Solder joint reliability in drop test is crucial for handheld systems, such as mobile phone, digital camera, and MP3 player. In recent years, a lot of experiments and simulations have been carried out by researchers to study board level drop test, and many useful results have been obtained. Regarding mechanical simulation and analysis, there are still two challenges: How to design drop test printed circuit board (PCB) based on dynamic simulation and analysis? How to get accurate elastic modulus of PCB, especially damping parameters, as property inputs for drop test simulation? In this study, an approach based on systematic modal tests and analyses is used to address these two challenges. First, modal dynamic simulation is used to design the test board to meet drop test requirements. Second, modal tests are conducted on drop test board in order to validate dynamic simulation and measure structural damping parameters and overall board elastic modulus as well. Adopted directly in drop test simulation, the measured damping parameters and elastic modulus are proved to be accurate. It is verified through comparison between the finite element simulation and real drop test results. With the modal tests and simulation method established here, drop simulation becomes very simple and accurate, and test board design and characterization are also simplified. Thus, considerable drop test experiment and simulation fine tune, and validation work can be saved.
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e-mail: fangl@sjtu.edu.cn
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June 2008
Research Papers
Board Level Drop Test Analysis Based on Modal Test and Simulation
Fang Liu,
Fang Liu
State Key Laboratory of Mechanical System and Vibration,
e-mail: fangl@sjtu.edu.cn
Shanghai Jiao Tong University
, 800 Dongchuan Road, Shanghai 200240, P.R.C.
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Guang Meng,
Guang Meng
State Key Laboratory of Mechanical System and Vibration,
Shanghai Jiao Tong University
, 800 Dongchuan Road, Shanghai 200240, P.R.C.
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Mei Zhao,
Mei Zhao
State Key Laboratory of Mechanical System and Vibration,
Shanghai Jiao Tong University
, 800 Dongchuan Road, Shanghai 200240, P.R.C.
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Junfeng Zhao
Junfeng Zhao
Intel Technology Development (Shanghai) Co., Ltd.
, 999 Yinglun Road, Shanghai 200131, P.R.C.
Search for other works by this author on:
Fang Liu
State Key Laboratory of Mechanical System and Vibration,
Shanghai Jiao Tong University
, 800 Dongchuan Road, Shanghai 200240, P.R.C.e-mail: fangl@sjtu.edu.cn
Guang Meng
State Key Laboratory of Mechanical System and Vibration,
Shanghai Jiao Tong University
, 800 Dongchuan Road, Shanghai 200240, P.R.C.
Mei Zhao
State Key Laboratory of Mechanical System and Vibration,
Shanghai Jiao Tong University
, 800 Dongchuan Road, Shanghai 200240, P.R.C.
Junfeng Zhao
Intel Technology Development (Shanghai) Co., Ltd.
, 999 Yinglun Road, Shanghai 200131, P.R.C.J. Electron. Packag. Jun 2008, 130(2): 021007 (6 pages)
Published Online: May 8, 2008
Article history
Received:
March 30, 2007
Revised:
September 10, 2007
Published:
May 8, 2008
Citation
Liu, F., Meng, G., Zhao, M., and Zhao, J. (May 8, 2008). "Board Level Drop Test Analysis Based on Modal Test and Simulation." ASME. J. Electron. Packag. June 2008; 130(2): 021007. https://doi.org/10.1115/1.2912212
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