Natural convection in rectangular enclosures with multiple protruding heaters mounted on one side wall is of relevance to the cooling of electronic equipment. In some configurations, the top wall behaves as the heat sink while the opposing vertical wall and the bottom wall are insulated. The present work examines the peculiarities introduced in the natural convection process for such configurations. The enclosure considered had five protrusions, cavity width to heater length ratio of 1.2 and cavity height to heater length ratio of 11. It is shown that for such configurations, a stable flow exists only at lower Rayleigh numbers and that above a certain critical Rayleigh number, only quasi-steady solutions exist. At low Rayleigh numbers(Ra* ≤ 1.5 × 107), the flow is stable and characterized by the presence of a primary flow cell and a counter-rotating secondary cell at the top of the enclosure. At higher Rayleigh numbers (Ra* ≥ 3 × 108), however, the isothermal top wall causes a periodic flow pattern to develop within the enclosure. Several interesting characteristics of the flow and temperature fields are presented. Results compared with previous experimental and numerical work are found to be in good agreement.

1.
Afrid
M.
, and
Zebib
A.
,
1989
, “
Natural Convection Air Cooling of Heated Components Mounted on a Vertical Wall
,”
Numerical Heat Transfer
, Part A, Vol.
15
, pp.
243
259
.
2.
Carmona
R.
, and
Keyhani
M.
,
1989
, “
The Cavity Width Effect on Immersion Cooling of Discrete Flush-Heaters on One Vertical Wall of an Enclosure Cooled From the Top
,”
ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol.
111
, pp.
268
276
.
3.
Chen
L.
,
Keyhani
M.
, and
Pitts
D. R.
,
1991
, “
An Experimental Study of Natural Convection Heat Transfer in a Rectangular Enclosure with Protruding Heaters
,”
AIAA Journal of Thermophysics and Heat Transfer
, Vol.
5
, pp.
217
223
.
4.
FIDAP Theoretical Manual, 1993, Fluid Dynamics International, Evanston, IL.
5.
Incropera
F. P.
,
1988
, “
Convection Heat Transfer in Electronic Equipment Cooling
,”
ASME Journal of Heat Transfer
, Vol.
110
, pp.
1091
1111
.
6.
Jaluria
Y.
,
1985
, “
Interaction of Natural Convection Wakes Arising from Thermal Sources on a Vertical Surface
,”
ASME Journal of Heat Transfer
, Vol.
107
, pp.
883
892
.
7.
Joshi, Y., Kelleher, M. D., and Benedict, T. J., 1988, “Natural Convection Immersion Cooling of an Array of Simulated Electronic Components in an Enclosure Filled with Dielectric Fluid,” Proceedings, International Heat Transfer Conference, Yugoslavia.
8.
Joshi
Y.
,
Wilson
T.
, and
Hazard
S. J.
,
1989
, “
An Experimental Study of Natural Convection Cooling of an Array of Heated Protrusions in a Vertical Channel of Water
,”
ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol.
111
, pp.
33
40
.
9.
Kelleher, M. D., Knock, R. H., and Yang, K. T., 1987, “Laminar Natural Convection in a Rectangular Enclosure due to a Heated Protrusion on One Vertical Wall- Part I: Experimental Investigation,” Proceedings, 2nd ASME/JSME Thermal Engineering Joint Conference, Honolulu, Hawaii, Vol. 2, pp. 169–177.
10.
Keyhani
M.
,
Prasad
V.
, and
Cox
R.
,
1988
, “
An Experimental Study of Natural Convection in a Vertical Cavity with Discrete Heat Sources
,”
ASME Journal of Heat Transfer
, Vol.
110
, pp.
616
624
.
11.
Keyhani
M.
,
Chen
L.
, and
Pitts
D. R.
,
1991
, “
The Aspect Ratio Effect on Natural Convection in an Enclosure with Protruding Heat Sources
,”
ASME Journal of Heat Transfer
, Vol.
113
, pp.
883
891
.
12.
Kuhn, D., and Oosthuzien, P. H., 1986, “Three-dimensional Transient Natural Convective Flow in a Rectangular Enclosure with Localized Heating,” Natural Convection in Enclosures-1986, ASME HTD, Vol. 63, pp. 55–62.
13.
Lee, J. J., Liu, K. V., Yang, K. T., and Kelleher, M. D., 1987, “Laminar Natural Convection in a Rectangular Enclosure due to a Heated Protrusion on One Vertical Wall- Part II: Numerical Simulations,” Proceedings, 2nd ASME/JSME Thermal Engineering Joint Conference, Honolulu, Hawaii, Vol. 2, pp. 179–185.
14.
Liu, K. V., Yang, K. T., and Kelleher, M. D., 1987, “Three Dimensional Natural Convective Cooling of an Array of Heated Protrusions in an Enclosure filled with a Dielectric Fluid,” Proceedings, International Symposium on Cooling Technology for Electronic Equipment, Honolulu, Hawaii, pp. 486–497.
15.
Ozoe, H., 1987, “The Development of a Computational Scheme for Natural Convection in an Enclosure with Multiple Isolated Heat Sources,” Proceedings of the International Symposium of Cooling Technology for Electronic Equipment, Honolulu, Hawaii, pp. 522–534.
16.
Prasad
V.
,
Keyhani
M.
, and
Shen
R.
,
1990
, “
Free Convection in a Discretely Heated Vertical Enclosure: Effects of Prandtl number and Cavity Size
,”
ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol.
112
, pp.
63
74
.
17.
Rajakumar
C.
, and
Johnson
D.
,
1989
, “
Finite Element Predictions of Free Convection Heat Transfer Coefficients of Simulated Electronic Circuit Boards
,”
ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol.
111
, pp.
129
134
.
18.
Steinberg, D. S., 1980, Cooling Techniques for Electronic Equipment, Wiley Interscience Publication.
19.
Turner
B. L.
, and
Flack
R. D.
,
1980
, “
The Experimental Measurement of Natural Convective Heat Transfer in Rectangular Enclosures with Concentrated Energy Sources
,”
ASME Journal of Heat Transfer
, Vol.
102
, pp.
236
241
.
20.
Vafai
K.
, and
Ettefagh
J.
,
1990
a, “
The Effects of Sharp Corners on Buoyancy-Driven Flows With Particular Emphasis on Outer Boundaries
,”
International Journal of Heat and Mass Transfer
, Vol.
33
, pp.
2311
2328
.
21.
Vafai
K.
, and
Ettefagh
J.
,
1990
b, “
Thermal and Fluid Flow Instabilities in Buoyancy-Driven Flows in Open-Ended Cavities
,”
International Journal of Heat and Mass Transfer
, Vol.
33
, pp.
2329
2344
.
This content is only available via PDF.
You do not currently have access to this content.