MESA06—The 2nd IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications Beijing, China on August 13–16, 2006

Advisory Committee

Jorge Angeles, McGill University, Canada

David M. Auslander, U. of California, Berkeley, USA

Tianyou Chai, Northeast University, China

Krishna C. Gupta, U. of Illinois at Chicago, USA

Ren C. Luo, National Chung Cheng University, China

Michael McCarthy, U. of California, Irvine, USA

Bahram Ravani, U. of California, Davis, USA

T. J. Tarn, Washington University, USA

Masayoshi Tomizuka, U. of California, Berkeley, USA

Youlun Xiong, Huazhong U. of Science and Technology, China

General Chair

Feiyue Wang, U. of Arizona and Chinese Academy of Sciences, USA

General Co-Chairs

Nanning Zheng, Xian Jiaotong University, China

Dongming Guo, Dalian U. of Technology, China

Program Chair

Harry H. Cheng, U. of California, Davis, USA

Program Co-Chairs

Ying Chen, Hangzhou Dianzi University, China

Hanqi Zhuang, Florida Atlantic University, USA

S. Felix Wu, U. of California, Davis, USA

Dalei Guo, Chinese Academy of Sciences, China

Yanqing Guo, University of Arizona, USA

Publicity Chairs

Daniel Zeng, University of Arizona, USA

Huayong Yang, Zhejiang University, China

Q. Jeffrey Ge, State University of New York, USA

Industrial Liaison Chairs

Frederick M. Proctor, National Institute of Standards and Technology, USA

Zhilie Chen, Shenzhen Evoc Intelligent Technology Co. Ltd., China

Special Session Chairs

Lefei Li, University of Arizona, USA

Xudong Hu, Zhejiang Sci-Tech University, China

Workshop and Tutorial Chairs

Jian S. Dai, University of London, UK

Bo Chen, University of California, Davis, USA

Awards Committee Chairs

Peihua Gu, Shantou University, China

Zuomin Dong, University of Victoria, Canada

Du Zhang, California State University, USA

Local Organizing Chairs

Chunheng Wang, Chinese Academy of Sciences

Li Zheng, Tsinghua University, China

Huiguang He, Chinese Academy of Sciences

Publication Chair

Hao Hong, Chinese Academy of Sciences, China

Executive Secretariat Contact E-mail:


IEEE Intelligent Transportation Systems Society

ASME Division of Computer and Information in Engineering

ASME Division of Design Engineering

Chinese Association for Automation

Chinese Mechanical Engineering Society


National Natural Science Foundation of China


Mechanical and electrical engineering show an increasing integration of mechanics with electronics and information processing. This integration is between the components (hardware) and the information-driven functions (software), resulting in integrated systems called mechatronic systems. The development of mechatronic systems involves finding an optimal balance between the basic mechanical structure, sensor and actuator implementation, automatic digital information processing, and overall control for which embedded systems play a key role. The field of embedded systems is getting more and more challenging, and issues in development of embedded software are attracting the attention of an increasing number of researchers both in industry and academia. The goal of MESA06 is to bring together experts from the fields of mechatronic and embedded systems to disseminate the recent advances made in the area, discuss the future research directions, and exchange application experience with respect to the conference themes.


Mechatronics and Robotics

  • Analysis, modeling, and simulation

  • Autonomous mobile robots

  • Advanced control

  • System design

  • Robots and mobile devices

  • Man machine interfaces

  • Open architecture system integration

Embedded Systems Infrastructure and Theory
  • System-on-a-chip (SoC) technology

  • Embedded microcontrollers

  • Multiprocessors

  • Hardware specification

  • Synthesis, modeling, simulation, and analysis

  • Power-aware

  • Embedded system security

  • Real-time issues

  • Software architectures

  • Virtual machines

  • OS and middleware support

  • Memory management support

  • Hardware/software co-design

Sensors and MEMs
  • Analysis, modeling, and simulation

  • MEMS and NEMS

  • Sensor design, integration, and fusion

  • Sensor networks

Networked Mechatronic and Embedded Systems
  • Communication tools

  • Reconfigurable, scalable, and interoperable middleware development

  • Network-on-chip

  • Component-based approaches

  • Mobile and agent-based computing

Development, Verification, and Debug Tools for Mechatronic and Embedded Systems
  • Compilers

  • Assemblers and cross assemblers

  • System design tools

  • Test and debug strategies

  • Emulators and simulators

  • Debuggers

  • Software simulations of hardware components

Mechatronic and Embedded System Applications
  • Challenges, requirements, model problems, and constraints associated with various application domains

  • Use of mechatronic and embedded technologies in meeting particular system requirements, performance, scalability, reliability, and security

  • Assessments of mechatronic and embedded technologies for particular application domains

  • Technology transition lessons learned

  • Applications in intelligent transportation systems

  • Applications in intelligent manufacturing and automation systems

Education in Mechatronics and Embedded Computing
  • Innovations in course, curriculum, laboratory development

  • Development of teaching tools and innovative teaching strategies

  • Integration of emerging technologies into the undergraduate and graduate programs

Paper Submission

Complete manuscripts in PDF format must be electronically submitted to the conference website Submitted manuscripts should be six (6) pages or less in IEEE two-column format, including figures, tables, and references.

Important Dates

May 10, 2006—Full paper, proposal for special session, workshop and tutorial

June 20, 2006—Notification of acceptance

July 1, 2006—Camera ready paper submission

For detailed information, please visit the conference website at or