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Proceedings Papers

Thermo-Electric Modeling of Nanotube-Based Environmental Sensors

Michael James Martin, Harish Manohara
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A001, July 16–18, 2013
Paper No: IPACK2013-73053
DOI: https://doi.org/10.1115/IPACK2013-73053
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Topics: Modeling, Nanotubes, Sensors, Temperature, Pressure, Bridges (Structures), Heat transfer coefficients, Circuits, Convection, Electrical resistivity
Proceedings Papers

A Methodology for High Cycle Fatigue Characterization of Lead-Free Interconnects Under Simultaneous Harsh Environments of High Temperature and Vibration

Pradeep Lall, Geeta Limaye
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A017, July 16–18, 2013
Paper No: IPACK2013-73245
DOI: https://doi.org/10.1115/IPACK2013-73245
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Topics: High cycle fatigue, High temperature, Vibration, Temperature, Solders, Stress, Alloys, Electronics, Failure, Failure mechanisms
Proceedings Papers

Inelastic Thermal Stress Simulation for Si Chip and Insulator Around TSV in 3D SiP

Takahiro Kinoshita, Takashi Kawakami, Takeshi Wakamatsu, Shunpei Shima, Keiji Matsumoto, Sayuri Kohara, Fumiaki Yamada, Yasumitsu Orii
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A009, July 16–18, 2013
Paper No: IPACK2013-73151
DOI: https://doi.org/10.1115/IPACK2013-73151
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Topics: Silicon chips, Simulation, Thermal stresses, Stress, Bending strength, Copper, Finite element methods, Yield stress, Brittleness, Elevations (Drawings)
Proceedings Papers

Unsteady Thermo-Structural Simulation of Nano-Bridge Resonators

Elham Maghsoudi, Michael James Martin
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A002, July 16–18, 2013
Paper No: IPACK2013-73061
DOI: https://doi.org/10.1115/IPACK2013-73061
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Topics: Bridges (Structures), Simulation
Proceedings Papers

Method for Assessment of Prolonged and Intermittent Storage on Reliability of Leadfree Electronics Using Leading Indicators

Pradeep Lall, Kazi Mirza, Mahendra Harsha, Jeff Suhling, Kai Goebel
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A025, July 16–18, 2013
Paper No: IPACK2013-73309
DOI: https://doi.org/10.1115/IPACK2013-73309
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Topics: Electronics, Reliability, Storage, Damage, Temperature, Avionics, Electronic systems, Failure, High temperature, Intermetallic compounds
Proceedings Papers

Large-Scale Damage Path Simulation for Solder Joints in a BGA Package

Takahiro Omori, Kenji Hirohata, Tomoko Monda, Minoru Mukai
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A010, July 16–18, 2013
Paper No: IPACK2013-73161
DOI: https://doi.org/10.1115/IPACK2013-73161
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Topics: Ball-Grid-Array packages, Damage, Simulation, Solder joints, Fatigue, Crack propagation, Electronic packages, Fatigue life, Modeling, Printed circuit boards
Proceedings Papers

Prognostics of Damage Accrual in SSL Luminaires and Drivers Subjected to HTSL Accelerated Aging

Pradeep Lall, Peter Sakalaukus, Lynn Davis
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A018, July 16–18, 2013
Paper No: IPACK2013-73250
DOI: https://doi.org/10.1115/IPACK2013-73250
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Topics: Algorithms, Aluminum, Capacitance, Capacitors, Climate, Damage, Electrical components, Failure, High temperature, Service life (Equipment)
Proceedings Papers

Performance Analysis of a Combination System of Concentrating PV/T Collector and TEGs

Xinqiang Xu, Siyi Zhou, Mark Meyers, Bahgat G. Sammakia, Bruce Murray
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A003, July 16–18, 2013
Paper No: IPACK2013-73062
DOI: https://doi.org/10.1115/IPACK2013-73062
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Topics: Cooling, Electric power generation, Electrical efficiency, Energy budget (Physics), Fatigue life, Flow (Dynamics), Gallium arsenide, Heat, Heat recovery, Heat sinks
Proceedings Papers

Heat Transfer in Nanoelectronics by Quantum Mechanics

Thomas Prevenslik
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A011, July 16–18, 2013
Paper No: IPACK2013-73173
DOI: https://doi.org/10.1115/IPACK2013-73173
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Topics: Heat transfer, Nanoelectronics, Quantum mechanics, Heat, Joules, Quantum electrodynamics, Circuits, Phonons, Radiation (Physics), Temperature
Proceedings Papers

Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability

Pradeep Lall, Ryan Lowe, Kai Goebel
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A019, July 16–18, 2013
Paper No: IPACK2013-73252
DOI: https://doi.org/10.1115/IPACK2013-73252
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Topics: Algorithms, Reliability, Kalman filters, Ball-Grid-Array packaging, Failure, Filters, Particulate matter, Printed circuit boards, Service life (Equipment), Solder joints
Proceedings Papers

