Topics: Boundary-value problems , Geometry , Heat , Heat conduction , Heat flux , Heat sinks , Integrated circuits , Temperature , Thermal conductivity , Thermal management

An Experimental Investigation of a High Flux Heat Pipe Heat Sink

H. B. Ma, K. P. Lofgreen, G. P. Peterson

J. Electron. Packag. March 2006, 128(1): 18–22. doi: https://doi.org/10.1115/1.2159004

Abstract

View articletitled, An Experimental Investigation of a High Flux Heat Pipe Heat Sink

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Topics: Air flow , Condensers (steam plant) , Design , Heat , Heat pipes , Heat sinks , Heat transfer , Temperature , Particulate matter , Evaporation

Thermal Joint Resistance of Polymer-Metal Rough Interfaces

M. Bahrami, M. M. Yovanovich, E. E. Marotta

J. Electron. Packag. March 2006, 128(1): 23–29. doi: https://doi.org/10.1115/1.2159005

Abstract

View articletitled, Thermal Joint Resistance of Polymer-Metal Rough Interfaces

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Topics: Deformation , Metals , Polymers , Surface roughness , Thermal resistance , Temperature , Microhardness

Implementation of Microchannel Evaporator for High-Heat-Flux Refrigeration Cooling Applications

Jaeseon Lee, Issam Mudawar

J. Electron. Packag. March 2006, 128(1): 30–37. doi: https://doi.org/10.1115/1.2159006

Abstract

View articletitled, Implementation of Microchannel Evaporator for High-Heat-Flux Refrigeration Cooling Applications

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Topics: Compressors , Cooling , Heat , Heat sinks , Microchannels , Pressure drop , Refrigeration , Temperature , Compression , Heat transfer coefficients

Numerical Analysis of Blockage and Optimization of Heat Transfer Performance of Fractal-like Microchannel Nets

Xiang-Qi Wang, Arun S. Mujumdar, Christopher Yap

J. Electron. Packag. March 2006, 128(1): 38–45. doi: https://doi.org/10.1115/1.2159007

Abstract

View articletitled, Numerical Analysis of Blockage and Optimization of Heat Transfer Performance of Fractal-like Microchannel Nets

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Topics: Flow (Dynamics) , Fractals , Heat transfer , Microchannels , Heat sinks , Temperature , Disks , Optimization , Fluid dynamics , Temperature distribution

Design of Thermal Interface Material With High Thermal Conductivity and Measurement Apparatus

Jong-Jin Park, Minoru Taya

J. Electron. Packag. March 2006, 128(1): 46–52. doi: https://doi.org/10.1115/1.2159008

Abstract

View articletitled, Design of Thermal Interface Material With High Thermal Conductivity and Measurement Apparatus

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Topics: Network models , Resistors , Thermal conductivity , Thermometers , Temperature , Carbon nanotubes , Thermal resistance , Design

A Model for Flow Bypass and Tip Leakage in Pin Fin Heat Sinks

M. Baris Dogruoz, Alfonso Ortega, Russell V. Westphal

J. Electron. Packag. March 2006, 128(1): 53–60. doi: https://doi.org/10.1115/1.2159009

Abstract

View articletitled, A Model for Flow Bypass and Tip Leakage in Pin Fin Heat Sinks

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Topics: Flow (Dynamics) , Heat sinks , Leakage , Heat transfer , Pressure drop

A Practical Viscoplastic Damage Model for Lead-Free Solder

A. F. Fossum, P. T. Vianco, M. K. Neilsen, D. M. Pierce

J. Electron. Packag. March 2006, 128(1): 71–81. doi: https://doi.org/10.1115/1.2160514

Abstract

View articletitled, A Practical Viscoplastic Damage Model for Lead-Free Solder

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Topics: Creep , Damage , Shear (Mechanics) , Stress , Temperature , Solders , Lead-free solders

Cooling Performance of Using a Confined Slot Jet Impinging onto Heated Heat Sinks

Ta-Wei Lin, Ming-Chang Wu, Li-Kang Liu, Chun-Jen Fang, Ying-Huei Hung

J. Electron. Packag. March 2006, 128(1): 82–91. doi: https://doi.org/10.1115/1.2161426

Abstract

View articletitled, Cooling Performance of Using a Confined Slot Jet Impinging onto Heated Heat Sinks

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Topics: Cooling , Heat sinks , Heat transfer , Reynolds number , Steady state , Transients (Dynamics) , Nozzles , Composite materials , Temperature distribution