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Issues
December 1994
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Editorial
Notes on the First International Symposium on Microelectronic Package and PCB Technology, Beijing P. R. China
J. Electron. Packag. December 1994, 116(4): 241.
doi: https://doi.org/10.1115/1.2905693
Topics:
China
Research Papers
Effects of Ceramic Ball-Grid-Array Package’s Manufacturing Variations on Solder Joint Reliability
J. Electron. Packag. December 1994, 116(4): 242–248.
doi: https://doi.org/10.1115/1.2905694
Residual Stresses for In-Situ Deposition of Thin-Film High-Temperature Superconductors
J. Electron. Packag. December 1994, 116(4): 249–257.
doi: https://doi.org/10.1115/1.2905695
Translation of Stress States Into Reliability Terms for Single Chip Ceramic Packages
J. Electron. Packag. December 1994, 116(4): 258–264.
doi: https://doi.org/10.1115/1.2905696
Topics:
Ceramics
,
Reliability
,
Stress
,
Failure
,
Probability
A Finite Element Study of Factors Affecting Fatigue Life of Solder Joints
J. Electron. Packag. December 1994, 116(4): 265–273.
doi: https://doi.org/10.1115/1.2905697
Topics:
Fatigue life
,
Finite element analysis
,
Solder joints
,
Cycles
,
Alloys
,
Constitutive equations
,
Creep
,
Design
,
Grain size
,
Manufacturing
Methodology for Automated Design of Microelectronic Packages
J. Electron. Packag. December 1994, 116(4): 274–281.
doi: https://doi.org/10.1115/1.2905698
A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem
J. Electron. Packag. December 1994, 116(4): 282–289.
doi: https://doi.org/10.1115/1.2905699
Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 1—Design Criteria and Heat Diffusion Constraints
J. Electron. Packag. December 1994, 116(4): 290–297.
doi: https://doi.org/10.1115/1.2905700
Topics:
Computer cooling
,
Design
,
Heat sinks
,
Microchannels
,
Thermal diffusion
,
Flow (Dynamics)
,
Heat flux
,
Boiling
,
Cooling
,
Critical heat flux
Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2—Flow Rate and Pressure Drop Constraints
J. Electron. Packag. December 1994, 116(4): 298–305.
doi: https://doi.org/10.1115/1.2905701
Topics:
Computer cooling
,
Flow (Dynamics)
,
Heat sinks
,
Microchannels
,
Pressure drop
,
Geometry
,
Compressibility
,
Energy dissipation
,
Heat
,
Boiling
Effect of Pin Fin Density of the Thermal Performance of Unshrouded Pin Fin Heat Sinks
J. Electron. Packag. December 1994, 116(4): 306–309.
doi: https://doi.org/10.1115/1.2905702
Topics:
Density
,
Heat sinks
,
Thermal resistance
,
Fins
,
Forced convection
,
Air flow
,
Cooling
,
Flow (Dynamics)
,
Heat transfer coefficients
,
Pins (Engineering)
Decoupling Convective and Conductive Heat Transfer Using the Adiabatic Heat Transfer Coefficient
J. Electron. Packag. December 1994, 116(4): 310–316.
doi: https://doi.org/10.1115/1.2905703
Topics:
Heat transfer
,
Heat transfer coefficients
,
Convection
,
Heat conduction
,
Temperature
,
Radiation (Physics)
,
Computation
,
Computer cooling
,
Ducts
,
Errors
Some Effects of Water Immersion on the Mechanical Behavior of a Polyimide Film
J. Electron. Packag. December 1994, 116(4): 317–319.
doi: https://doi.org/10.1115/1.2905704
Topics:
Mechanical behavior
,
Water
,
Creep
,
Polymers
,
Stiffness
,
Stress
,
Temperature
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