Unified Creep Plasticity Damage (UCPD) Model for SAC396 Solder

Michael Neilsen, Paul Vianco
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A004, July 16–18, 2013
Paper No: IPACK2013-73074
DOI: https://doi.org/10.1115/IPACK2013-73074
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Topics: Creep, Damage, Plasticity, Solders, Fatigue, Solder joints, Finite element analysis, Fracture (Materials), Package on package, Electronic packaging
Proceedings Papers

3D Stacks of Microprocessors and Memories With Backside Two-Phase Multi-Microchannel Cooler

Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A020, July 16–18, 2013
Paper No: IPACK2013-73263
DOI: https://doi.org/10.1115/IPACK2013-73263
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Topics: Microchannels, Cooling, Manufacturing, Thermohydrodynamics, Architecture, Computers, Density, Design, Electronic components, Engineering simulation
Proceedings Papers

Simulations of Deformation and Stress During Copper Wirebond on ULK Chips

Hung-Yun Lin, Kritika Upreti, Allen Tippmann, Ganesh Subbarayan, Dae Young Jung, Bahgat Sammakia
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A012, July 16–18, 2013
Paper No: IPACK2013-73178
DOI: https://doi.org/10.1115/IPACK2013-73178
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Topics: Copper, Deformation, Engineering simulation, Simulation, Stress, Fracture (Materials), Vibration, Critical points (Physics), Wire, Wire bonding
Proceedings Papers

Transient Compact Modeling of 3D Stacked Die Inter-Tier Microfluidic Cooling Under Non-Uniform Heat Flux

Zhimin Wan, Yogendra Joshi
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A005, July 16–18, 2013
Paper No: IPACK2013-73080
DOI: https://doi.org/10.1115/IPACK2013-73080
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Topics: Cooling, Heat flux, Microfluidics, Modeling, Transients (Dynamics), Flow (Dynamics), Computational fluid dynamics, Heat transfer, Signals, Temperature
Proceedings Papers

Dynamic Modeling of a Two-Phase On-Chip Cooling System Applied on Parallel High Performance Microprocessors

Nicolas Lamaison, Jackson B. Marcinichen, John R. Thome
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A021, July 16–18, 2013
Paper No: IPACK2013-73264
DOI: https://doi.org/10.1115/IPACK2013-73264
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Topics: Cooling systems, Dynamic modeling, Heat, Critical heat flux, Flow (Dynamics), Temperature, Transients (Dynamics), Condensers (steam plant), Pumps, Simulation
Proceedings Papers

A Study on Impact Stresses in Ceramic Capacitors

Takashi Kawakami, Noriyo Horikawa, Takahiro Kinoshita, Tomohiro Inagaki
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A013, July 16–18, 2013
Paper No: IPACK2013-73191
DOI: https://doi.org/10.1115/IPACK2013-73191
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Topics: Capacitors, Ceramics, Stress, Design engineering, Fracture (Materials), Impact testing, Machinery, Manufacturing, Printed circuit boards
Proceedings Papers

Analysis of 3D-Strain Singular Field Near the Corner of Si Chip Using Digital Image Correlation Method

Hideo Koguchi, Yasuyuki Tsukada, Takahiko Kurahashi
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A006, July 16–18, 2013
Paper No: IPACK2013-73112
DOI: https://doi.org/10.1115/IPACK2013-73112
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Topics: Corners (Structural elements), Silicon chips, Displacement, Galerkin method, Stress, Bonding, Density, Electronics, Failure, Lasers
Proceedings Papers

Computational Strategies to Minimize Transient Response During Time-Domain Analysis of Structures Under Vibratory Loading

Matthew Ernst, Cholmin Choi, Abhijit Dasgupta
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A014, July 16–18, 2013
Paper No: IPACK2013-73200
DOI: https://doi.org/10.1115/IPACK2013-73200
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Topics: Time-domain analysis, Transients (Dynamics), Finite element analysis, Cycles, Dynamic analysis, Vibration, Cantilever beams, Circuits, Durability, Manufacturing
Proceedings Papers

CFD Simulation of Wave Soldering Process (Case of Simple 2-Dimensional Configurations)

Kazunori Inagaki, Shinji Nakagawa, Tomoyuki Hatakeyama, Koichi Ishikura, Katsuhiro Koizumi
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A022, July 16–18, 2013
Paper No: IPACK2013-73275
DOI: https://doi.org/10.1115/IPACK2013-73275
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Topics: Computational fluid dynamics, Simulation, Wave soldering, Solders, Computer software, Electronics, Flow (Dynamics), Fluids, Melting, Melting point
Proceedings Papers

High Field Breakdown of Carbon Nanotube Network Transistors

Man Prakash Gupta, Ashkan Behnam, David Estrada, Eric Pop, Satish Kumar
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T04A007, July 16–18, 2013
Paper No: IPACK2013-73115
DOI: https://doi.org/10.1115/IPACK2013-73115
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Topics: Carbon nanotubes, Transistors, Density, Heating, Reliability, Thin film transistors