This paper describes the life assessment of flip chip joints. Flip chip joints of 63Sn-37Pb and 5Sn-95Pb solders on a printed circuit board were stressed thermally for fatigue. Fatigue lives of the joints were determined by an electrical potential drop method and the effect of encapsulation on fatigue life was discussed. The encapsulation had a significant effect of prolonging the fatigue life of the joints. Thermo-mechanical finite element analyses proved that the encapsulation lowered the strain amplitude of the joints by distributing the strain over a whole package and bending effect. Cracking location was also discussed in relation with the strain concentration in the joints. Fatigue lives of the flip chip joints were compared with those of bulk round bar specimens and the difference in fatigue life between two types of specimens was discussed from the specimen dimensions and ratchet effect. [S1043-7398(00)00203-6]
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September 2000
Technical Papers
Fatigue Life Analysis of Solder Joints in Flip Chip Bonding
Yutaka Tsukada,
Yutaka Tsukada
Yasu Technology Application Laboratory, IBM, 800 Ichimiyake, Yasu-cho, Yasu-gun, Shiga-ken 520-23 Japan
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Hideo Nishimura,
Hideo Nishimura
Yasu Technology Application Laboratory, IBM, 800 Ichimiyake, Yasu-cho, Yasu-gun, Shiga-ken 520-23 Japan
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Masao Sakane,
Masao Sakane
Department of Mechanical Engineering, Faculty of Science and Engineering, Ritsumeikan University, 1916 Noji-cho, Kusatsu-shi, Shiga-ken 525 Japan
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Masateru Ohnami
Masateru Ohnami
Department of Mechanical Engineering, Faculty of Science and Engineering, Ritsumeikan University, 1916 Noji-cho, Kusatsu-shi, Shiga-ken 525 Japan
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Yutaka Tsukada
Yasu Technology Application Laboratory, IBM, 800 Ichimiyake, Yasu-cho, Yasu-gun, Shiga-ken 520-23 Japan
Hideo Nishimura
Yasu Technology Application Laboratory, IBM, 800 Ichimiyake, Yasu-cho, Yasu-gun, Shiga-ken 520-23 Japan
Masao Sakane
Department of Mechanical Engineering, Faculty of Science and Engineering, Ritsumeikan University, 1916 Noji-cho, Kusatsu-shi, Shiga-ken 525 Japan
Masateru Ohnami
Department of Mechanical Engineering, Faculty of Science and Engineering, Ritsumeikan University, 1916 Noji-cho, Kusatsu-shi, Shiga-ken 525 Japan
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EEPD November 1997; revised manuscript received November 1999. Associate Technical Editor: Yi-Hsin Pao.
J. Electron. Packag. Sep 2000, 122(3): 207-213 (7 pages)
Published Online: November 1, 1999
Article history
Received:
November 1, 1997
Revised:
November 1, 1999
Citation
Tsukada , Y., Nishimura, H., Sakane , M., and Ohnami, M. (November 1, 1999). "Fatigue Life Analysis of Solder Joints in Flip Chip Bonding ." ASME. J. Electron. Packag. September 2000; 122(3): 207–213. https://doi.org/10.1115/1.1286002
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