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Proceedings Papers

Air Flow Pattern and Path Flow Simulation of Airborne Particulate Contaminants in a High-Density Data Center Utilizing Airside Economization

Gautham Thirunavakkarasu, Satyam Saini, Jimil Shah, Dereje Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A011, August 27–30, 2018
Paper No: IPACK2018-8436
DOI: https://doi.org/10.1115/IPACK2018-8436
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Topics: Air flow, Data centers, Density, Flow simulation, Particulate matter, Cooling, Contamination, Air conditioning, Carbon, Computer software
Proceedings Papers

Thermal Modeling of Snap-In Type Electrolytic Capacitors in Electronic Equipment

Katsuhiro Koizumi, Masaru Ishizuka, Shinji Nakagawa
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 239-245, July 19–23, 2009
Paper No: InterPACK2009-89052
DOI: https://doi.org/10.1115/InterPACK2009-89052
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Topics: Capacitors, Electronic equipment, Modeling, Computational fluid dynamics, Flow simulation, Temperature, Design, Flow (Dynamics), Switches, Thermal analysis
Proceedings Papers

Development of Cooling Structures for Blu-Ray Disc Compatible Optical Disc Drives Using Computational Fluid Dynamics Based on Cartesian Grid Method

Nobuyuki Isoshima, Takayuki Fujimoto, Yukinobu Abe, Masatoshi Watanabe, Yoshiaki Yamauchi, Ikuo Nishida
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 895-907, July 8–12, 2007
Paper No: IPACK2007-33248
DOI: https://doi.org/10.1115/IPACK2007-33248
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Topics: Computational fluid dynamics, Cooling, Disks, Flow (Dynamics), Lasers, Flow simulation, Heat transfer, Pressure, Rotating disks, Temperature
Proceedings Papers

Thermal Analysis of Natural Convection Cooled Switch Mode Power Supplies

Katsuhiro Koizumi, Akito Joboji, Kuniaki Nagahara, Masaru Ishizuka
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 103-109, July 6–11, 2003
Paper No: IPACK2003-35048
DOI: https://doi.org/10.1115/IPACK2003-35048
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Topics: Natural convection, Switches, Thermal analysis, Power semiconductor devices, Computational methods, Design, Experimental design, Flow simulation, Heat, Modeling