In order to utilize a numerical simulation on a product development for electronic equipment, not only the simulation techniques themselves, but the application technologies of the simulation in the product design, were examined. The design process of electronic equipment was categorized into four stages, which were a concept, a function, a layout and a parameter design. Each design stage consists of a specifying that a human decide the specification for the next stage and a verification whether the specification satisfy the previous stage requirements. The specifying and the verification are conducted over and over again. Numerical simulation is corresponded to the verification and is used to accelerate this iteration instead of experiments. The examples of numerical simulation corresponding to these four verifications were shown in the present paper. There are few examples in last two type of simulation. The progress of the numerical technology for function and concept verification is expected. The product development process requires not only numerical simulation based on physics but also statistical approach.
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ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability
July 19–23, 2009
San Francisco, California, USA
Conference Sponsors:
- Electronic and Photonic Packaging Division
ISBN:
978-0-7918-4360-4
PROCEEDINGS PAPER
Categorized Application Technology of Numerical Simulation on Electronic Equipment Thermal Design
Yasuyuki Yokono,
Yasuyuki Yokono
The University of Tokyo, Tokyo, Japan
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Katsumi Hisano,
Katsumi Hisano
Toshiba Corporation, Kawasaki, Japan
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Kenji Hirohata
Kenji Hirohata
Toshiba Corporation, Kawasaki, Japan
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Yasuyuki Yokono
The University of Tokyo, Tokyo, Japan
Katsumi Hisano
Toshiba Corporation, Kawasaki, Japan
Kenji Hirohata
Toshiba Corporation, Kawasaki, Japan
Paper No:
InterPACK2009-89057, pp. 247-252; 6 pages
Published Online:
December 24, 2010
Citation
Yokono, Y, Hisano, K, & Hirohata, K. "Categorized Application Technology of Numerical Simulation on Electronic Equipment Thermal Design." Proceedings of the ASME 2009 InterPACK Conference collocated with the ASME 2009 Summer Heat Transfer Conference and the ASME 2009 3rd International Conference on Energy Sustainability. ASME 2009 InterPACK Conference, Volume 2. San Francisco, California, USA. July 19–23, 2009. pp. 247-252. ASME. https://doi.org/10.1115/InterPACK2009-89057
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