We have investigated a novel hybrid nanocomposite thermal interface material (TIM) that consists of silver nanoparticles (AgNPs), silver nanoflakes (AgNFs), and copper microparticles (CuMPs). Continuous metallic network form while AgNPs and AgNFs fuse to join bigger CuMPs upon hot compression, resulting in superior thermal and mechanical performances. The assembly temperature is as low as 125 °C due to the size effect of silver nanoparticulates. The thermal conductivity, k, of the hybrid nanocomposite TIMs is found to be in the range of 15–140 W/mK, exceeding best-performing commercial thermal greases, while comparable to high-end solder TIMs. The dependence of k on the solid packing density and the volume fraction of voids is discussed through comparing to model predictions.
Skip Nav Destination
Article navigation
September 2018
Research-Article
Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density
Tingting Zhang,
Tingting Zhang
Department of Mechanical Engineering,
Institute for Materials Research,
Binghamton University,
State University of New York,
Binghamton, NY 13902
Institute for Materials Research,
Binghamton University,
State University of New York,
Binghamton, NY 13902
Search for other works by this author on:
Bahgat G. Sammakia,
Bahgat G. Sammakia
Department of Mechanical Engineering,
Institute for Materials Research,
Binghamton University,
State University of New York,
Binghamton, NY 13902
Institute for Materials Research,
Binghamton University,
State University of New York,
Binghamton, NY 13902
Search for other works by this author on:
Zhihao Yang,
Zhihao Yang
School of Materials Science and
Energy Engineering,
Foshan University,
Foshan 528000, Guangdong, China
Energy Engineering,
Foshan University,
Foshan 528000, Guangdong, China
Search for other works by this author on:
Howard Wang
Howard Wang
Department of Mechanical Engineering,
Institute for Materials Research,
Binghamton University,
State University of New York,
Binghamton, NY 13902;
Institute for Materials Research,
Binghamton University,
State University of New York,
Binghamton, NY 13902;
Department of Materials
Science and Engineering,
University of Maryland,
College Park, MD 20742
e-mails: wangh@umd.edu; pvtech@qq.com
Science and Engineering,
University of Maryland,
College Park, MD 20742
e-mails: wangh@umd.edu; pvtech@qq.com
Search for other works by this author on:
Tingting Zhang
Department of Mechanical Engineering,
Institute for Materials Research,
Binghamton University,
State University of New York,
Binghamton, NY 13902
Institute for Materials Research,
Binghamton University,
State University of New York,
Binghamton, NY 13902
Bahgat G. Sammakia
Department of Mechanical Engineering,
Institute for Materials Research,
Binghamton University,
State University of New York,
Binghamton, NY 13902
Institute for Materials Research,
Binghamton University,
State University of New York,
Binghamton, NY 13902
Zhihao Yang
School of Materials Science and
Energy Engineering,
Foshan University,
Foshan 528000, Guangdong, China
Energy Engineering,
Foshan University,
Foshan 528000, Guangdong, China
Howard Wang
Department of Mechanical Engineering,
Institute for Materials Research,
Binghamton University,
State University of New York,
Binghamton, NY 13902;
Institute for Materials Research,
Binghamton University,
State University of New York,
Binghamton, NY 13902;
Department of Materials
Science and Engineering,
University of Maryland,
College Park, MD 20742
e-mails: wangh@umd.edu; pvtech@qq.com
Science and Engineering,
University of Maryland,
College Park, MD 20742
e-mails: wangh@umd.edu; pvtech@qq.com
1Corresponding authors.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received October 15, 2017; final manuscript received April 9, 2018; published online June 11, 2018. Assoc. Editor: Eric Wong.
J. Electron. Packag. Sep 2018, 140(3): 031006 (8 pages)
Published Online: June 11, 2018
Article history
Received:
October 15, 2017
Revised:
April 9, 2018
Citation
Zhang, T., Sammakia, B. G., Yang, Z., and Wang, H. (June 11, 2018). "Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density." ASME. J. Electron. Packag. September 2018; 140(3): 031006. https://doi.org/10.1115/1.4040204
Download citation file:
Get Email Alerts
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Related Articles
Thermal Conductivity of Single-Walled Carbon Nanotube/PMMA Nanocomposites
J. Heat Transfer (August,2007)
Nanothermal Interface Materials: Technology Review and Recent Results
J. Electron. Packag (December,2015)
Modeling the Thermal Conductivity and Phonon Transport in
Nanoparticle Composites Using Monte Carlo Simulation
J. Heat Transfer (April,2008)
Special Section on InterPACK 2013
J. Electron. Packag (December,2014)
Related Proceedings Papers
Related Chapters
Natural Gas Transmission
Pipeline Design & Construction: A Practical Approach, Third Edition
Optimization of an Irregular 2D Packing Problem by a Genetic-Based Heuristic Algorithm
International Conference on Computer and Automation Engineering, 4th (ICCAE 2012)
The Thermo —Mechanical Analysis of Mechanical Packing (SEAL), Using Finite Element Method (FEM) — Results and Conclusions
International Conference on Mechanical Engineering and Technology (ICMET-London 2011)