Abstract
Sintered copper nanoparticles are being considered as alternatives to solder and/or sintered silver in different applications. Like for the alternatives, the interpretation of accelerated fatigue test results does however require modeling, typically involving prediction of stresses and strains versus time and temperature based on constitutive relations. This poses a challenge as the inelastic deformation properties depend strongly on both the initial particles and details of the processing, i.e., unlike for solder general constitutive relations are not possible. This work provides a mechanistic description of the early transient creep of relevance in cycling, including effects of sintering parameters and subsequent oxidation. Inelastic deformation is dominated by diffusion, rather than dislocation motion. Generalized constitutive relations are provided to the extent that quantitative modeling of a specific structure only requires the measurement of a single creep curve for that.
Issue Section:
Research Papers
References
1.
Lu
,
M.
,
Shih
,
D. Y.
,
Lauro
,
P.
,
Goldsmith
,
C.
, and
Henderson
,
D.
, 2008
, “
Effect of Sn Grain Orientation on Electromigration Degradation Mechanism in High Sn-Based Pb-Free Solders
,” Appl. Phys. Lett.
,
92
(21
), p. 211909
.10.1063/1.29369962.
Ouyang
,
F. Y.
,
Hsu
,
H.
,
Su
,
Y. P.
, and
Chang
,
T. C.
, 2012
, “
Electromigration Induced Failure on Lead-Free Micro Bumps in Three-Dimensional Integrated Circuits Packaging
,” J. Appl. Phys.
,
112
(2
), p. 023505
.10.1063/1.47371543.
Chang
,
Y. W.
,
Chen
,
C.
,
Chang
,
T. C.
,
Zhan
,
C. J.
,
Juang
,
J. Y.
, and
Huang
,
A. T.
, 2014
, “
Fast Phase Transformation Due to Electromigration of 18 μm Microbumps in Three-Dimensional Integrated-Circuit Integration
,” Mater. Lett.
,
137
, pp. 136
–138
.10.1016/j.matlet.2014.08.1564.
Li
,
M.
,
Li
,
Z.
,
Xiao
,
Y.
, and
Wang
,
C.
, 2013
, “
Rapid Formation of Cu/Cu3Sn/Cu Joints Using Ultrasonic Bonding Process at Ambient Temperature
,” Appl. Phys. Lett.
,
102
(9
), p. 094104
.10.1063/1.47946845.
Lin
,
Y. M.
,
Zhan
,
C. J.
,
Juang
,
J. Y.
,
Lau
,
J. H.
,
Chen
,
T. H.
,
Lo
,
R.
,
Kao
,
M.
,
Tian
,
T.
, and
Tu
,
K. N.
, 2011
, “
Electromigration in Ni/Sn Intermetallic Micro Bump Joint for 3D IC Chip Stacking
,” IEEE 61st Electronic Components and Technology Conference (ECTC
),
IEEE
, Lake Buena Vista, FL
, May 31–June 3, pp. 351
–357
.10.1109/ECTC.2011.58985376.
Liang
,
Y. C.
,
Chen
,
C.
, and
Tu
,
K. N.
, 2012
, “
Side Wall Wetting Induced Void Formation Due to Small Solder Volume in Microbumps of Ni/SnAg/Ni Upon Reflow
,” ECS Solid State Lett.
,
1
(4
), pp. P60
–P62
.10.1149/2.002204ssl7.
Njuki
,
M.
,
Thekkut
,
S.
,
Das
,
R.
,
Shahane
,
N.
,
Thompson
,
P.
,
Mirpuri
,
K.
,
Borgesen
,
P.
, and
Dimitrov
,
N.
, 2022
, “
Understanding and Preventing Cu–Sn Micro Joint Defects Through Design and Process Control
,” J. Appl. Electrochem.
,
52
(2
), pp. 259
–271
.10.1007/s10800-021-01630-58.
Njuki
,
M.
,
Thekkut
,
S.
,
Sivasubramony
,
R.
,
Greene
,
C. M.
,
Shahane
,
N.
,
Thompson
,
P.
,
Mirpuri
,
K.
,
Borgesen
,
P.
, and
Dimitrov
,
N.
, 2022
, “
Enhanced Voiding in Cu-Sn Micro Joints
,” Mater. Res. Bull.
,
150
, p. 111759
.10.1016/j.materresbull.2022.1117599.
Tang
,
Y.
