Volume 128 Issue 4 | J. Electron. Packag.

Research Papers

A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages

Sandeep S. Tonapi, Sanjeev B. Sathe, Bahgat G. Sammakia, K. Srihari

J. Electron. Packag. December 2006, 128(4): 305–310. doi: https://doi.org/10.1115/1.2351891

View articletitled, A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages

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Topics: Air flow , Ball-Grid-Array packages , Energy dissipation , Forced convection , Heat , Heat transfer , Numerical analysis , Temperature , Junctions , Temperature distribution

Optimization Study for a Parallel Plate Impingement Heat Sink

Amit Shah, Bahgat G. Sammakia, K. Srihari, K. Ramakrishna

J. Electron. Packag. December 2006, 128(4): 311–318. doi: https://doi.org/10.1115/1.2351893

Abstract

View articletitled, Optimization Study for a Parallel Plate Impingement Heat Sink

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Topics: Design , Heat sinks , Fins , Pressure drop , Optimization

Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material

Zongrong Liu, D. D. L. Chung

J. Electron. Packag. December 2006, 128(4): 319–323. doi: https://doi.org/10.1115/1.2351895

Abstract

View articletitled, Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material

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Topics: Boron , Contact resistance , Paraffin wax , Particulate matter , Pressure , Temperature , Thermal conductivity , Electrical conductance , Copper

Predicting the Liquid Formation for the Solder Joints in Flip Chip Technology

Wen-Hwa Chen, Shu-Ru Lin, Kuo-Ning Chiang

J. Electron. Packag. December 2006, 128(4): 331–338. doi: https://doi.org/10.1115/1.2229216

Abstract

View articletitled, Predicting the Liquid Formation for the Solder Joints in Flip Chip Technology

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Topics: Flip-chip devices , Solder joints , Solders , Surface tension , Shapes , Flip-chip

Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board

Sony Mathew, Diganta Das, Michael Osterman, Michael Pecht, Robin Ferebee

J. Electron. Packag. December 2006, 128(4): 339–345. doi: https://doi.org/10.1115/1.2351897

Abstract

View articletitled, Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board

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Topics: Aluminum , Damage , Life testing , Shock (Mechanics) , Stress , Vibration , Testing , Printed circuit boards , Cycles , Failure

The Exergy Cost of Information Processing: A Comparison of Computer-Based Technologies and Biological Systems

V. P. Carey, A. J. Shah

J. Electron. Packag. December 2006, 128(4): 346–352. doi: https://doi.org/10.1115/1.2351899

Abstract

View articletitled, The Exergy Cost of Information Processing: A Comparison of Computer-Based Technologies and Biological Systems

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Topics: Brain , Computers , Exergy , Energy efficiency

Optimization of Synthetic Jet Fluidic Structures in Printed Wiring Boards

Yong Wang, Guang Yuan, Yong-Kyu Yoon, Mark G. Allen, Sue Ann Bidstrup

J. Electron. Packag. December 2006, 128(4): 353–359. doi: https://doi.org/10.1115/1.2351900

Abstract

View articletitled, Optimization of Synthetic Jet Fluidic Structures in Printed Wiring Boards

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Topics: Cooling , Dimensions , Heat transfer , Jets , Printed circuit boards , Diaphragms (Mechanical devices) , Diaphragms (Structural) , Thermal management , Flow (Dynamics) , Fluid mechanics

An Exergy-Based Figure-of-Merit for Electronic Packages

Amip J. Shah, Van P. Carey, Cullen E. Bash, Chandrakant D. Patel

J. Electron. Packag. December 2006, 128(4): 360–369. doi: https://doi.org/10.1115/1.2351901

Abstract

View articletitled, An Exergy-Based Figure-of-Merit for Electronic Packages

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Topics: Exergy , Energy dissipation , Junctions , Cooling , Heat sinks , Temperature

Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders

Ta-Wei Lin, Ming-Chang Wu, Cheng-Hsien Peng, Po-Li Chen, Ying-Huei Hung

J. Electron. Packag. December 2006, 128(4): 370–379. doi: https://doi.org/10.1115/1.2351902

Abstract

View articletitled, Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders

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Topics: Flat heat pipes , Silicon , Surface roughness , Thermal resistance , Natural convection , Heat transfer , Heat

Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature

Siddharth Bhopte, Dereje Agonafer, Roger Schmidt, Bahgat Sammakia

J. Electron. Packag. December 2006, 128(4): 380–387. doi: https://doi.org/10.1115/1.2356866

Abstract

View articletitled, Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature

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Topics: Ceilings , Data centers , Optimization , Temperature , Design

Cooling of Power Electronics by Embedded Solids

J. Dirker, J. D. van Wyk, J. P. Meyer

J. Electron. Packag. December 2006, 128(4): 388–397. doi: https://doi.org/10.1115/1.2351903

Abstract

View articletitled, Cooling of Power Electronics by Embedded Solids

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Topics: Cooling , Temperature , Aluminum

Effects of Dissolved Air on Subcooled Flow Boiling of a Dielectric Coolant in a Microchannel Heat Sink

Tailian Chen, Suresh V. Garimella

J. Electron. Packag. December 2006, 128(4): 398–404. doi: https://doi.org/10.1115/1.2351905

Abstract

View articletitled, Effects of Dissolved Air on Subcooled Flow Boiling of a Dielectric Coolant in a Microchannel Heat Sink

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Topics: Boiling , Bubbles , Flow (Dynamics) , Heat sinks , Heat transfer , Microchannels , Pressure drop , Temperature , Wall temperature , Flow instability

Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials

Saketh Mahalingam, Kunal Goray, Sandeep Tonapi, Suresh K. Sitaraman

J. Electron. Packag. December 2006, 128(4): 405–411. doi: https://doi.org/10.1115/1.2386242

Abstract

View articletitled, Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials

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Topics: Delamination , Fatigue , Fatigue testing , Fracture (Materials) , Stress , Thermomechanics , Temperature , Experimental characterization , Fracture (Process) , Fracture toughness

Experimental Investigation of Heat Transfer in Impingement Air Cooled Plate Fin Heat Sinks

Zhipeng Duan, Y. S. Muzychka

J. Electron. Packag. December 2006, 128(4): 412–418. doi: https://doi.org/10.1115/1.2351906

Abstract

View articletitled, Experimental Investigation of Heat Transfer in Impingement Air Cooled Plate Fin Heat Sinks

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Topics: Flow (Dynamics) , Heat sinks , Heat transfer , Thermal resistance

Test Methods for Silicon Die Strength

M. Y. Tsai, C. H. Chen, C. S. Lin

J. Electron. Packag. December 2006, 128(4): 419–426. doi: https://doi.org/10.1115/1.2351907

Abstract

View articletitled, Test Methods for Silicon Die Strength

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Topics: Silicon , Stress , Semiconductor wafers , Failure , Surface roughness , Deflection , Finite element analysis

A Graphite Foams Based Vapor Chamber for Chip Heat Spreading

Minhua Lu, Larry Mok, R. J. Bezama

J. Electron. Packag. December 2006, 128(4): 427–431. doi: https://doi.org/10.1115/1.2351908

Abstract

View articletitled, A Graphite Foams Based Vapor Chamber for Chip Heat Spreading

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Topics: Fluids , Graphite , Thermal conductivity , Vapors , Thermal resistance , Ethanol , Foams (Chemistry) , Heat flux

Constructal Peripheral Cooling of a Rectangular Heat-Generating Area

Alexandre K. da Silva, Louis Gosselin

J. Electron. Packag. December 2006, 128(4): 432–440. doi: https://doi.org/10.1115/1.2351909

Abstract

View articletitled, Constructal Peripheral Cooling of a Rectangular Heat-Generating Area

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Topics: Cooling , Heat , Flow (Dynamics) , Degrees of freedom

Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies

S. Chaparala, J. M. Pitarresi, S. Parupalli, S. Mandepudi, M. Meilunas

J. Electron. Packag. December 2006, 128(4): 441–448. doi: https://doi.org/10.1115/1.2353280

Abstract

View articletitled, Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies

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Topics: Ball-Grid-Array packaging , Manufacturing , Reliability , Stiffness , Mirrors , Cycles , Solder joints , Solders , Finite element analysis , Capacitors

Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components

Kun-Nan Chen

J. Electron. Packag. December 2006, 128(4): 449–455. doi: https://doi.org/10.1115/1.2353281

Abstract

View articletitled, Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components

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Topics: Computer cooling , Cooling , Design , Finite element analysis , Finite element model , Optimization , Printed circuit boards , Screws , Testing , Materials properties

