... of laminar flow. Compared with traditional microchannel heat sink, dimple-microchannel heat sink has stronger cooling capacity, could be an attractive choice for cooling of future microelectronics. Thermal Performance Dimple Microchannel Electronics Cooling CFD 1 Copyright © 2013 by ASME...

... that the pressure gradient, temperature, and local velocity of the gas are governed by coupled ordinary differential equations. The system of equations is solved for representative arrays of nano- fins to find the total heat transfer and pressure drop across a 1 cm chip. KEYWORDS Electronics cooling, Forced...

... boiling, heat surface enhancement, porous, wire mesh, high-flux surface, electronics cooling. INTRODUCTION The ever-increasing packaging density of modern electronic systems demands efficient cooling to ensure their safe operation. By some statements [1, 2], the surface heat flux for next generation...

... electronics cooling MNHMT2009-18233 THE EXPERIMENTAL STUDY ON MAGNETIC FLUID FLAT PLATE HEAT PIPE AS THERMAL SPREADERS Ming ZHANG, Zhongliang LIU Chen WANG Key Laboratory of Enhanced Heat Transfer and Energy Conservation, Ministry of Education and Key Laboratory of Heat Transfer and Energy Conversion...

... temperature sensitive hydro gel electronics cooling mobile computing 1 Copyright © 2009 by ASME Proceedings of MNHMT2009 ASME 2nd International Micro/Nanoscale Heat Transfer International Conference December 18-21, 2009, Shanghai, China MNHMT2009-18370 BIOMIMETIC PASSIVE SKIN COOLING FOR HIGH-END...

... to thermoelectric microcoolers — using mini-contcat enhancement and in-plane thermoelectric currents, orthotropic TIM’s/heat spreaders, and phase-change microgap coolers. Hot Spot Electronics Cooling Termoelectric Cooler Anisotropic Heat Spreader Microgap Cooler 1 Copyright © 2009 by ASME Proceedings...

... great uniform temperature distribution. By comparing the experimental results with numerical simulation results, the reliability of the numerical model can be verified. vapor chamber electronics cooling grooved structure h Latent heat, J/kg T Temperature of ambient, K Proceedings of MNHT2008...

... constraints, so that the thermal resistance is at a minimum, is described and demonstrated using the computational model. Microchannel Microchannel Optimization Electronics Cooling Heat Sinks AB opti rect base gov com dist used for To v as d exp with arriv arra desi min com Key Elec Proceedings...