,
Chang
,
Y.
, and
Chen
,
K. N.
, 2012
, “
Wafer-Level Cu–Cu Bonding Technology
,” Microelectron. Reliab.
,
52
(2
), pp. 312
–320
.10.1016/j.microrel.2011.04.01610.
Sosa
,
R. A.
,
Nguyen
,
M. K. L.
,
Tummala
,
R.
,
Antoniou
,
A.
, and
Smet
,
V.
, 2019
, “
Cu Pillar With Nanocopper Caps: The Next Interconnection Node Beyond Traditional Cu Pillar
,” IEEE 69th Electronic Components and Technology Conference (ECTC
), Las Vegas, NV, May 28–31, pp. 655
–660
.10.1109/ECTC.2019.0010411.
Zinn
,
A.
,
Stoltenberg
,
R.
,
Fried
,
A.
,
Chang
,
J.
,
Elhawary
,
A.
,
Beddow
,
J.
, and
Chiu
,
F.
, 2012
, “
NanoCopper Based Solder-Free Electronic Assembly Material
,” Nanotechnology
,
2
, pp. 71
–74
.https://www.circuitinsight.com/pdf/nano_copper_ipc.pdf12.
Zürcher
,
J.
,
Yu
,
K.
,
Schlottig
,
G.
,
Baum
,
M.
,
Taklo
,
M. M. V.
,
Wunderle
,
B.
,
Warszyński
,
P.
, and
Brunschwiler
,
T.
, 2015
, “
Nanoparticle Assembly and Sintering Towards All-Copper Flip Chip Interconnects
,” 2015 IEEE 65th Electronic Components and Technology Conference (ECTC
),
IEEE
, San Diego, CA
, May 26–29, pp. 1115
–1121
.10.1109/ECTC.2015.715973413.
Jianfeng
,
Y.
,
Guisheng
,
Z.
,
Anming
,
H.
, and
Zhou
,
Y. N.
, 2011
, “
Preparation of PVP Coated Cu NPs and the Application for Low-Temperature Bonding
,” J. Mater. Chem.
,
21
(40
), pp. 15981
–15986
.10.1039/c1jm12108a14.
Ishizaki
,
T.
, and
Watanabe
,
R.
, 2012
, “
A New One-Pot Method for the Synthesis of Cu Nanoparticles for Low Temperature Bonding
,” J. Mater. Chem.
,
22
(48
), pp. 25198
–25206
.10.1039/c2jm34954j15.
Chen
,
T.
, and
Siow
,
K.
, 2021
, “
Comparing the Mechanical and Thermal-Electrical Properties of Sintered Copper (Cu) and Sintered Silver (Ag) Joints
,” J. Alloys Compd.
,
866
, p. 158783
.10.1016/j.jallcom.2021.15878316.
Riva
,
R.
,
Buttay
,
C.
,
Allard
,
B.
, and
Bevilacqua
,
P.
, 2013
, “
Migration Issues in Sintered-Silver Die Attaches Operating at High Temperature
,” Microelectron. Reliab.
,
53
(9–11
), pp. 1592
–1596
.10.1016/j.microrel.2013.07.10317.
Sivasubramony
,
R. S.
,
Kokash
,
M. Z.
,
Thekkut
,
S.
,
Shahane
,
N.
,
Thompson
,
P.
,
Mirpuri
,
K.
,
Kawana
,
Y.
,
Greene
,
C. M.
, and
Borgesen
,
P.
, 2022
, “
Fatigue of Copper Nanoparticle Based Joints and Bonds
,” ASME J. Electron. Packag.
,
144
(1
), p. 011007
.10.1115/1.405087118.
Hsieh
,
M.-C.
,
Yu
,
C.-K.
, and
Wu
,
S.-T.
, 2010
, “
Thermo-Mechanical Simulative Study for 3D Vertical Stacked IC Packages With Spacer Structures
,” 26th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM
), Santa Clara, CA, Feb. 21–25, pp. 47
–54
.10.1109/STHERM.2010.544431419.
Wang
,
Y.
,
Watanabe
,
A. O.
,
Ogura
,
N.
,
Raj
,
P. M.
, and
Tummala
,
R.
, 2020
, “
Sintered Nanocopper Paste for High-Performance 3D Heterogeneous Package Integration
,” J. Electron. Mater.
,
49
(11
), pp. 6737
–6745
.10.1007/s11664-020-08399-x20.
