1-8 of 8
Computer cooling
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Unit Cell Model Formulation and Thermal Performance Analysis for Cross-Flow Heat Exchanger

Hengyun Zhang, Zhaoqiang Wang, Yansong Wang
Proc. ASME. MNHMT2016, Volume 2: Micro/Nano-Thermal Manufacturing and Materials Processing; Boiling, Quenching and Condensation Heat Transfer on Engineered Surfaces; Computational Methods in Micro/Nanoscale Transport; Heat and Mass Transfer in Small Scale; Micro/Miniature Multi-Phase Devices; Biomedical Applications of Micro/Nanoscale Transport; Measurement Techniques and Thermophysical Properties in Micro/Nanoscale; Posters, V002T11A028, January 4–6, 2016
Paper No: MNHMT2016-6711
DOI: https://doi.org/10.1115/MNHMT2016-6711
View Paper
PDF
Topics: Cross-flow, Heat exchangers, Design, Heat, Heat transfer coefficients, Computation, Computer cooling, Fluid dynamics, Heat transfer, Manufacturing
Proceedings Papers

Nano-PCMs for Electronics Cooling Applications

Laura Colla, Laura Fedele, Simone Mancin, Sergio Bobbo, Davide Ercole, Oronzio Manca
Proc. ASME. MNHMT2016, Volume 2: Micro/Nano-Thermal Manufacturing and Materials Processing; Boiling, Quenching and Condensation Heat Transfer on Engineered Surfaces; Computational Methods in Micro/Nanoscale Transport; Heat and Mass Transfer in Small Scale; Micro/Miniature Multi-Phase Devices; Biomedical Applications of Micro/Nanoscale Transport; Measurement Techniques and Thermophysical Properties in Micro/Nanoscale; Posters, V002T14A002, January 4–6, 2016
Paper No: MNHMT2016-6613
DOI: https://doi.org/10.1115/MNHMT2016-6613
View Paper
PDF
Topics: Computer cooling, Phase change materials, Nanoparticles, Paraffin wax, Waxes, Computer simulation, Latent heat, Melting, Specific heat, Temperature
Proceedings Papers

Thermal Performance of Microchannels With Dimples for Electronics Cooling

Hui Lu, Liang Gong, Minghai Xu
Proc. ASME. MNHMT2013, ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T11A010, December 11–14, 2013
Paper No: MNHMT2013-22198
DOI: https://doi.org/10.1115/MNHMT2013-22198
View Paper
PDF
Topics: Computer cooling, Microchannels
Proceedings Papers

Heat Transfer Performance of a Phase Change Microcapsule Fluid

Paul Kalinowski, John Lawler, Bao Yang, Fangyu Cao
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 235-243, March 3–6, 2012
Paper No: MNHMT2012-75190
DOI: https://doi.org/10.1115/MNHMT2012-75190
View Paper
PDF
Topics: Fluids, Heat transfer, Heat transfer coefficients, Particulate matter, Computer cooling, Coolants, Heat sinks, Microchannels, Nanoparticles, Phase change materials
Proceedings Papers

Microjet Impingement Boiling on a Structured-Porous Surface

Zenghui Zhao, Yoav Peles, Michael K. Jensen
Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 411-417, March 3–6, 2012
Paper No: MNHMT2012-75271
DOI: https://doi.org/10.1115/MNHMT2012-75271
View Paper
PDF
Topics: Boiling, Flow (Dynamics), Wire mesh, Copper, Heat transfer, Atmospheric pressure, Computer cooling, Heat, Heat flux, Reynolds number
Proceedings Papers

Microfluidic Refrigerant Compression and Pumping by Maxwell Pressure Generated at a Nanoporous Monolith

Hsueh-Chia Chang
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 593-595, December 18–21, 2009
Paper No: MNHMT2009-18555
DOI: https://doi.org/10.1115/MNHMT2009-18555
View Paper
PDF
Topics: Compression, Microfluidics, Pressure, Refrigerants, Cooling, Computer cooling, Density, Heat, High pressure (Physics), Manufacturing
Proceedings Papers

Biomimetic Passive Skin Cooling for High-End Handheld Devices

Xinsheng Zhang, Ming Zhou, Zhi Huang, Xiaoding Xu, Xianzheng Zhang, Xuejiao Hu
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 259-263, December 18–21, 2009
Paper No: MNHMT2009-18370
DOI: https://doi.org/10.1115/MNHMT2009-18370
View Paper
PDF
Topics: Biomimetics, Cooling, Evaporation, Natural convection, Skin, Temperature, Heat, Energy dissipation, Blackbody radiation, Computer cooling
Proceedings Papers

Thermal Management of On-Chip Hot Spot

Avram Bar-Cohen, Peng Wang
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 553-567, December 18–21, 2009
Paper No: MNHMT2009-18548
DOI: https://doi.org/10.1115/MNHMT2009-18548
View Paper
PDF
Topics: Flat heat pipes, Thermal management, Heat flux, Anisotropy, Computer cooling, Coolers, Cooling, Currents, Density, Electronics