Current technological developmental efforts for high performing liquid assisted air-cooling solution (LAAC) is presented in this research. The roadmap needs of high-power packages such as client, datacenter and graphics product segments are addressed. Systematic evaluation and qualification process for developing cost effective LAAC solutions to provide cooling capabilities for multiple socketed packages are also discussed. This effort includes qualifying high performing heat exchanger (finned radiator) and cold plate with different fin designs. Thermal simulations were conducted and correlated with experimental data. The concept of power density approach is introduced for predicting the cooling capability of newly developed LAAC solution for different lidded package form factors. The paper presents supporting data of performance evaluation from graphics segment that extends the solution capability to data center segment. The technology developed here will address the increasing cooling capability needed for future products with high power dissipation and multiple socket cooling configuration.