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Journal Articles

Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package

Fei Chong Ng, Mohamad Aizat Abas
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041009.
Paper No: EP-21-1137
DOI: https://doi.org/10.1115/1.4052920
Published Online: December 1, 2022
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Topics: Design, Flip-chip packages, Flow (Dynamics), Optimization, Fluids, Computer simulation
Image
Three segregated regions in a W × W unit cell with their designated...

Three segregated regions in a W × W unit cell with their designated...

in Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package > Journal of Electronic Packaging
Published Online: December 1, 2022
Fig. 1 Three segregated regions in a W × W unit cell with their designated regional bounds More
Image
Schematic of a flip-chip package and its design parameters

Schematic of a flip-chip package and its design parameters

in Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package > Journal of Electronic Packaging
Published Online: December 1, 2022
Fig. 2 Schematic of a flip-chip package and its design parameters More
Image
Parameters that associated with the position of flow meniscus in a unit-cel...

Parameters that associated with the position of flow meniscus in a unit-cel...

in Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package > Journal of Electronic Packaging
Published Online: December 1, 2022
Fig. 3 Parameters that associated with the position of flow meniscus in a unit-cell More
Image
Overview of the numerical flip-chip unit-cell model

Overview of the numerical flip-chip unit-cell model

in Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package > Journal of Electronic Packaging
Published Online: December 1, 2022
Fig. 4 Overview of the numerical flip-chip unit-cell model More
Image
Plots of experimental, analytical and numerical filling times against filli...

Plots of experimental, analytical and numerical filling times against filli...

in Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package > Journal of Electronic Packaging
Published Online: December 1, 2022
Fig. 5 Plots of experimental, analytical and numerical filling times against filling distance More
Image
Plots of analytical and numerical filling times against bump pitch

Plots of analytical and numerical filling times against bump pitch

in Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package > Journal of Electronic Packaging
Published Online: December 1, 2022
Fig. 6 Plots of analytical and numerical filling times against bump pitch More
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Qualitative comparison of numerical simulated flow menisci at the different...

Qualitative comparison of numerical simulated flow menisci at the different...

in Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package > Journal of Electronic Packaging
Published Online: December 1, 2022
Fig. 7 Qualitative comparison of numerical simulated flow menisci at the different filling stages More
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Plots of unit-cell filling time, T f * against bump pitch, ...

Plots of unit-cell filling time, T f * against bump pitch, ...

in Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package > Journal of Electronic Packaging
Published Online: December 1, 2022
Fig. 8 Plots of unit-cell filling time, T f * against bump pitch, W * at different contact angles More
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Plots of unit-cell filling time, T f * against gap height, ...

Plots of unit-cell filling time, T f * against gap height, ...

in Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package > Journal of Electronic Packaging
Published Online: December 1, 2022
Fig. 9 Plots of unit-cell filling time, T f * against gap height, h * at different contact angles More
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Plots of critical bump pitch, W cr * at different contact a...

Plots of critical bump pitch, W cr * at different contact a...

in Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package > Journal of Electronic Packaging
Published Online: December 1, 2022
Fig. 10 Plots of critical bump pitch, W cr * at different contact angle, θ and gap height, h * More
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Plots of critical gap height, h cr * at different bump pitc...

Plots of critical gap height, h cr * at different bump pitc...

in Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package > Journal of Electronic Packaging
Published Online: December 1, 2022
Fig. 11 Plots of critical gap height, h cr * at different bump pitch, W * and contact angle, θ More
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Concept flow for the design optimization of package miniaturization based o...

Concept flow for the design optimization of package miniaturization based o...

in Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package > Journal of Electronic Packaging
Published Online: December 1, 2022
Fig. 12 Concept flow for the design optimization of package miniaturization based on threshold and criticality of underfill parameters—contact angle, gap height, bump pitch More
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Simultaneous determination for the optimum pair of gap height, h * ...

Simultaneous determination for the optimum pair of gap height, h * ...

in Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package > Journal of Electronic Packaging
Published Online: December 1, 2022
Fig. 13 Simultaneous determination for the optimum pair of gap height, h * and bump pitch, W * More
Journal Articles

The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods

Accepted Manuscript
Yuqian Xu, Qiwen Zeng, Yuexing Wang, Mingyong Wu, Xiangyu Chen, Gang Chen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-22-1001
DOI: https://doi.org/10.1115/1.4054821
Published Online: June 16, 2022
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Topics: Algebra, Deformation, Differential equations, Errors, Genetic algorithms, Solders, Stress
Journal Articles

Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks

Accepted Manuscript
Ting-Chuan Huang, Kuo-Chi Liao
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-22-1010
DOI: https://doi.org/10.1115/1.4054822
Published Online: June 16, 2022
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Topics: Shock (Mechanics), Contact resistance, Displacement, Molten salt reactors, Dynamic response, Finite element analysis, Surface roughness
Journal Articles

Viscoelastic Influence On the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Accepted Manuscript
Abel Misrak, Rabin Bhandari, Dereje Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-21-1110
DOI: https://doi.org/10.1115/1.4054784
Published Online: June 13, 2022
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Topics: Semiconductor wafers, Reliability, Viscoelasticity, Electronic packages, Glass transition, Manufacturing, Printed circuit boards, Creep, Design, Elastic moduli
Journal Articles

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for GaN HEMTs

Accepted Manuscript
Han-ling Li, Yang Shen, Yu-Chao Hua, S.L. Sobolev, Bing-Yang Cao
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-22-1007
DOI: https://doi.org/10.1115/1.4054698
Published Online: June 1, 2022
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Topics: Diffusion (Physics), Gallium nitride, Heating, Modeling, Phonons, Temperature, Heat, Simulation, Heat conduction, Electromagnetic scattering
Journal Articles

Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat

Accepted Manuscript
Michael Deckard, Darin Sharar, Michael Fish, Patrick J. Shamberger
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-21-1153
DOI: https://doi.org/10.1115/1.4054651
Published Online: May 25, 2022
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Topics: Heat, Phase change materials, Slabs, Heat sinks, Transients (Dynamics), Steady state, Thermal resistance, Tradeoffs, Boundary-value problems, Cooling
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( a ) Commercial cold plate, ( b ) Keyence laser scanning microscope, ( c )...

( a ) Commercial cold plate, ( b ) Keyence laser scanning microscope, ( c )...

in Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink > Journal of Electronic Packaging
Published Online: May 19, 2022
Fig. 1 ( a ) Commercial cold plate, ( b ) Keyence laser scanning microscope, ( c ) microscopic picture of the square pin fins, and ( d ) 3D and profile graph for the fin height More