Cheng
,
B.
, and
Ngan
,
A. H.
, 2013
, “
The Crystal Structures of Sintered Copper Nanoparticles: A Molecular Dynamics Study
,” Int. J. Plasticity
,
47
, pp. 65
–79
.10.1016/j.ijplas.2013.01.00621.
Thekkut
,
S.
,
Kokash
,
M. Z.
,
Sivasubramony
,
R. S.
,
Kawana
,
Y.
,
Mirpuri
,
K.
,
Shahane
,
N.
,
Thompson
,
P.
,
Greene
,
C. M.
, and
Borgesen
,
P.
, 2022
, “
Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds
,” ASME J. Electron. Packag.
,
144
(3
), p. 031009
.10.1115/1.405172822.
Zhu
,
H.
, 1996
, “
Sintering Processes of Two Nanoparticles: A Study by Molecular Dynamics Simulations
,” Philos. Mag. Lett.
,
73
(1
), pp. 27
–33
.10.1080/09500839618107323.
Darveaux
,
R.
, and
Banerji
,
K.
, 1992
, “
Constitutive Relations for Tin-Based-Solder Joints
,” Proceedings 42nd Electronic Components & Technology Conference
, San Diego, CA, May 18–20, pp. 538
–551
.10.1109/33.20692524.
Motalab
,
M.
,
Cai
,
Z.
,
Suhling
,
J. C.
, and
Lall
,
P.
, 2012
, “
Determination of Anand Constants for SAC Solders Using Stress-Strain or Creep Data
,” 13th Inter Society Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
,
IEEE
, San Diego, CA
, May 30–June 1, pp. 910
–922
.10.1109/ITHERM.2012.623152225.
Wang
,
G. Z.
,
Cheng
,
Z. N.
,
Becker
,
K.
, and
Wilde
,
J.
, 2001
, “
Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys
,” ASME J. Electron. Packag.
,
123
(3
), pp. 247
–253
.10.1115/1.137178126.
Rodgers
,
B.
,
Flood
,
B.
,
Punch
,
J.
, and
Waldron
,
F.
, 2005
, “
Determination of the Anand Viscoplasticity Model Constants for SnAgCu
,” ASME
Paper No. IPACK2005-73352.10.1115/IPACK2005-7335227.
Khatibi
,
G.
,
Lederer
,
M.
,
Byrne
,
E.
,
Kotas
,
A.
,
Weiss
,
B.
, and
Ipser
,
H.
, 2013
, “
Characterization of Stress-Strain Response of Lead-Free Solder Joints Using a Digital Image Correlation Technique and Finite-Element Modeling
,” J. Electron. Mater.
,
42
(2
), pp. 294
–303
.10.1007/s11664-012-2276-228.
Cocke
,
D. L.
,
Schennach
,
R.
,
Hossain
,
M. A.
,
Mencer
,
D. E.
,
McWhinney
,
H.
,
Parga
,
J. R.
,
Kesmez
,
M.
,
Gomes
,
J. A. G.
, and
Mollah
,
M. Y.
, 2005
, “
The Low-Temperature Thermal Oxidation of Copper, Cu3O2, and Its Influence on Past and Future Studies
,” Vaccum
,
79
(1–2
), pp. 71
–83
.10.1016/j.vacuum.2005.01.01029.
Gattinoni
,
C.
, and
Michaelides
,
A.
, 2015
, “
Atomistic Details of Oxide Surfaces and Surface Oxidation: The Example of Copper and Its Oxides
,” Surf. Sci. Rep.
,
70
(3
), pp. 424
–447
.10.1016/j.surfrep.2015.07.00130.
Castrejón-Sánchez
,
Víctor-Hugo
,
A. C.
,
Solís
,
R.
,
López
,
C.
,
Encarnación-Gomez
,
F. M.
,
Morales
,
O. S.
,
Vargas
,
J. E.
,
Mastache-Mastache
., and
G. V.
, Sánchez
, 2019
, “
Thermal Oxidation of Copper Over a Broad Temperature Range: Towards the Formation of Cupric Oxide (CuO)
,” Mater. Res. Express
,
6
(7
), p. 075909
.10.1088/2053-1591/ab166231.
Lenglet
,
M.
,
Kartouni
,
K.
,
Machefert
,
J.
,
Claude
,
J. M.
,
Steinmetz
,
P.
