This study describes an application of the flow resistance network analysis to thermal design of fan-cooled electronic equipment. Especially, a modeling method of the flow resistance network was investigated. Current electronic equipment becomes smaller and thinner while their functions become more complex. As a result, flow passages for cooling air become complex. In order to simulate the complex airflow in high-density packaging electronic equipment by using the flow resistance network, we tried to develop the flow resistance network by support of the 3D-CFD analysis. A test model which simulates high-density packaging electronic equipment is prepared and the flow resistance network analysis is applied to the prediction of flow rate distribution in the model. Through the investigation, we obtained information and future problems about the development of the flow resistance network in electronic equipment with lots of electrical components.
- Electronic and Photonic Packaging Division
Flow Resistance Network Analysis in Fan-Cooled High-Density Packaging Electronic Equipment
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Fukue, T, Hatakeyama, T, Ishizuka, M, Hirose, K, Obata, K, & Koizumi, K. "Flow Resistance Network Analysis in Fan-Cooled High-Density Packaging Electronic Equipment." Proceedings of the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems collocated with the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. Volume 1: Thermal Management. San Francisco, California, USA. July 6–9, 2015. V001T09A044. ASME. https://doi.org/10.1115/IPACK2015-48600
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