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Issues
March 1995
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Technical Papers
Fatigue of Microlithographically-Patterned Free-Standing Aluminum Thin Film Under Axial Stresses
J. Electron. Packag. March 1995, 117(1): 1–6.
doi: https://doi.org/10.1115/1.2792062
Topics:
Aluminum
,
Fatigue
,
Stress
,
Thin films
,
Cycles
,
Fatigue life
,
Fracture (Materials)
,
Titanium
,
Tensile strength
A Global Sensitivity Approach for the Dynamic Response of Printed Wiring Boards
J. Electron. Packag. March 1995, 117(1): 7–13.
doi: https://doi.org/10.1115/1.2792071
Topics:
Dynamic response
,
Printed circuit boards
,
Design
Wirebond Deformation During Molding of IC Packages
J. Electron. Packag. March 1995, 117(1): 14–19.
doi: https://doi.org/10.1115/1.2792061
Topics:
Deformation
,
Molding
,
Flow (Dynamics)
,
Deflection
,
Transfer molding
,
Wire
,
Cavities
,
Circuits
,
Creeping flow
,
Dimensions
Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Devices
J. Electron. Packag. March 1995, 117(1): 20–25.
doi: https://doi.org/10.1115/1.2792063
Contact Analysis of Regular Patterned Rough Surfaces in Magnetic Recording
J. Electron. Packag. March 1995, 117(1): 26–33.
doi: https://doi.org/10.1115/1.2792064
Topics:
Magnetic recording
,
Surface roughness
,
Design
,
Disks
,
Stress
,
Magnetic heads
,
Shapes
,
Thin films
On the Natural Convection in a Cavity With a Cooled Top Wall and Multiple Protruding Heaters
J. Electron. Packag. March 1995, 117(1): 34–45.
doi: https://doi.org/10.1115/1.2792065
Topics:
Cavities
,
Natural convection
,
Flow (Dynamics)
,
Rayleigh number
,
Cooling
,
Electronic equipment
,
Heat sinks
,
Secondary cells
,
Temperature
Numerical Study of Forced Convection in a Partially Porous Channel With Discrete Heat Sources
J. Electron. Packag. March 1995, 117(1): 46–51.
doi: https://doi.org/10.1115/1.2792066
Topics:
Forced convection
,
Heat
,
Heat transfer
,
Pressure drop
,
Porous materials
,
Flow (Dynamics)
,
Fluids
Laminar Heat Transfer Between a Series of Parallel Plates With Surface-Mounted Discrete Heat Sources
J. Electron. Packag. March 1995, 117(1): 52–62.
doi: https://doi.org/10.1115/1.2792067
Topics:
Heat
,
Heat transfer
,
Plates (structures)
,
Thermal resistance
,
Friction
,
Air flow
,
Cooling
,
Electrical conductivity
,
Electronic equipment
,
Flow (Dynamics)
An Approximate Method for Predicting Laminar Heat Transfer Between Parallel Plates Having Embedded Heat Sources
J. Electron. Packag. March 1995, 117(1): 63–68.
doi: https://doi.org/10.1115/1.2792068
Topics:
Heat
,
Heat transfer
,
Plates (structures)
,
Flow (Dynamics)
,
Temperature
,
Boundary-value problems
,
Computer cooling
,
Forced convection
,
Simulation
Forced Convective Cooling Enhancement Through a Double Layer Design
J. Electron. Packag. March 1995, 117(1): 69–74.
doi: https://doi.org/10.1115/1.2792069
Topics:
Cooling
,
Design
,
Flow (Dynamics)
,
Computer simulation
,
Fluid dynamics
,
Heat
,
Heat transfer
,
Pressure
,
Printed circuit boards
,
Temperature
Steady-State Investigation of Vapor Deposited Micro Heat Pipe Arrays
J. Electron. Packag. March 1995, 117(1): 75–81.
doi: https://doi.org/10.1115/1.2792070
Transient Response Characteristics of Vapor Deposited Micro Heat Pipe Arrays
J. Electron. Packag. March 1995, 117(1): 82–87.
doi: https://doi.org/10.1115/1.2792072
Technical Brief
How Compliant Should a Die-Attachment be to Protect the Chip From Substrate Bowing?
J. Electron. Packag. March 1995, 117(1): 88–92.
doi: https://doi.org/10.1115/1.2792073
Topics:
Adhesives
,
Bending (Stress)
,
Diluents
,
Elastic constants
,
Epoxy adhesives
,
Manufacturing
,
Mechanical behavior
,
Rails
,
Silicones
,
Stiffness
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