,
Beauprez
,
E.
,
Heinrich
,
J.
, and
Celati
,
N.
, 1995
, “
Low Temperature Oxidation of Copper: The Formation of CuO
,” Mater. Res. Bull.
,
30
(4
), pp. 393
–403
.10.1016/0025-5408(95)00025-932.
Zhou
,
G.
,
Wang
,
L.
, and
Yang
,
J. C.
, 2005
, “
Effects of Surface Topology on the Formation of Oxide Islands on Cu Surfaces
,” J. Appl. Phys.
,
97
(6
), p. 063509
.10.1063/1.186114733.
Feng
,
Z.
,
Marks
,
C. R.
, and
Barkatt
,
A.
, 2003
, “
Oxidation-Rate Excursions During the Oxidation of Copper in Gaseous Environments at Moderate Temperatures
,” Oxid. Metals
,
60
(5/6
), pp. 393
–408
.10.1023/A:102733160541734.
Fujita
,
K.
,
Ando
,
D.
,
Uchikoshi
,
M.
,
Mimura
,
K.
, and
Isshiki
,
M.
, 2013
, “
New Model for Low-Temperature Oxidation of Copper Single Crystal
,” Appl. Surface Sci.
,
276
, pp. 347
–358
.10.1016/j.apsusc.2013.03.09635.
Anand
,
L.
, 1982
, “
Constitutive Equations for the Rate-Dependent Deformation of Metals at Elevated Temperatures
,” ASME J. Eng. Mater. Technol.
,
104
(1
), pp. 12
–17
.10.1115/1.322502836.
Yang
,
F.
, and
Li
,
J. C.
, 2013
, “
Impression Test—A Review
,” Mater. Sci. Eng. R Rep.
,
74
(8
), pp. 233
–253
.10.1016/j.mser.2013.06.00237.
Louchet
,
F.
, and
Duval
,
P.
, 2009
, “
Andrade Creep Revisited
,” Int. J. Mater. Res.
,
100
(10
), pp. 1433
–1439
.10.3139/146.11018938.
Alghoul
,
T.
,
Wentlent
,
L.
,
Sivasubramony
,
R.
,
Greene
,
C.
,
Thompson
,
P.
, and
Borgesen
,
P.
, 2020
, “
Diffusion Creep of Realistic SnAgCu Solder Joints at Times and Stresses of Relevance to Thermal Fatigue
,” IEEE Trans. Compon., Packag. Manuf. Technol.
,
10
(2
), pp. 288
–295
.10.1109/TCPMT.2019.292905139.
Zheng
,
H.
,
Berry
,
D.
,
Ngo
,
K. D.
, and
Lu
,
G.-Q.
, 2014
, “
Chip-Bonding on Copper by Pressureless Sintering of Nano Silver Paste Under Controlled Atmosphere
,” Packag. Manuf. Technol. IEEE Trans. Compon.
,
4
(3
), p. 37
.10.1109/TCPMT.2013.229688240.
Mohan
,
K.
,
Shahane
,
N.
,
Liu
,
R.
,
Smet
,
V.
, and
Antoniou
,
A.
, 2018
, “
A Review of Nanoporous Metals in Interconnects
,” JOM
,
70
(10
), pp. 2192
–2204
.10.1007/s11837-018-3081-z41.
Schnabl
,
K.
,
Wentlent
,
L.
,
Mootoo
,
K.
,
Khasawneh
,
S.
,
Zinn
,
A. A.
,
Beddow
,
J.
,
Hauptfleisch
,
E.
,
Blass
,
D.
, and
Borgesen
,
P.
, 2014
, “
Nanocopper Based Solder-Free Electronic Assembly
,” J. Electron. Mater.
,
43
(12
), pp. 4515
–4521
.10.1007/s11664-014-3478-642.
Borgesen
,
P.
,
Wentlent
,
L.
,
Alghoul
,
T.
,
Sivasubramony
,
R.
,
Yadav
,
M.
,
Thekkut
,
S.
,
Cuevas
,
J.
, and
Greene
,
C.
, 2019
, “
A Mechanistic Model of Damage Evolution in Lead Free Solder Joints Under Combinations of Vibration and Thermal Cycling With Varying Amplitudes
,” Microelectron. Reliab.
,
95
, pp. 65
–73
.10.1016/j.microrel.2019.02.001Copyright © 2023 by ASME
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