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Proceedings Papers

Isothermalization of an IGBT Power Electronic Chip

Peng Wang, F. Patrick McCluskey, Avram Bar-Cohen
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 5-15, November 12–18, 2010
Paper No: IMECE2010-41019
DOI: https://doi.org/10.1115/IMECE2010-41019
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Topics: Cooling, Cooling systems, Design, Electronics, Flux (Metallurgy), Heat, Heat flux, Heat sinks, Hybrid electric vehicles, Microchannels
Proceedings Papers

A Reliability Study of a Novel Type of Solder-Less Interconnection

Raymond T. Lueg, James W. Rose, James E. Simpson
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 463-468, November 12–18, 2010
Paper No: IMECE2010-37680
DOI: https://doi.org/10.1115/IMECE2010-37680
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Topics: Reliability, Solders, Adhesives, Metals, Cycles, Temperature, Adhesion, Anisotropy, Bonding, Displacement
Proceedings Papers

Effects of Solder Wetting on Self-Alignment Accuracy and Modeling for Optoelectronics Assembly

Ming Kong, Sungeun Jeon, Chiwon Hwang, Y. C. Lee
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 317-324, November 12–18, 2010
Paper No: IMECE2010-37181
DOI: https://doi.org/10.1115/IMECE2010-37181
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Topics: Manufacturing, Modeling, Optoelectronic devices, Solders, Wetting
Proceedings Papers

Effect of Thermal Characteristics of Electronic Enclosures on Dynamic Data Center Performance

Mahmoud Ibrahim, Siddharth Bhopte, Bahgat Sammakia, Bruce Murray, Madhusudan Iyengar, Roger Schmidt
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 411-420, November 12–18, 2010
Paper No: IMECE2010-40914
DOI: https://doi.org/10.1115/IMECE2010-40914
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Topics: Data centers, Temperature, Buoyancy, Computer simulation, Computers, Air conditioning, Boundary-value problems, Computational fluid dynamics, Cooling, Dynamics (Mechanics)
Proceedings Papers

Conjugate Effect of Hygro and Thermo-Mechanical Behavior in MEMS Packages

Seungbae Park, Jae Kwak, Haojun Zhang, Xin Zhang, Siu-Lung Ng
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 365-373, November 12–18, 2010
Paper No: IMECE2010-39756
DOI: https://doi.org/10.1115/IMECE2010-39756
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Topics: MEMS packages, Thermomechanics, Temperature, Stress, Weight (Mass), Curve fitting, Diffusion (Physics), High temperature, Numerical analysis, Warping
Proceedings Papers

Characteristic Analysis of Anti-Reflective Subwavelength Cross Gratings Fabricated With Holographic Technique

Fengmei Zhao, Xiangsu Zhang, Shou Liu, Xuechang Ren
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 1-4, November 12–18, 2010
Paper No: IMECE2010-37974
DOI: https://doi.org/10.1115/IMECE2010-37974
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Topics: Diffraction gratings, Reflection, Refractive index
Proceedings Papers

Thermoelectric Coolers for Thermal Gradient Management on Chip

Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay, Satish Kumar
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 187-195, November 12–18, 2010
Paper No: IMECE2010-38184
DOI: https://doi.org/10.1115/IMECE2010-38184
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Topics: Temperature gradient, Thermoelectric coolers, Cooling, Temperature, Transients (Dynamics), Electronic packages, Flat heat pipes, Shapes
Proceedings Papers

Optimization of Natural Air Cooling in a Vertical Channel of Electronic Equipment

Yasushi Nishino, Masaru Ishizuka, Tomoyuki Hatakeyama, Shinji Nakagawa
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 145-153, November 12–18, 2010
Paper No: IMECE2010-37028
DOI: https://doi.org/10.1115/IMECE2010-37028
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Topics: Cooling, Electronic equipment, Optimization, Clearances (Engineering), Copper, Computer simulation, Temperature, Air flow, Ducts, Natural convection
Proceedings Papers

Conjugate Mixed Convection With Surface Radiation and Substrate Conduction in Laminar Channel Flow With Discrete Flush-Mounted Heat Sources

Jing He, Anthony M. Jacobi
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 23-30, November 12–18, 2010
Paper No: IMECE2010-40471
DOI: https://doi.org/10.1115/IMECE2010-40471
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Topics: Channel flow, Heat, Heat conduction, Heat transfer, Mixed convection, Radiation (Physics)
Proceedings Papers

Organic Monolayers for Low Temperature Copper – Gold Bonding

X. F. Ang, H. J. Lu, J. Wei, H. J. Zhang, C. C. Wong
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 281-284, November 12–18, 2010
Paper No: IMECE2010-38552
DOI: https://doi.org/10.1115/IMECE2010-38552
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Topics: Bonding, Copper, Low temperature, Bond strength, Chain, Coating processes, Coatings, Temperature
Proceedings Papers

Laser Ultrasonic Inspection of Solder Bumps in Flip Chip Packages Using Virtual Package Device as Reference

