Topics: Simulation, Solidification, Plasmas (Ionized gases), Wire, Microelectronic packaging, Collisions (Physics), Electric discharge, Energy budget (Physics), Finite volume methods, Flames

Topics: Aluminum, Copper, High temperature, Reliability, Storage, Wire, Failure, Temperature, Damage, Intermetallic compounds

Topics: Solder joints, Copper, Tin, Annealing, Intermetallic compounds, Nickel, Brittleness, Finishes, Plating, Printed circuit boards

Topics: Computation, Computer simulation, Contact resistance, Dimensions, Heat conduction, Silicon, Solders, Steady state, Temperature, Wire bonding

Topics: Design, Electronic components, Fatigue life, Fatigue strength, Manufacturing, Reliability, Shapes, Stress, Temperature, Thermal expansion

Topics: Filters, Liquid crystalline polymers, Transmission lines, Waves, Manufacturing, Strip transmission lines, Bonding, Millimeter waves, Wire, Wire bonding

Topics: High temperature, Wire, Reliability, Stress, Wire bonding, Aluminum, Copper, Delays, Heat, Materials properties

Topics: Artificial neural networks, Flames, Taguchi methods, Wire, Electrodes, Errors, Wire bonding

Topics: Elevators, Failure, Failure mechanisms, Fatigue, Gates (Closures), Heating, Locomotives, Packaging, Railroads, Reliability

Topics: Film boiling, Micromachining, Microscale devices, Temperature sensors, Thermocouples, Metals, Boiling, Manufacturing, Copper, Design

Topics: Actuators, Sensors, Wire bonding

Topics: Manufacturing, Microoptoelectromechanical systems, Packaging, Lasers, Machinery, Microassembling, Reflow soldering, Robotics, Sealing (Process), Wire bonding

Topics: Complementary metal oxide semiconductors, Packaging, Manufacturing, Microchannels, Microfluidics, Epoxy resins, Micronozzles, Microscale devices, Reservoirs, Robotics