Three-dimensional finite element analysis has been applied for determining time-dependent solder joint response of leaded surface mount components under thermal cycling. Two main challenges are the geometric complexity in mesh development and computationally intensive analysis because of the highly nonlinear material properties. Advanced techniques have been applied, including multi-point constraints for mesh transition, which reduces the number of degrees of freedom in the model, and substructuring, which effectively reduces computational time in the iterative analysis. The result is a generic approach for nonlinear creep analysis using commercial FEA software on a high performance workstation. Illustrations are provided for J and gullwing leaded packages.
1.
Steinberg, D. S., Cooling Techniques for Electronic Equipment, Wiley, New York, 1991.
2.
Hagge, J. K., “Predicting Fatigue Life of Leadless Chip Carriers Using Manson-Coffin Equations,” Proceedings of the International Electronics Packaging Society Conference, 1982, pp. 199–206.
3.
Engelmaier, W., “Functional Cycling and Surface Mounting Attachment Reliability,” Surface Mount Technology Technical Monograph Series 6984-002, ISHM, 1984, pp. 87–114.
4.
Engelmaier
W.
Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling
,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology
, Vol. CHMT-6
, No. 3
, Sept. 1983
, pp. 232
–237
.5.
Stone, D., Wilson, H., Subrahmanyan, R., and Li, C., “Mechanisms of Damage Accumulation in Solders During Thermal Fatigue,” Proceedings of the 36th Electronic Components Conference, 1986, pp. 630–635.
6.
Wong
B.
Helling
D. E.
Clark
R. W.
A Creep-Rupture Model for Two-Phase Eutectic Solders
,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology
, Vol. 11
, No. 3
, Sept. 1988
, pp. 284
–290
.7.
Wong
B.
Helling
D. E.
A Mechanistic Model for Solder Joint Failure Prediction Under Thermal Cycling
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 112
, June 1990
, pp. 104
–109
.8.
Subrahmanyan
R.
Wilcox
J. R.
Li
C. Y.
A Damage Integral Approach to Thermal Fatigue of Solder Joints
,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology
, Vol. 12
, No. 4
, Dec. 1989
, pp. 480
–491
.9.
Shine, M. C., Fox, L. R., and Sofia, J. W., “A Strain Range Partitioning Procedure for Solder Fatigue,” Brazing and Soldering, No. 9, Autumn 1985, pp. 11–14.
10.
Solomon, H. D., “Fatigue of 60/40 Solder,” Proceedings of the 36th Electronic Components Conference, 1986, pp. 622–692.
11.
Pan, T. Y., “Thermal Cycling Induced Plastic Deformation in Solder Joints—Part III: Strain-Energy Based Fatigue Life Model and Effects of Ramp Rate and Hold Time,” ASME Winter Annual Meeting, Dec. 1991.
12.
Dasgupta
A.
Oyan
C.
Barker
D.
Pecht
M.
Solder Creep-Fatigue Analysis by an Energy-Partitioning Approach
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 114
, June 1992
, pp. 152
–160
.13.
Hall
P. M.
Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed Boards
,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology
, Vol. 7
, No. 4
, Dec. 1984
, pp. 314
–327
.14.
Clech, J. P., and Augis, J. A., “Temperature Cycling, Structural Response and Attachment Reliability of Surface-Mounted Leaded Packages,” Proceedings of the International Electronics Packaging Society Conference, Nov. 1988, pp. 305–325.
15.
Pao
Y. H.
Badgley
S.
Govila
R.
Baumgartner
L.
Allor
R.
Cooper
R.
Measurement of Mechanical Behavior of High Lead-Tin Solder Joints Subjected to Thermal Cycling
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 114
, June 1992
, pp. 135
–144
.16.
Guo
Y.
Woychik
C. G.
Thermal Strain Measurements of Solder Joints in Second Level Interconnections Using Moire Interferometry
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 114
, Mar. 1992
, pp. 88
–92
.17.
Lau
J. H.
Rice
D. W.
Avery
P. A.
Elastoplastic Analysis of Surface-Mount Solder Joints
,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology
, Vol. CHMT-10
, No. 3
, Sept. 1987
, pp. 346
–357
.18.
Lau
J. H.
Thermal Stress Analysis of SMT PQFP Packages and Interconnections
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 111
, March 1989
, pp. 2
–8
.19.
Charles
H. K.
Clatterbaugh
G. V.
Solder Joint Reliability—Design Implications From Finite Element Modeling and Experimental Testing
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 112
, June 1990
, pp. 135
–146
.20.
Riemer, D. E., “Prediction of Temperature Cycling Life for SMT Solder Joints on TCE-Mismatched Substrates,” Proceedings of 40th Electronic Components & Technology Conference, 1990, pp. 418–425.
21.
Ozmat, B., “A Nonlinear Thermal Stress Analysis of Surface Mount Solder Joints,” Proceedings of 40th Electronic Components & Technology Conference, 1990, pp. 959–972.
22.
Solomon, H. D., Brzozowski, V., and Thompson, D. G., “Predictions of Solder Joint Fatigue Life,” Proceedings of 40th Electronic Components & Technology Conference, 1990, pp. 351–359.
23.
Pan
T. Y.
Thermal Cycling Induced Plastic Deformation in Solder Joints—Part I: Accumulated Deformation in Surface Mount Joints
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 113
, Mar. 1991
, pp. 8
–15
.24.
Akay, H. U., Tong, Y., and Paydar, N., “Thermal Fatigue Analysis of an SMT Solder Joint Using Nonlinear FEM Approach,” International Electronics Packaging Conference, Sept. 1992.
25.
Paydar, N., Akay, H. U., and Tong, Y., “Thermal Stress Analysis of an SMT Solder Joint Using a Creep-Plasticity Model,” Proceedings of ELECTRECON ’91, Oct. 1991.
26.
Lam
S. T.
Arieli
A.
Mukherjee
A. K.
Superplastic Behavior of Pb-Sn Eutectic Alloy
,” Materials Science and Engineering
, Vol. 40
, 1979
, pp. 73
–79
.27.
Kashyap
B. P.
Murty
G. S.
Experimental Constitutive Relations for the High Temperature Deformation of a Pb-Sn Eutectic Alloy
,” Materials Science and Engineering
, Vol. 50
, 1981
, pp. 205
–213
.28.
Knecht
S.
Fox
L. R.
Constitutive Relation and Creep-Fatigue Life Model for Eutectic Tin-Lead Solder
,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology
, Vol. 13
, No. 2
, June 1990
, pp. 424
–433
.29.
Tribula
D.
Morris
J. W.
Creep in Shear of Experimental Solder Joints
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 112
, June 1990
, pp. 87
–93
.30.
Darveaux, R., and Banerji, K., “Constitutive Relations for Tin-Based-Solder Joints,” Proceedings of 42nd Electronic Components & Technology Conference, 1992, pp. 538–550.
31.
Zienkiewicz, O. C., and Taylor, R. L., The Finite Element Method, McGraw-Hill, New York, 1989.
32.
.Shine, M. C., and Fox, L. R., “Fatigue of Solder Joints in Surface Mount Devices,” ASTM STP 942, Low Cycle Fatigue, Philadelphia, 1988, pp. 588–610.
33.
Syed
A. R.
Banerjee
B. K.
Bhatti
P. K.
Gschwend
K.
Kwang
A. Y.
Effect of Temperature Profile Parameters on Creep Strain Response of Solder Joints in Leaded Surface Mount Devices
,” Proceedings of the 1993 ASME International Electronics Packaging Conference
, Vol. 2
, 1993
, pp. 1055
–1062
.
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