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Proceedings Papers

AI/ML Applications for Thermally Aware SoC Designs

Adam Norman, Mark Gallina, Olena Zhu, Joyce Weiner, Fabian Garita Gonzalez

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A001, October 25–27, 2022

Paper No: IPACK2022-97186

DOI: https://doi.org/10.1115/IPACK2022-97186

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Topics: Computation, Degrees of freedom, Design, Engineering disciplines, Excitation, Feedback, Machine learning, Modeling, Optimization, Robustness

Proceedings Papers

Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers

Lucas Arrivo, Steven Schon, Aaron P. Wemhoff

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, October 26–28, 2021

Paper No: IPACK2021-73015

DOI: https://doi.org/10.1115/IPACK2021-73015

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Topics: Contact resistance, Cooling, Data centers, Electronics, Foams (Chemistry), Plates (structures), Bonding, Heat transfer, Metal foams, Modeling

Proceedings Papers

Thermal Analysis of Wavy Thermal Management System With Phase Change Composite and Pyrolytic Graphite Sheet for Cylindrical Lithium-Ion Battery Packs

Damon Gresham-Chisolm, Sonya Smith

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A005, October 27–29, 2020

Paper No: IPACK2020-2565

DOI: https://doi.org/10.1115/IPACK2020-2565

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Topics: Composite materials, Graphite, Lithium-ion batteries, Thermal analysis, Thermal management, Cooling, Design, Heat, Batteries, Stress

Proceedings Papers

Multi-Scale Thermal Analysis for Design of SiC-Based Medium Voltage Motor Drive

J. Emily Cousineau, Kevin Bennion, Karun Potty, He Li, Risha Na, Longya Xu, Jin Wang

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A030, October 7–9, 2019

Paper No: IPACK2019-6631

DOI: https://doi.org/10.1115/IPACK2019-6631

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Topics: Design, Modeling, Motor drives, Porous materials, Thermal analysis, Computational fluid dynamics, Simulation, Boundary-value problems, Convection, Electronics

Proceedings Papers

Evaluation of Low Order Stress Models for Use in Co-Design Analysis of Electronics Packaging

L. M. Boteler, S. M. Miner

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A003, October 7–9, 2019

Paper No: IPACK2019-6381

DOI: https://doi.org/10.1115/IPACK2019-6381

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Topics: Design, Electronic packaging, Stress, Temperature, Finite element analysis, Army, Design engineering, Flat heat pipes, Heat sinks, Manufacturing

Proceedings Papers

Thermal Analysis of High Efficiency High Speed Drives

Yasmin Khakpour, Weilun Warren Chen, Parikshith Channegowda, Matthew R. Pearson, Yongduk Lee, Luis Arnedo

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A025, October 7–9, 2019

Paper No: IPACK2019-6534

DOI: https://doi.org/10.1115/IPACK2019-6534

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Topics: Thermal analysis

Proceedings Papers

Thermal Analysis of 3D ICs With TSVs Placement Optimization

Zongqing Ren, Ayed Alqahtani, Nader Bagherzadeh, Jaeho Lee

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, October 7–9, 2019

Paper No: IPACK2019-6417

DOI: https://doi.org/10.1115/IPACK2019-6417

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Topics: Algorithms, Anisotropy, Delays, Heat transfer, Integrated circuits, Optimization, Power density, Signals, Silicon, Simulated annealing

Proceedings Papers

Analysis of Thermal Properties of Power Multifinger HEMT Devices

Aleš Chvála, Robert Szobolovszký, Jaroslav Kováč, Jr., Martin Florovič, Juraj Marek, Luboš Černaj, Patrik Príbytný, Daniel Donoval, Jaroslav Kováč, Sylvain Laurent Delage, Jean-Claude Jacquet

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, August 27–30, 2018

Paper No: IPACK2018-8256

DOI: https://doi.org/10.1115/IPACK2018-8256

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Topics: Cooling, Design, Electrons, Gallium nitride, Heat, Manufacturing, Mechanical admittance, Optimization, Packaging, Raman spectroscopy

Proceedings Papers

Comparison of Thermal and Stress Analysis Results for a High Voltage Module Using FEA and a Quick Parametric Analysis Tool

L. M. Boteler, S. M. Miner

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A019, August 27–30, 2018

Paper No: IPACK2018-8394

DOI: https://doi.org/10.1115/IPACK2018-8394

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Topics: Finite element analysis, Stress analysis (Engineering), Design, Temperature, Stress, Modeling, Thermal stresses, Computation, Convection, Flat heat pipes

Proceedings Papers

Multifunctional Chip for Use in Thermal Analysis of Power Systems

David Gonzalez-Nino, Lauren Boteler, Damian P. Urciuoli, Iain M. Kierzewski, Dimeji Ibitayo, Pedro O. Quintero

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A014, August 27–30, 2018

Paper No: IPACK2018-8355

DOI: https://doi.org/10.1115/IPACK2018-8355

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Topics: Design, Electronic systems, Flux (Metallurgy), Heat, Heat flux, High temperature, Instrumentation, Junctions, Military systems, Power systems (Machinery)

Proceedings Papers

Power Packaging Thermal and Stress Model for Quick Parametric Analyses

L. M. Boteler, S. M. Miner

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 29–September 1, 2017

Paper No: IPACK2017-74130

DOI: https://doi.org/10.1115/IPACK2017-74130

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Topics: Packaging, Stress, Finite element analysis, Design, Matlab, Temperature, Thermal stresses, Computer-aided design, Resistors, Computer-aided engineering

Proceedings Papers

A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply

Unique Rahangdale, Pavan Rajmane, Abel Misrak, Dereje Agonafer

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, August 29–September 1, 2017

