The ubiquitous eutectic tin-lead (Sn–Pb) solder alloys are soon to be replaced with lead-free alternatives. In light of this transition, new computational tools for predicting the fatigue life of lead-free solders are required. A fatigue life prediction methodology was developed, based on stress-strain, creep, and isothermal fatigue data; the latter generated using a double lap-shear (DLS) test assembly. The proposed fatigue life prediction methodology builds on current practices in fatigue prediction for solder alloys, particularly the concepts of unpartitioned energy methods in finite element analysis (FEA) and continuum damage mechanics. As such, the current state of these fields is briefly discussed. Next, the global and local FEA simulations of the DLS test assembly are detailed. A correlation is then made between the empirical data and the FEA simulations. A general fatigue life prediction methodology is next described in detail. Finally, this methodology is tested and verified against the empirical data.
Skip Nav Destination
Article navigation
March 2009
Research Papers
A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects
David M. Pierce,
David M. Pierce
Department of Mechanical Engineering,
Stanford University
, Stanford, CA 94305
Search for other works by this author on:
Sheri D. Sheppard,
Sheri D. Sheppard
Department of Mechanical Engineering,
Stanford University
, Stanford, CA 94305
Search for other works by this author on:
Paul T. Vianco
Paul T. Vianco
Sandia National Laboratories
, Albuquerque, NM 87185
Search for other works by this author on:
David M. Pierce
Department of Mechanical Engineering,
Stanford University
, Stanford, CA 94305
Sheri D. Sheppard
Department of Mechanical Engineering,
Stanford University
, Stanford, CA 94305
Paul T. Vianco
Sandia National Laboratories
, Albuquerque, NM 87185J. Electron. Packag. Mar 2009, 131(1): 011008 (11 pages)
Published Online: February 13, 2009
Article history
Received:
August 8, 2007
Revised:
August 9, 2008
Published:
February 13, 2009
Citation
Pierce, D. M., Sheppard, S. D., and Vianco, P. T. (February 13, 2009). "A General Methodology to Predict Fatigue Life in Lead-Free Solder Alloy Interconnects." ASME. J. Electron. Packag. March 2009; 131(1): 011008. https://doi.org/10.1115/1.3068313
Download citation file:
Get Email Alerts
Cited By
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Related Articles
Validation of a General Fatigue Life Prediction Methodology for Sn–Ag–Cu Lead-Free Solder Alloy Interconnects
J. Electron. Packag (March,2008)
Isothermal Cyclic Bend Fatigue Test Method for Lead-Free Solder Joints
J. Electron. Packag (December,2007)
Development of the Damage State Variable for a Unified Creep Plasticity Damage Constitutive Model of the 95.5Sn–3.9Ag–0.6Cu Lead-Free Solder
J. Electron. Packag (March,2008)
A Global–Local Approach for Mechanical Deformation and Fatigue
Durability of Microelectronic Packaging Systems
J. Electron. Packag (June,2007)
Related Proceedings Papers
Related Chapters
Fatigue Analysis in the Connecting Rod of MF285 Tractor by Finite Element Method
International Conference on Advanced Computer Theory and Engineering, 4th (ICACTE 2011)
Understanding the Problem
Design and Application of the Worm Gear
Industrially-Relevant Multiscale Modeling of Hydrogen Assisted Degradation
International Hydrogen Conference (IHC 2012): Hydrogen-Materials Interactions