Thermomechanical analysis of global and local buckling is presented to show temperature effects on the stress/strain and shape of a film-on-substrate system. First, the strain is expressed as a function of three key temperatures (room, working, and deposit temperatures). Through sensitivity analysis on temperature, polydimethylsiloxane (PDMS) selection is determined to theoretically design film-on-substrate systems with the minimum variation in stress caused by temperatures. Then, the wrinkling behaviors are studied to establish the relationships of critical strain, wavelength, and amplitude with temperature. In addition, the critical working temperature is determined for local buckling. The approximate semi-analytical solution and the finite element simulation are compared by the use of a two-dimensional case of film on a half-space substrate.
Skip Nav Destination
e-mail: yahuang@hust.edu.cn
Article navigation
July 2010
Research Papers
Thermomechanical Analysis of Film-on-Substrate System With Temperature-Dependent Properties
YongAn Huang,
YongAn Huang
State Key Laboratory of Digital Manufacturing Equipment and Technology,
e-mail: yahuang@hust.edu.cn
Huazhong University of Science and Technology
, Wuhan 430074, P.R. China
Search for other works by this author on:
ZhouPing Yin,
ZhouPing Yin
State Key Laboratory of Digital Manufacturing Equipment and Technology,
Huazhong University of Science and Technology
, Wuhan 430074, P.R. China
Search for other works by this author on:
YouLun Xiong
YouLun Xiong
State Key Laboratory of Digital Manufacturing Equipment and Technology,
Huazhong University of Science and Technology
, Wuhan 430074, P.R. China
Search for other works by this author on:
YongAn Huang
State Key Laboratory of Digital Manufacturing Equipment and Technology,
Huazhong University of Science and Technology
, Wuhan 430074, P.R. Chinae-mail: yahuang@hust.edu.cn
ZhouPing Yin
State Key Laboratory of Digital Manufacturing Equipment and Technology,
Huazhong University of Science and Technology
, Wuhan 430074, P.R. China
YouLun Xiong
State Key Laboratory of Digital Manufacturing Equipment and Technology,
Huazhong University of Science and Technology
, Wuhan 430074, P.R. ChinaJ. Appl. Mech. Jul 2010, 77(4): 041016 (9 pages)
Published Online: April 16, 2010
Article history
Received:
August 7, 2009
Revised:
December 9, 2009
Online:
April 16, 2010
Published:
April 16, 2010
Citation
Huang, Y., Yin, Z., and Xiong, Y. (April 16, 2010). "Thermomechanical Analysis of Film-on-Substrate System With Temperature-Dependent Properties." ASME. J. Appl. Mech. July 2010; 77(4): 041016. https://doi.org/10.1115/1.4000927
Download citation file:
Get Email Alerts
Why biological cells can't stay spherical?
J. Appl. Mech
Interplay Between Nucleation and Kinetics in Dynamic Twinning
J. Appl. Mech (December 2024)
Elastic Localization With Particular Reference to Tape-Springs
J. Appl. Mech (December 2024)
Related Articles
A Simple Formula for Evaluating the Fundamental Frequency Parameter of Initially Stressed Uniform Beams on Elastic Foundation
J. Vib. Acoust (July,2002)
Modeling and Experiments of Buckling Modes and Deflection of Fixed-Guided Beams in Compliant Mechanisms
J. Mech. Des (May,2011)
Errors Caused by Non-Work-Conjugate Stress and Strain Measures and Necessary Corrections in Finite Element Programs
J. Appl. Mech (July,2010)
Cover Requirement and Stability of Horizontally Bent Buried Pipelines
J. Pressure Vessel Technol (April,2012)
Related Proceedings Papers
Related Chapters
Subsection NB—Class 1 Components
Companion Guide to the ASME Boiler and Pressure Vessel Code, Volume 1, Third Edition
Axially Loaded Members
Design & Analysis of ASME Boiler and Pressure Vessel Components in the Creep Range
Members in Compression
Design & Analysis of ASME Boiler and Pressure Vessel Components in the Creep Range