I. Charles Ume, Jie Gong, Razid Ahmad, Abel Valdes
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 507-516, November 12–18, 2010
Paper No: IMECE2010-39970
DOI: https://doi.org/10.1115/IMECE2010-39970
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Topics: Flip-chip packages, Inspection, Lasers, Solders, Signals, Vibration, Flip-chip devices, Interferometers, Manufacturing industry, Silicon
Proceedings Papers

Thermal and Structural Response of Pin Fins for Different Interface Conditions

Abul Fazal M. Arif, Sulaman Pashah, Syed M. Zubair, M. Inam
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 375-384, November 12–18, 2010
Paper No: IMECE2010-39972
DOI: https://doi.org/10.1115/IMECE2010-39972
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Topics: Adhesives, Design, Electronic products, Energy dissipation, Finite element methods, Finite element model, Fins, Heat, Heat sinks, Heat transfer
Proceedings Papers

Thermally Based Design Optimization of Telecommunication Shelter

Venkata Naga Poornima Mynampati, Feroz Ahamed Iqbal Mariam, Bharathkrishnan Muralidharan, Abhilash Ramachandran Menon, Dereje Agonafer, Mark Hendrix
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 421-426, November 12–18, 2010
Paper No: IMECE2010-40949
DOI: https://doi.org/10.1115/IMECE2010-40949
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Topics: Design, Optimization, Telecommunications, Temperature, Computational fluid dynamics, Electronics, Heat, HVAC equipment, Modular construction, Thermal analysis
Proceedings Papers

Interfacial Delamination Between Through Silicon Vias (TSVs) and Silicon Matrix

Kuan Hsun Lu, Suk-Kyu Ryu, Qiu Zhao, Rui Huang, Paul S. Ho
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 105-112, November 12–18, 2010
Paper No: IMECE2010-40015
DOI: https://doi.org/10.1115/IMECE2010-40015
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Topics: Delamination, Silicon, Fracture (Materials), Cycles, Finite element analysis, Reliability, Steady state, Cooling, Heating, Metals
Proceedings Papers

Health Monitoring Method for Load Assessment and Cooling Performance Degradation of Printed Circuit Boards

Kenji Hirohata, Katsumi Hisano, Yousuke Hisakuni, Takahiro Omori, Minoru Mukai
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 469-478, November 12–18, 2010
Paper No: IMECE2010-37988
DOI: https://doi.org/10.1115/IMECE2010-37988
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Topics: Cooling, Printed circuit boards, Stress, Temperature, Computer-aided engineering, Deformation, Electronic equipment, Reliability, Design, Design methodology
Proceedings Papers

Modeling of Two-Phase Micro-Channel Flow for Thermal Management of Electronic Systems

Siyi Zhou, Bahgat G. Sammakia
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 325-333, November 12–18, 2010
Paper No: IMECE2010-37219
DOI: https://doi.org/10.1115/IMECE2010-37219
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Topics: Boiling, Bubbles, Bubbly flow, Cavities, Circuits, Computer software, Critical heat flux, Electronic systems, Flow (Dynamics), Fluctuations (Physics)
Proceedings Papers

Design, Modeling, and Optimization for Highly Efficient Ionic Wind-Based Cooling Microfabricated Devices

Andojo Ongkodjojo, Alexis R. Abramson, Norman C. Tien
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 235-244, November 12–18, 2010
Paper No: IMECE2010-40427
DOI: https://doi.org/10.1115/IMECE2010-40427
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Topics: Cooling, Corona discharge, Design, Electrohydrodynamics, Heat, Modeling, Optimization, Pumps, Wind
Proceedings Papers

Multiscale Thermal Transport Across Solid-Solid Interfaces

Ganesh Balasubramanian, Ravi Kappiyoor, Ishwar K. Puri
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 197-201, November 12–18, 2010
Paper No: IMECE2010-38766
DOI: https://doi.org/10.1115/IMECE2010-38766
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Topics: Boundary-value problems, Electromagnetic scattering, Flux (Metallurgy), Hydrodynamics, Molecular dynamics, Molecular dynamics simulation, Particulate matter, Phonons, Radiation scattering, Scattering (Physics)
Proceedings Papers

Heat Transfer Enhancement by Helium Gas Filled in a Hard Disk Drive Enclosure

Jiaping Yang, Cheng Peng Tan, Eng Hong Ong
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 155-159, November 12–18, 2010
Paper No: IMECE2010-37622
DOI: https://doi.org/10.1115/IMECE2010-37622
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Topics: Disks, Heat transfer, Helium
Proceedings Papers

Stabilization Effect of Surfactant and Functional Group on Highly Concentrated Carbon Nanotube Conductive Ink

H. Tantang, J. Wei
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 285-288, November 12–18, 2010
Paper No: IMECE2010-38562
DOI: https://doi.org/10.1115/IMECE2010-38562
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Topics: Carbon nanotubes, Inks, Surfactants, Stability, Electrical conductivity, Ions, Thermal conductivity, Spectra (Spectroscopy), Thin films, Ultraviolet radiation