Graphite Foam Thermal Management of a High Packing Density Array of Power Amplifiers

Z. A. Williams, J. A. Roux

J. Electron. Packag. December 2006, 128(4): 456–465. doi: https://doi.org/10.1115/1.2353282

Abstract

View articletitled, Graphite Foam Thermal Management of a High Packing Density Array of Power Amplifiers

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Topics: Cooling , Flow (Dynamics) , Graphite , Thermal management , Temperature , Copper , Density , Packing (Shipments) , Packings (Cushioning)

Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment

Tunc Icoz, Nitin Verma, Yogesh Jaluria

J. Electron. Packag. December 2006, 128(4): 466–478. doi: https://doi.org/10.1115/1.2353284

Abstract

View articletitled, Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment

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Topics: Cooling , Design , Flow (Dynamics) , Heat , Heat transfer , Optimization , Simulation , Computer simulation , Pressure drop , Cooling systems

Research Papers

The Role of Fin Geometry in Heat Sink Performance

W. A. Khan, J. R. Culham, M. M. Yovanovich

J. Electron. Packag. December 2006, 128(4): 324–330. doi: https://doi.org/10.1115/1.2351896

Abstract

View articletitled, The Role of Fin Geometry in Heat Sink Performance

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Topics: Drag (Fluid dynamics) , Entropy , Geometry , Heat sinks , Heat transfer , Reynolds number , Thermal resistance , Heat transfer coefficients , Viscosity

Technical Briefs

Singulation of Electronic Packages With Abrasive Waterjets

Mohamed Hashish

J. Electron. Packag. December 2006, 128(4): 479–483. doi: https://doi.org/10.1115/1.2353328

Abstract

View articletitled, Singulation of Electronic Packages With Abrasive Waterjets

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Topics: Cutting , Strips , Nozzles , Machinery , Flow (Dynamics)

Thermal Management of Electronics in Telecommunications Products: Designing for the Network Equipment Building System (NEBS) Standards

Jinny Rhee, Sergio I. Hernandez

J. Electron. Packag. December 2006, 128(4): 484–493. doi: https://doi.org/10.1115/1.2353327

Abstract

View articletitled, Thermal Management of Electronics in Telecommunications Products: Designing for the Network Equipment Building System (NEBS) Standards

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Topics: Temperature , Telecommunications , Heating , Reynolds number

Research Papers

A Numerical Analysis of the Thermal Performance of Single Sided and Back-to-Back Tape Ball Grid Array Packages

Optimization Study for a Parallel Plate Impingement Heat Sink

Boron Nitride Particle Filled Paraffin Wax as a Phase-Change Thermal Interface Material

Predicting the Liquid Formation for the Solder Joints in Flip Chip Technology

Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board

The Exergy Cost of Information Processing: A Comparison of Computer-Based Technologies and Biological Systems

Optimization of Synthetic Jet Fluidic Structures in Printed Wiring Boards

An Exergy-Based Figure-of-Merit for Electronic Packages

Thermal Behavior of Nominally Flat Silicon-Based Heat Spreaders

Optimization of Data Center Room Layout to Minimize Rack Inlet Air Temperature

Cooling of Power Electronics by Embedded Solids

Effects of Dissolved Air on Subcooled Flow Boiling of a Dielectric Coolant in a Microchannel Heat Sink

Experimental Characterization of Monotonic and Fatigue Delamination of Novel Underfill Materials

Experimental Investigation of Heat Transfer in Impingement Air Cooled Plate Fin Heat Sinks

Test Methods for Silicon Die Strength

A Graphite Foams Based Vapor Chamber for Chip Heat Spreading

Constructal Peripheral Cooling of a Rectangular Heat-Generating Area

Experimental and Numerical Investigation of the Reliability of Double-Sided Area Array Assemblies

Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components

Graphite Foam Thermal Management of a High Packing Density Array of Power Amplifiers

Design of Air and Liquid Cooling Systems for Electronic Components Using Concurrent Simulation and Experiment

Research Papers

The Role of Fin Geometry in Heat Sink Performance

Technical Briefs

Singulation of Electronic Packages With Abrasive Waterjets

Thermal Management of Electronics in Telecommunications Products: Designing for the Network Equipment Building System (NEBS) Standards

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