IMECE1997-0507
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Topics: Fracture (Materials), Reliability, Stress, Testing, Failure analysis, Finite element analysis, Manufacturing, Silicon
Proceedings Papers

Fracture and Damage Evaluation in Chip Scale Packages and Flip-Chip-Assemblies by FEA and MicroDAC

Jürgen Auersperg, Andreas Schubert, Dietmar Vogel, Bernd Michel, Herbert Reichl
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 133-138, November 16–21, 1997
Paper No: IMECE1997-0508
DOI: https://doi.org/10.1115/IMECE1997-0508
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Topics: Damage, Finite element analysis, Flip-chip assemblies, Fracture (Materials), Fracture (Process), Solders, Reliability, Simulation, Thermomechanics, Delamination
Proceedings Papers

Comparison of Acoustic Microscope, X-Ray Radiography, Dye Penetrant and Destructive Physical Analysis Data for Die Attachment Analysis

Duane A. Gilmour, James F. Reilly, Donald W. Calabrese
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 175-181, November 16–21, 1997
Paper No: IMECE1997-0514
DOI: https://doi.org/10.1115/IMECE1997-0514
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Topics: Acoustics, Microscopes, X-rays, Microscopy, Silicon, Adhesion, Energy dissipation, Testing, Delamination, Density
Proceedings Papers

Adhesion and Reliability of Polymer/Inorganic Interfaces in Microelectronic Applications

J. M. Snodgrass, S.-Y. Kook, A. Kirtikar, R. H. Dauskardt
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 33-39, November 16–21, 1997
Paper No: IMECE1997-0497
DOI: https://doi.org/10.1115/IMECE1997-0497
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Topics: Adhesion, Polymers, Reliability, Fracture (Materials), Fracture (Process), Fatigue, Fracture toughness, Cycles, Deformation, Fracture mechanics
Proceedings Papers

Optimization of the Silicon/PZT Longitudinal Mode Resonant Transducer

Amit Lai, Richard M. White
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 61-67, November 16–21, 1997
Paper No: IMECE1997-0940
DOI: https://doi.org/10.1115/IMECE1997-0940
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Topics: Optimization, Resonance, Silicon, Transducers, Laminates, Metals, Q-factor, Titanium alloys, Ultrasonic transducers
Proceedings Papers

Micromachined RF Signal Switching Devices on High Resistivity Silicon Substrates

Zhimin J. Yao, Chuck Goldsmith, Susan Eshelman, David Denniston
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 69-73, November 16–21, 1997
Paper No: IMECE1997-0941
DOI: https://doi.org/10.1115/IMECE1997-0941
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Topics: Cantilevers, Design, Electrical resistivity, Manufacturing, Membranes, Metals, Micromachining, Microwaves, Signals, Silicon
Proceedings Papers

High Resolution Single Crystal Silicon Accelerometer Using Silicon Fusion Bonding and Deep Reactive Ion Etching

B. P. van Drieënhuizen, N. I. Maluf
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 9-12, November 16–21, 1997
Paper No: IMECE1997-0931
DOI: https://doi.org/10.1115/IMECE1997-0931
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Topics: Accelerometers, Bonding, Crystals, Reactive-ion etching, Resolution (Optics), Silicon, Noise (Sound), Complementary metal oxide semiconductors, Brownian motion, Electronics
Proceedings Papers

A High-Sensitivity Micromachined Accelerometer Based on Electron Tunneling Transducers

C. H. Liu, J. K. Reynolds, A. Partridge, J. D. Grade, A. M. Barzilai, T. W. Kenny, H. K. Rockstad
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 13-20, November 16–21, 1997
Paper No: IMECE1997-0932
DOI: https://doi.org/10.1115/IMECE1997-0932
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Topics: Accelerometers, Electrons, Micromachining, Transducers, Tunnel construction, Resonance, Silicon, Acoustics, Design, Manufacturing
Proceedings Papers

Strength and Fracture of Micromachined Silicon Structures

Wan Suwito, Martin L. Dunn, Shawn J. Cunningham
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 99-104, November 16–21, 1997
Paper No: IMECE1997-0946
DOI: https://doi.org/10.1115/IMECE1997-0946
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Topics: Fracture (Materials), Fracture (Process), Micromachining, Silicon, Corners (Structural elements), Design, Anisotropy, Chemical etching, Crystals, Manufacturing
Proceedings Papers

Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films

Y. Sungtaek Ju, Kenneth E. Goodson
Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 181-190, November 16–21, 1997
Paper No: IMECE1997-0956
DOI: https://doi.org/10.1115/IMECE1997-0956
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Topics: Heat conduction, Phonons, Semiconductor films, Size effect, Thermal conductivity, Semiconductors (Materials), Silicon, Electromagnetic scattering, Radiation scattering, Scattering (Physics)