Paper No: IPACK2017-74278

DOI: https://doi.org/10.1115/IPACK2017-74278

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Topics: Manufacturing, Testing, Reliability, Stress, Lumber, Temperature, Failure, Finite element analysis, Young's modulus, Computation

Proceedings Papers

Thermal Solution of High Flux Phased Radar Antenna for Military Application

Murat Parlak, Murat Yaban

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A008, July 6–9, 2015

Paper No: IPACK2015-48055

DOI: https://doi.org/10.1115/IPACK2015-48055

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Topics: Defense industry, Radar, Design, Cooling, Heat flux, Manifolds, Computational fluid dynamics, Computer software, Finite element methods, Flow (Dynamics)

Proceedings Papers

Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels

H. Y. Zhang, Xiao Yan, W. H. Zhu, Leon Lin

Paper No: IPACK2015-48088

DOI: https://doi.org/10.1115/IPACK2015-48088

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Topics: Design, Heat sinks, Silicon, Aluminum, Copper, Energy dissipation, Heat, Modeling, Slug flows, Cooling

Proceedings Papers

Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane

Masood Razavi, Alireza Dehghani-Sanij, Yuri S. Muzychka

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A058, July 6–9, 2015

Paper No: IPACK2015-48685

DOI: https://doi.org/10.1115/IPACK2015-48685

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Topics: Convection, Thermal resistance, Heat transfer coefficients, Boundary-value problems, Cooling, Thermal analysis, Computer software, Design, Engineers, Finite volume methods

Proceedings Papers

Modeling Thermal Spreading Resistance in Via Arrays

Michael Fish, Patrick McCluskey, Avram Bar-Cohen

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A070, July 6–9, 2015

Paper No: IPACK2015-48422

DOI: https://doi.org/10.1115/IPACK2015-48422

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Topics: Modeling, Boundary-value problems, Anisotropy, Computer simulation, Computer software, Electronic packages, Finite element analysis, Flow (Dynamics), Heat, Heat flux

Proceedings Papers

Improved Zonal Model for Data Center Analysis

Zhihang Song, Bruce T. Murray, Bahgat Sammakia

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T09A001, July 16–18, 2013

Paper No: IPACK2013-73048

DOI: https://doi.org/10.1115/IPACK2013-73048

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Topics: Data centers, Computational fluid dynamics, Thermal analysis, Air flow, Computer software, Containment, Errors, Flow (Dynamics), Momentum, Temperature distribution

Proceedings Papers

Numerical Calculation of the Pulse Compression of Ultrashort Pulse Laser Light by Means of the Thermoreflectance of SiC Substrate

Hong Duc Doan, Kazuyoshi Fushinobu

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A007, July 16–18, 2013

Paper No: IPACK2013-73050

DOI: https://doi.org/10.1115/IPACK2013-73050

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Topics: Compression, Lasers, Thermoreflectance, Electrons, Temperature, Computer simulation, Density, Reflectance, Thermal analysis

Proceedings Papers

Liquid Cooled High Power Aerospace Electronics Fluid Channel Layout Design Strategy Based on Analytical Calculation

Frank Fan Wang

Proc. ASME. InterPACK2013, Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems, V002T08A047, July 16–18, 2013

Paper No: IPACK2013-73262

DOI: https://doi.org/10.1115/IPACK2013-73262

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Topics: Aerospace industry, Design, Electronics, Fluids, Cooling, Computational fluid dynamics, Computer software, Pressure drop, Computers, Dimensions

Proceedings Papers

Design, Optimization and Thermal Analysis of Motor-Controllers in a Quadruped Robot

Naveen Kannan, Niket Shah, Dereje Agonafer, Alan Bowling

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 257-262, July 6–8, 2011

Paper No: IPACK2011-52160

DOI: https://doi.org/10.1115/IPACK2011-52160

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Topics: Control equipment, Design, Engines, Motors, Optimization, Robots, Thermal analysis, Heat, Computer programming, Computers

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NARROW

AI/ML Applications for Thermally Aware SoC Designs

Measuring the Thermal Contact Resistance Between Cu Foams and Substrates for On-Chip Cooling Applications in Data Centers

Thermal Analysis of Wavy Thermal Management System With Phase Change Composite and Pyrolytic Graphite Sheet for Cylindrical Lithium-Ion Battery Packs

Multi-Scale Thermal Analysis for Design of SiC-Based Medium Voltage Motor Drive

Evaluation of Low Order Stress Models for Use in Co-Design Analysis of Electronics Packaging

Thermal Analysis of High Efficiency High Speed Drives

Thermal Analysis of 3D ICs With TSVs Placement Optimization

Analysis of Thermal Properties of Power Multifinger HEMT Devices

Comparison of Thermal and Stress Analysis Results for a High Voltage Module Using FEA and a Quick Parametric Analysis Tool

Multifunctional Chip for Use in Thermal Analysis of Power Systems

Power Packaging Thermal and Stress Model for Quick Parametric Analyses

A Computational Approach to Study the Impact of PCB Thickness on QFN Assembly Under Drop Testing With Package Power Supply

Thermal Solution of High Flux Phased Radar Antenna for Military Application

Thermal Design Analysis of 2.5-D Packages With Analytical TSV Submodels

Numerical Investigation of Thermal Resistance in a Rectangular Flux Channel With Non-Uniform Heat Convection in the Sink Plane

Modeling Thermal Spreading Resistance in Via Arrays

Improved Zonal Model for Data Center Analysis

Numerical Calculation of the Pulse Compression of Ultrashort Pulse Laser Light by Means of the Thermoreflectance of SiC Substrate

Liquid Cooled High Power Aerospace Electronics Fluid Channel Layout Design Strategy Based on Analytical Calculation

Design, Optimization and Thermal Analysis of Motor-Controllers in a Quadruped Robot

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