1-15 of 15
Carbon nanotubes
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology

Jerzy Szałapak, Konrad Kiełbasiński, Łucja Dybowska-Sarapuk, Jakub Krzeminski, Marian Teodorczyk, Tomasz Kowaluk, Małgorzata Jakubowska
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2021, 143(3): 034501.
Paper No: EP-20-1091
https://doi.org/10.1115/1.4049240
Published Online: January 19, 2021
View Article titled, Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology
Open the PDF for Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology in another window
Topics: Carbon, Carbon nanotubes, Electrical resistivity, Graphene, Nanoparticles, Silver, Thermal conductivity, Temperature, Joining, High temperature
Journal Articles

Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials

Andrew J. McNamara, Yogendra Joshi, Zhuomin Zhang, Kyoung-sik Moon, Ziyin Lin, Yagang Yao, Ching-Ping Wong, Wei Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031014.
Paper No: EP-14-1043
https://doi.org/10.1115/1.4030802
Published Online: September 1, 2015
View Article titled, Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials
Open the PDF for Double-Sided Transferred Carbon Nanotube Arrays for Improved Thermal Interface Materials in another window
Topics: Carbon nanotubes, Steady state, Temperature, Thermal resistance, Solders, Thermal conductivity
Journal Articles

Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density

Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041011.
Paper No: EP-13-1125
https://doi.org/10.1115/1.4026878
Published Online: September 19, 2014
View Article titled, Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density
Open the PDF for Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density in another window
Topics: Carbon nanotubes, Current density, Damage, Multi-walled carbon nanotubes, Oxidation, Density, Electrodes, Atoms, Carbon, Evaporation
Journal Articles

Preparation of Water-Based Carbon Nanotube Inks and Application in the Inkjet Printing of Carbon Nanotube Gas Sensors

Ziyin Lin, Taoran Le, Xiaojuan Song, Yagang Yao, Zhuo Li, Kyoung-sik Moon, Manos M. Tentzeris, Ching-ping Wong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2013, 135(1): 011001.
Paper No: EP-11-1098
https://doi.org/10.1115/1.4023758
Published Online: March 26, 2013
View Article titled, Preparation of Water-Based Carbon Nanotube Inks and Application in the Inkjet Printing of Carbon Nanotube Gas Sensors
Open the PDF for Preparation of Water-Based Carbon Nanotube Inks and Application in the Inkjet Printing of Carbon Nanotube Gas Sensors in another window
Topics: Carbon nanotubes, Inks, Printing, Sensors, Water
Journal Articles

Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique

Joseph R. Wasniewski, David H. Altman, Stephen L. Hodson, Timothy S. Fisher, Anuradha Bulusu, Samuel Graham, Baratunde A. Cola
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020901.
https://doi.org/10.1115/1.4005909
Published Online: June 11, 2012
View Article titled, Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique
Open the PDF for Characterization of Metallically Bonded Carbon Nanotube-Based Thermal Interface Materials Using a High Accuracy 1D Steady-State Technique in another window
Topics: Bonding, Carbon nanotubes, Diffusion bonding (Metals), Steady state, Test facilities, Testing, Pressure, Thermal resistance, Nanotubes, Solders
Journal Articles

Introduction for JEP Special Issue on Carbon Nanotubes

Tarek Ragab, Dr., Cemal Basaran, Dr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2011, 133(2): 020301.
https://doi.org/10.1115/1.4004324
Published Online: July 1, 2011
View Article titled, Introduction for JEP Special Issue on Carbon Nanotubes
Open the PDF for Introduction for JEP Special Issue on Carbon Nanotubes in another window
Topics: Carbon nanotubes, Electronic packaging, Chirality, Electron field emission, Nanoelectronics, Strength (Materials)
Journal Articles

Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations

Feng Gao, Jianmin Qu, Matthew Yao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020908.
https://doi.org/10.1115/1.4004095
Published Online: July 1, 2011
View Article titled, Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations
Open the PDF for Electrical Contact Resistance at the Carbon Nanotube/Pd and Carbon Nanotube/Al Interfaces in End-Contact by First-Principles Calculations in another window
Topics: Carbon nanotubes, Contact resistance, Electrodes, Electron configuration
Journal Articles

Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces

Stephen L. Hodson, Thiruvelu Bhuvana, Baratunde A. Cola, Xianfan Xu, G. U. Kulkarni, Timothy S. Fisher
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020907.
https://doi.org/10.1115/1.4004094
Published Online: June 23, 2011
View Article titled, Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces
Open the PDF for Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces in another window
Topics: Carbon nanotubes, Palladium, Nanoparticles
Journal Articles

A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials

Satish Kumar, Baratunde A. Cola, Roderick Jackson, Samuel Graham
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020906.
https://doi.org/10.1115/1.4004220
Published Online: June 17, 2011
View Article titled, A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials
Open the PDF for A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials in another window
Topics: Carbon nanotubes, Electrodes
Journal Articles

Synthesis of Double Wall Carbon Nanotubes Using Sulfur as Catalyst

O. A. Al-Hartomy, M. A. SHAH
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020904.
https://doi.org/10.1115/1.4003867
Published Online: June 7, 2011
View Article titled, Synthesis of Double Wall Carbon Nanotubes Using Sulfur as Catalyst
Open the PDF for Synthesis of Double Wall Carbon Nanotubes Using Sulfur as Catalyst in another window
Topics: Carbon nanotubes, Catalysts, Chemical vapor deposition, Nanotubes, Sulfur
Journal Articles

Application of Carbon Nanotubes to Thermal Interface Materials

Drazen Fabris, Michael Rosshirt, Christopher Cardenas, Patrick Wilhite, Toshishige Yamada, Cary Y. Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020902.
https://doi.org/10.1115/1.4003864
Published Online: June 7, 2011
View Article titled, Application of Carbon Nanotubes to Thermal Interface Materials
Open the PDF for Application of Carbon Nanotubes to Thermal Interface Materials in another window
Topics: Carbon nanotubes, Thermal conductivity, Thermal resistance, Pressure
Journal Articles

The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations

Tarek Ragab, Cemal Basaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020903.
https://doi.org/10.1115/1.4003866
Published Online: June 7, 2011
View Article titled, The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations
Open the PDF for The Unravelling of Open-Ended Single Walled Carbon Nanotubes Using Molecular Dynamics Simulations in another window
Topics: Atoms, Carbon nanotubes, Chain, Displacement, Failure, Molecular dynamics simulation, Nanotubes, Simulation, Single-walled carbon nanotubes, Stress
Journal Articles

Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites

Xiaobo Sun, Aiping Yu, Palanisamy Ramesh, Elena Bekyarova, Mikhail E. Itkis, Robert C. Haddon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020905.
https://doi.org/10.1115/1.4003988
Published Online: June 7, 2011
View Article titled, Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites
Open the PDF for Oxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites in another window
Topics: Carbon nanotubes, Composite materials, Epoxy adhesives, Epoxy resins, Fillers (Materials), Graphite, Oxidation, Particle size, Polymers, Thermal conductivity
Journal Articles

Design of Thermal Interface Material With High Thermal Conductivity and Measurement Apparatus

Jong-Jin Park, Minoru Taya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 46–52.
https://doi.org/10.1115/1.2159008
Published Online: September 23, 2005
View Article titled, Design of Thermal Interface Material With High Thermal Conductivity and Measurement Apparatus
Open the PDF for Design of Thermal Interface Material With High Thermal Conductivity and Measurement Apparatus in another window
Topics: Network models, Resistors, Thermal conductivity, Thermometers, Temperature, Carbon nanotubes, Thermal resistance, Design
Journal Articles

A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes

Anand Desai, Sanket Mahajan, Ganesh Subbarayan, Wayne Jones, James Geer, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2006, 128(1): 92–97.
https://doi.org/10.1115/1.2161231
Published Online: May 10, 2005
View Article titled, A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes
Open the PDF for A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes in another window
Topics: Carbon nanotubes, Nanotubes, Temperature, Thermal conductivity, Thermal management