The spacecraft electronic assemblies are subjected to severe environmental conditions during testing, launching and during orbit mission. The success of the mission depends upon the proper functioning of these critical electronic modules. The structural analyses using Finite Element Methods (FEM) assure the integrity of these components. A typical box, Array Drive Electronics (ADE), for TIROS satellites [1] is discussed in this article. The NASTRAN software was used to perform the stress and modal analyses of the box assembly with five circuit boards, covers and mounting feet. The stress analysis was performed for a static solution. As a conservative loading, 3 sigma load factor was used in the calculation of the acceleration values from the random vibration test conditions. Margins of safety were calculated. Design and material changes were recommended. The mode shapes fall in to three groups as explained in the text.
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March 1992
Technical Briefs
Structural Analyses of Spacecraft Electronic Packages
S. Kannappan,
S. Kannappan
General Electric Company, Princeton, NJ 08543
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V. Kunukkassril
V. Kunukkassril
General Electric Company, Princeton, NJ 08543
Search for other works by this author on:
S. Kannappan
General Electric Company, Princeton, NJ 08543
V. Kunukkassril
General Electric Company, Princeton, NJ 08543
J. Electron. Packag. Mar 1992, 114(1): 96-99 (4 pages)
Published Online: March 1, 1992
Article history
Received:
September 1, 1990
Revised:
December 20, 1991
Online:
April 28, 2008
Citation
Kannappan, S., and Kunukkassril, V. (March 1, 1992). "Structural Analyses of Spacecraft Electronic Packages." ASME. J. Electron. Packag. March 1992; 114(1): 96–99. https://doi.org/10.1115/1.2905449
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