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Keywords: low-temperature cooling
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Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 351-356, July 6–11, 2003
Paper No: IPACK2003-35156
... providing low temperature cooling via a dual-path cooling module (evaporator) mounted on a CPU-MCM package. Cooling capacity for each refrigeration unit was controlled ranging from 250W to 2500W with a refrigerant evaporating temperature at −25 degree centigrade. The CPU-MCM mounted with the refrigeration...