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Keywords: Electronics Cooling
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Proceedings Papers

Proc. ASME. MNHMT2013, ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T11A010, December 11–14, 2013
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2013-22198
... of laminar flow. Compared with traditional microchannel heat sink, dimple-microchannel heat sink has stronger cooling capacity, could be an attractive choice for cooling of future microelectronics. Thermal Performance Dimple Microchannel Electronics Cooling CFD 1 Copyright © 2013 by ASME...
Proceedings Papers

Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 909-916, March 3–6, 2012
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2012-75312
.... Electronics cooling Forced convection Free-molecular flow kinetic theory HEAT TRANSFER AND PRESSURE DROP THROUGH NANO-FIN ARRAYS IN THE FREE-MOLECULAR FLOW REGIME Michael James Martin Assistant Professor Louisiana State University Department of Mechanical Engineering Baton Rouge, Louisiana 70803, USA...
Proceedings Papers

Proc. ASME. MNHMT2012, ASME 2012 Third International Conference on Micro/Nanoscale Heat and Mass Transfer, 411-417, March 3–6, 2012
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2012-75271
... to jet impinging on a plain copper surface under similar working conditions, a 248% performance enhancement is obtained with the porous surface. jet impingement nucleate flow boiling heat surface enhancement porous wire mesh high-flux surface electronics cooling 1 Copyright © 2012...
Proceedings Papers

Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 389-394, December 18–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2009-18233
... electronics cooling MNHMT2009-18233 THE EXPERIMENTAL STUDY ON MAGNETIC FLUID FLAT PLATE HEAT PIPE AS THERMAL SPREADERS Ming ZHANG, Zhongliang LIU Chen WANG Key Laboratory of Enhanced Heat Transfer and Energy Conservation, Ministry of Education and Key Laboratory of Heat Transfer and Energy Conversion...
Proceedings Papers

Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 259-263, December 18–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2009-18370
... temperature sensitive hydro gel electronics cooling mobile computing 1 Copyright © 2009 by ASME Proceedings of MNHMT2009 ASME 2nd International Micro/Nanoscale Heat Transfer International Conference December 18-21, 2009, Shanghai, China MNHMT2009-18370 BIOMIMETIC PASSIVE SKIN COOLING FOR HIGH-END...
Proceedings Papers

Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 553-567, December 18–21, 2009
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2009-18548
... to thermoelectric microcoolers — using mini-contcat enhancement and in-plane thermoelectric currents, orthotropic TIM’s/heat spreaders, and phase-change microgap coolers. Hot Spot Electronics Cooling Termoelectric Cooler Anisotropic Heat Spreader Microgap Cooler 1 Copyright © 2009 by ASME Proceedings...
Proceedings Papers

Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 923-929, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52017
... 23 06 2009 vapor chamber electronics cooling grooved structure An effective thermal spreader can achieve more uniform heat flux distribution and thus enhance heat dissipation of heat sinks. Vapor chamber is one of highly effective thermal spreaders. In this paper, a novel...
Topics: Vapors
Proceedings Papers

Proc. ASME. MNHT2008, ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B, 671-677, June 6–9, 2008
Publisher: American Society of Mechanical Engineers
Paper No: MNHT2008-52117
... constraints, so that the thermal resistance is at a minimum, is described and demonstrated using the computational model. Microchannel Microchannel Optimization Electronics Cooling Heat Sinks AB opti rect base gov com dist used for To v as d exp with arriv arra desi min com Key Elec Proceedings...