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Issues
June 2022
ISSN 1530-9827
EISSN 1944-7078
In this Issue
Special Issue: Highlights of CIE 2021
Guest Editorial
Special Issue: Highlights of CIE 2021
J. Comput. Inf. Sci. Eng. June 2022, 22(3): 030301.
doi: https://doi.org/10.1115/1.4054201
Research Papers
Strut Diameter Uncertainty Prediction by Deep Neural Network for Additively Manufactured Lattice Structures
J. Comput. Inf. Sci. Eng. June 2022, 22(3): 031001.
doi: https://doi.org/10.1115/1.4053001
Adaptive Virtual Reality Exergame: Promoting Physical Activity Among Workers
J. Comput. Inf. Sci. Eng. June 2022, 22(3): 031002.
doi: https://doi.org/10.1115/1.4053002
Topics:
Machine learning
,
Virtual reality
,
Sensors
Multisensory Virtual Reality for Delivering Training Content to Machinery Operators
J. Comput. Inf. Sci. Eng. June 2022, 22(3): 031003.
doi: https://doi.org/10.1115/1.4053075
Topics:
Machinery
,
Virtual reality
,
Design
,
Testing
Isogeometric Shape Optimization for Design Dependent Loads
J. Comput. Inf. Sci. Eng. June 2022, 22(3): 031004.
doi: https://doi.org/10.1115/1.4053076
Topics:
Design
,
Optimization
,
Shape optimization
,
Stress
,
Weight (Mass)
,
Shapes
,
Pressure
,
Geometry
Segmentation of Additive Manufacturing Defects Using U-Net
J. Comput. Inf. Sci. Eng. June 2022, 22(3): 031005.
doi: https://doi.org/10.1115/1.4053078
Functionally Graded Non-Periodic Cellular Structure Design and Optimization
J. Comput. Inf. Sci. Eng. June 2022, 22(3): 031006.
doi: https://doi.org/10.1115/1.4053039
Topics:
Design
,
Optimization
A Surrogate Model to Predict Production Performance in Digital Twin-Based Smart Manufacturing
J. Comput. Inf. Sci. Eng. June 2022, 22(3): 031007.
doi: https://doi.org/10.1115/1.4053038
Topics:
Digital twin
,
Machinery
,
Manufacturing
,
Manufacturing systems
,
Semiconductor wafers
,
Stress
,
Splines
Prediction of Mechanical Properties of Three-Dimensional Printed Lattice Structures Through Machine Learning
J. Comput. Inf. Sci. Eng. June 2022, 22(3): 031008.
doi: https://doi.org/10.1115/1.4053077
Topics:
Elastic moduli
,
Errors
,
Machine learning
,
Mechanical properties
,
Three-dimensional models
,
Entropy
,
Yield strength
,
Design
,
Porosity
Design of Customized Virtual Reality Serious Games for the Cognitive Rehabilitation of Retrograde Amnesia After Brain Stroke
J. Comput. Inf. Sci. Eng. June 2022, 22(3): 031009.
doi: https://doi.org/10.1115/1.4053149
Topics:
Biomedicine
,
Design
,
Virtual reality
,
Brain
,
Computer software
,
Modeling
,
Sensors
Automated and Adaptive Geometry Preparation for AR/VR-Applications
J. Comput. Inf. Sci. Eng. June 2022, 22(3): 031010.
doi: https://doi.org/10.1115/1.4053327
Topics:
Geometry
,
Virtual reality
,
Computer-aided design
Identify Finger Rotation Angles With ArUco Markers and Action Cameras
J. Comput. Inf. Sci. Eng. June 2022, 22(3): 031011.
doi: https://doi.org/10.1115/1.4053409
Topics:
Rotation
Algorithms for Improving Speed and Accuracy of Automated Three-Dimensional Reconstruction With a Depth Camera Mounted on An Industrial Robot
J. Comput. Inf. Sci. Eng. June 2022, 22(3): 031012.
doi: https://doi.org/10.1115/1.4053272
Topics:
Algorithms
,
Errors
,
Imaging
,
Robots
,
Trajectories (Physics)
,
Uncertainty
,
Calibration
Design Evaluations in Educational Settings: A Neuroscientific Study of Incentivized Test/Retest on Student Performance
J. Comput. Inf. Sci. Eng. June 2022, 22(3): 031013.
doi: https://doi.org/10.1115/1.4053801
Topics:
Brain
,
Design
,
Electroencephalography
,
Stress
,
Students
,
Sensors
,
Design education
Computational Design for Digitally Fabricated 3D Inductive Power Transfer Coils
J. Comput. Inf. Sci. Eng. June 2022, 22(3): 031014.
doi: https://doi.org/10.1115/1.4053500
Topics:
Design
,
Simulation
,
Shapes
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Special Issue: Scientific Machine Learning for Manufacturing Processes and Material Systems
J. Comput. Inf. Sci. Eng
A Conceptual Design Method based on C-K Theory and Large Language Models
J. Comput. Inf. Sci. Eng
Evaluating Large Language Models for Material Selection
J. Comput. Inf. Sci. Eng