Power dissipation in electronic devices is projected to increase over the next to the range of per chip for high performance applications. One of the primary obstacles to the thermal management of devices operating at such high powers is the thermal resistance between the device and the heat spreader or heat sink that it is attached to. Typically the in situ thermal conductivity of interface materials is in the range of , even though the bulk thermal conductivity of the material may be significantly higher. In an attempt to improve the effective in situ thermal conductivity of interface materials nanoparticles and nanotubes are being considered as a possible addition to such interfaces. This paper presents the results of a numerical study of transport in a thermal interface material that is enhanced with carbon nanotubes. The results from the numerical solution are in excellent agreement with an analytical model (Desai, A., Geer, J., and Sammakia, B., “Models of Steady Heat Conduction in Multiple Cylindrical Domains,” J. Electron. Packaging (to be published)) of the same geometry. Wide ranges of parametric studies were conducted to examine the effects of the thermal conductivity of the different materials, the geometry, and the size of the nanotubes. An estimate of the effective thermal conductivity of the carbon nanotubes was used, obtained from a molecular dynamics analysis (Mahajan, S., Subbarayan, G., Sammakia, B. G., and Jones, W., 2003, Proceedings of the 2003 ASME International Mechanical Engineering Congress and Exposition, Washington, D.C., Nov. 15–21). The numerical analysis was used to estimate the impact of imperfections in the nanotubes upon the overall system performance. Overall the nanotubes are found to significantly improve the thermal performance of the thermal interface material. The results show that varying the diameter of the nanotube and the percentage of area occupied by the nanotubes does not have any significant effect on the total temperature drop.
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March 2006
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A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes
Anand Desai,
e-mail: adesai0@binghamton.edu
Anand Desai
Binghamton University
, P.O. Box 6000, Vestal Pkwy East, Binghamton, NY 13790
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Sanket Mahajan,
Sanket Mahajan
School of Mechanical Engineering, 585 Purdue Mall,
Purdue University
, West Lafayette, IN 47907-2088
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Ganesh Subbarayan,
Ganesh Subbarayan
School of Mechanical Engineering, 585 Purdue Mall,
e-mail: ganeshs@purdue.edu
Purdue University
, West Lafayette, IN 47907-2088
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Wayne Jones,
Wayne Jones
Binghamton University
, P.O. Box 6000, Vestal Pkwy East, Binghamton, NY 13790
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James Geer,
James Geer
Binghamton University
, P.O. Box 6000, Vestal Pkwy East, Binghamton, NY 13790
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Bahgat Sammakia
Bahgat Sammakia
Binghamton University
, P.O. Box 6000, Vestal Pkwy East, Binghamton, NY 13790
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Anand Desai
Binghamton University
, P.O. Box 6000, Vestal Pkwy East, Binghamton, NY 13790e-mail: adesai0@binghamton.edu
Sanket Mahajan
School of Mechanical Engineering, 585 Purdue Mall,
Purdue University
, West Lafayette, IN 47907-2088
Ganesh Subbarayan
School of Mechanical Engineering, 585 Purdue Mall,
Purdue University
, West Lafayette, IN 47907-2088e-mail: ganeshs@purdue.edu
Wayne Jones
Binghamton University
, P.O. Box 6000, Vestal Pkwy East, Binghamton, NY 13790
James Geer
Binghamton University
, P.O. Box 6000, Vestal Pkwy East, Binghamton, NY 13790
Bahgat Sammakia
Binghamton University
, P.O. Box 6000, Vestal Pkwy East, Binghamton, NY 13790J. Electron. Packag. Mar 2006, 128(1): 92-97 (6 pages)
Published Online: May 10, 2005
Article history
Received:
July 23, 2004
Revised:
May 10, 2005
Citation
Desai, A., Mahajan, S., Subbarayan, G., Jones, W., Geer, J., and Sammakia, B. (May 10, 2005). "A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes." ASME. J. Electron. Packag. March 2006; 128(1): 92–97. https://doi.org/10.1115/1.2161231
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