This paper proposes a method to estimate basic material constants in an elasto-plastic-creep constitutive model for lead-free solders by conducting only a tensile test. The test employs a stepped ramp wave loading, which repeats instantaneous strain and strain maintenance. Time-independent strains are obtained from the stress-strain relations at the instantaneously strained parts, while the time-dependent strains are obtained from the stress-time relations during the strain maintaining periods. Based on the obtained time-independent and time-dependent strains, the values of the material constants in the elasto-plastic-creep model proposed by the authors are determined. Simulations of the viscoplastic deformations of a Sn–3.0Ag–0.5Cu solder alloy are also conducted to verify the validity of the proposed method.
Skip Nav Destination
e-mail: ken@ipc.akita-u.ac.jp
Article navigation
June 2009
Research Papers
Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test
Ken-ichi Ohguchi,
Ken-ichi Ohguchi
Department of Materials Science and Engineering,
e-mail: ken@ipc.akita-u.ac.jp
Akita University
, Tegatagakuen-cho 1-1, Akita 010-8502, Japan
Search for other works by this author on:
Katsuhiko Sasaki,
Katsuhiko Sasaki
Division of Human Mechanical Systems and Design,
Hokkaido University
, N13 W8 Kita-ku, Sapporo 060-8628, Japan
Search for other works by this author on:
Setsuo Aso
Setsuo Aso
Department of Materials Science and Engineering,
Akita University
, Tegatagakuen-cho 1-1, Akita 010-8502, Japan
Search for other works by this author on:
Ken-ichi Ohguchi
Department of Materials Science and Engineering,
Akita University
, Tegatagakuen-cho 1-1, Akita 010-8502, Japane-mail: ken@ipc.akita-u.ac.jp
Katsuhiko Sasaki
Division of Human Mechanical Systems and Design,
Hokkaido University
, N13 W8 Kita-ku, Sapporo 060-8628, Japan
Setsuo Aso
Department of Materials Science and Engineering,
Akita University
, Tegatagakuen-cho 1-1, Akita 010-8502, JapanJ. Electron. Packag. Jun 2009, 131(2): 021003 (7 pages)
Published Online: March 27, 2009
Article history
Received:
May 9, 2008
Revised:
November 26, 2008
Published:
March 27, 2009
Citation
Ohguchi, K., Sasaki, K., and Aso, S. (March 27, 2009). "Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test." ASME. J. Electron. Packag. June 2009; 131(2): 021003. https://doi.org/10.1115/1.3103951
Download citation file:
Get Email Alerts
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag
Enhancing Mechanical Reliability of Silver-Sintered Joints With Copper Nanowires in High-Power Electronic Devices
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag (December 2024)
Related Articles
Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling
J. Electron. Packag (December,2001)
Experimental Observation of Correlation Between Creep and Uniaxial Ratchetting of Sn ∕ 37 Pb and Sn ∕ 3 Ag ∕ 0.5 Cu Solder Alloys
J. Electron. Packag (March,2007)
Time-Independent and Time-Dependent Inelastic Strain Analysis of Lead-Free Solder by Cyclic Loading Test Using Stepped Ramp Waves
J. Electron. Packag (December,2010)
Behavior of Lead-Free Solder Under Thermomechanical Loading
J. Electron. Packag (September,2004)
Related Proceedings Papers
Related Chapters
Polycrystalline Simulations of In-Reactor Deformation of Zircaloy-4 Cladding Tubes during Nominal Operating Conditions
Zirconium in the Nuclear Industry: 20th International Symposium
Analysis of Components: Strain- and Deformation-Controlled Limits
Design & Analysis of ASME Boiler and Pressure Vessel Components in the Creep Range
Basic Concepts
Design & Analysis of ASME Boiler and Pressure Vessel Components in the Creep Range