1-4 of 4
Network analysis
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

Masaya Fukada, Takashi Fukue, Yasuhiro Sugimoto, Tomoyuki Hatakeyama, Masaru Ishizuka
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A006, October 26–28, 2021
Paper No: IPACK2021-72975
DOI: https://doi.org/10.1115/IPACK2021-72975
View Paper
PDF
Topics: Flow (Dynamics), Heat sinks, Modeling, Thermal resistance, Electronic equipment, Cooling, Design, Forced convection, Heat transfer, Network analysis
Proceedings Papers

Flow Resistance Network Analysis in Fan-Cooled High-Density Packaging Electronic Equipment

Takashi Fukue, Tomoyuki Hatakeyama, Masaru Ishizuka, Koichi Hirose, Kazuma Obata, Katsuhiro Koizumi
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A044, July 6–9, 2015
Paper No: IPACK2015-48600
DOI: https://doi.org/10.1115/IPACK2015-48600
View Paper
PDF
Topics: Density, Electronic equipment, Flow (Dynamics), Network analysis, Packaging, Air flow, Computational fluid dynamics, Cooling, Design, Diluents
Proceedings Papers

Basic Study on Transient Temperature Response of Papers in a Thermal Transfer Printer

Koichi Hirose, Takashi Fukue, Fumiya Nakagawa, Risa Ito, Tomoko Wauke, Hisashi Hoshino, Hirotoshi Terao
Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A019, July 16–18, 2013
Paper No: IPACK2013-73088
DOI: https://doi.org/10.1115/IPACK2013-73088
View Paper
PDF
Topics: Temperature, Transients (Dynamics), Printing, Contact resistance, Heat, Heating, Network analysis, Thermal papers
Proceedings Papers

Thermal Resistance Measurement and Thermal Network Analysis of Printed Circuit Board With Thermal Vias

Tomoyuki Hatakeyama, Masaru Ishizuka, Shinji Nakagawa, Sadakazu Takakuwa
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 251-258, July 6–8, 2011
Paper No: IPACK2011-52168
DOI: https://doi.org/10.1115/IPACK2011-52168
View Paper
PDF
Topics: Network analysis, Printed circuit boards, Thermal resistance, Copper, Heat, Computational fluid dynamics, Temperature, Electronics, Epoxy adhesives, Epoxy resins