A z-axis anisotropic electrically conducting polymer-matrix composite film was developed. It comprised 25 volume percent copper coated polyether sulfone particles and a polyimidesiloxane matrix. Each particle protruded from both sides of the film and provided a conducting path along the z-axis. A z-axis pressure of 40 kPa resulted in a z-axis electrical resistivity of 2 Ω · cm for the overall film (i.e., 0.5 Ω · cm for a conducting path); subsequent pressure removal caused the resistivity to rise to 7 Ω · cm only. The film exhibited negligible stress relaxation and a low modulus of 1.67 GPa.

1.
Iscoff, R., Semiconductor International, May 1990.
2.
Advanced IC Packaging, Electronic Trend Publications, 1990, p. 2.
3.
Tummala, R., and Rymarszewski, E., “Controlled Collapse Chip Connection,” Micro-Electronic Packaging Handbook, Van Nostrand Reinhold, ed., 1989, p. 366.
4.
Fulton; J. A., Horton, D. R., Moore, R. C., Lambert, W. R., and Mottine, J. J., Proc. 33th Electronic Components Conf., May 1989, p. 71.
5.
Hogerton
P. B.
,
Hall
J. B.
,
Pujol
J. M.
, and
Reylek
R. S.
,
Mat. Res. Soc. Symp. Proc.
, Vol.
154
,
1989
, p.
415
415
.
6.
Tead, S. F., DARPA Physical Electronic Packaging 1992 Program Review, Arlington, VA, Feb. 4, 1992.
7.
Chung, K., Dreier, G., Fitzgerald, P., Boyle, A., Lin, M., and Sager, J., Proc. 41st Electronic Components Conf., May 1991, p. 345.
8.
Lee, C. J., 32nd Int. SAMPE Symposium, April 1987, p. 576.
9.
Lee, C. J., 1st Int. SAMPE Electronic Mater. and Proc. Conf., June 1987, p. 523.
This content is only available via PDF.
You do not currently have access to this content.